Deployable hardened housing units
The present application describes apparatuses, systems, and methods for robust, adaptable, and deployable computing devices and radio systems. In one aspect, the present application describes a chassis for housing electronic componentry. The chassis includes a frame with a top plate and a bottom plate, an interface panel located on the chassis frame; a back panel located on the chassis frame opposite the interface panel, and a protective protrusion located at a corner of the chassis frame extending beyond the top plate and the bottom plate.
1. A chassis for housing electronic componentry, the chassis comprising:
a chassis frame including a top plate and a bottom plate;
an interface panel located on the chassis frame and disposed between the top plate and the bottom plate;
a back panel located on the chassis frame opposite the interface panel, the back panel disposed between the top plate and the bottom plate;
a protective protrusion located at a corner of the chassis frame and extending beyond the top plate and the bottom plate, the protective protrusion configured to protect the interface panel during transportation, installation and operation of the chassis; and
a shock mount configured to secure the chassis frame.
2. The chassis according to claim 1 , further comprising a communication link configured to carry communication signals between the chassis and a device.
3. The chassis according to claim 2 , wherein the communication link is configured to carry electric power between the chassis and the device.
4. The chassis according to claim 1 , wherein the protective protrusion facilitates sliding of the chassis into and out of a mounting rack.
5. The chassis according to claim 4 , wherein a corner of the protective protrusion is faceted.
6. The chassis according to claim 1 , further comprising a heat transfer device configured to dissipate heat from the chassis.
7. The chassis according to claim 1 , wherein the interface panel includes an interface connection configured to communicate with one of a processor control unit and an antenna interface unit.
8. The chassis according to claim 1 , further comprising an internal mount for mounting the electronic componentry within the chassis frame.
9. The chassis according to claim 1 , wherein the chassis is configured to be mounted in one of a vertical position and a horizontal position.
10. A chassis for housing electronic componentry, the chassis comprising:
a chassis frame including a top plate and a bottom plate;
an interface panel located on the chassis frame and disposed between the top plate and the bottom plate;
a back panel located on the chassis frame opposite the interface panel, the back panel disposed between the top plate and the bottom plate;
a protective protrusion located at a corner of the chassis frame and extending beyond the top plate and the bottom plate, the protective protrusion configured to protect the interface panel of the chassis from a physical impact; and
a handle attached at the protective protrusion and extending along a side of the chassis frame to facilitate carrying of the chassis.
11. The chassis according to claim 10 , wherein the protective protrusion is shaped to facilitate sliding the chassis into and out of a mounting rack.
12. The chassis according to claim 10 , wherein a corner of the protective protrusion is faceted.
13. The chassis according to claim 10 , wherein the handle is located outside of the protective protrusion at a distance from the chassis.
14. The chassis according to claim 10 , wherein the handle includes a slot configured to receive a strap to secure the chassis.
15. The chassis according to claim 10 , wherein the interface panel includes an indicator configured to indicate status data.
16. The chassis according to claim 10 , wherein the interface panel includes a first port for connecting to a high band antenna and a second port for connecting to a low band antenna.
17. The chassis according to claim 10 , further including an interface connection to facilitate communication with a computer controller.
18. The chassis according to claim 10 , further comprising a heat pipe in thermal contact with the top plate and/or with the back panel.
19. The chassis according to claim 18 , further comprising a heat sink in thermal communication with the heat pipe.