IP Library Patent Application 17250997
Patent Application
App. No. 17/250,997

LED ARRAYS

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Quick Facts
Patent No.
US None
App. No.
17/250,997
Abstract

A method of producing a light emitting diode (LED) array comprises: forming a semiconductor layer ( 100 ) of group III nitride material; forming a dielectric mask layer ( 104 ) over the semiconductor layer, the dielectric mask layer having an array of holes through it each exposing an area of the semiconductor layer; and growing an LED structure ( 108 ) in each of the holes.

Claims (20)

1 . A method of producing a light emitting diode (LED) array, the method comprising: forming a semiconductor layer of group III nitride material; forming a dielectric mask layer over the semiconductor layer, the dielectric mask layer having an array of holes through it each exposing a respective area of the semiconductor layer; and growing an LED structure in each of the holes.

2 . The method according to claim 1 wherein the growing an LED structure in each of the holes comprises growing an n-type layer, at least one active layer, and a p-type layer in each of the holes.

3 . The method according to claim 2 wherein the dielectric mask layer has a top, and the at least one active layer has an upper surface which is below the top of the dielectric mask layer.

4 . The method according to claim 1 wherein the step of forming the dielectric mask layer comprises growing a layer of dielectric material, and etching the array of holes into the layer of dielectric material.

5 . The method according to claim 1 further comprising etching each of the exposed areas of the semiconductor layer before the growing an LED structure in each of the holes.

6 . The method according to claim 1 wherein the semiconductor layer provides a common contact to all of the LED structures.

7 . The method according to claim 1 wherein the semiconductor layer is doped.

8 . The method according to claim 1 wherein the semiconductor layer comprises a first sub-layer and a second sub-layer with a hetero-interface between the sublayers, wherein the hetero-interface is arranged to form a two dimensional charge carrier gas.

9 . The method according to claim 1 wherein the LED structures are micro-LED structures and the array is a regular array having a pitch of from 10 μm to 500 μm.

10 . The method according to claim 1 wherein the LED structures comprise a plurality of groups, the method further comprising forming a plurality of contact layer areas over the LED structures, wherein each of the contact layer areas makes electrical contact with a respective one of the groups of the LED structures.

11 . A method of producing an LED display comprising: forming a semiconductor layer of group III nitride material; forming a dielectric mask layer over the semiconductor layer, the dielectric mask layer having an array of holes through it each exposing a respective area of the semiconductor layer; and growing an LED structure in each of the holes thereby to form an LED array, and producing the LED display including the LED array.

12 . An LED array comprising a semiconductor layer, a dielectric layer extending over the semiconductor layer and having an array of holes through it, and an LED device formed in each of the holes.

13 . The LED array according to claim 12 wherein each of the LED devices comprises an n-type layer, at least one active layer, and a p-type layer.

14 . The LED array according to claim 12 wherein the dielectric layer has a top and the at least one active layer has an upper surface which is below the top of the dielectric layer.

15 . The LED array according to claim 12 wherein the semiconductor layer provides a common contact to all of the LED devices.

16 . The LED array according to claim 12 wherein the semiconductor layer is doped.

17 . The LED array according to claim 12 wherein the semiconductor layer comprises a first sub-layer and a second sub-layer with a hetero-interface between the sublayers, wherein the hetero-interface is arranged to form a two dimensional charge carrier gas.

18 . The LED array according to claim 12 wherein the LED devices are micro-LED structures and the array is a regular array having a pitch of from 10 μm to 500 μm.

19 . The LED array according to claim 12 wherein the LED devices comprise a plurality of groups and the LED array further comprises a plurality of contact layer areas extending over the LED devices, wherein each of the contact layer areas is in electrical contact with a respective one of the groups of the LED devices.

20 . An LED display comprising the LED array according to claim 12 .

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE ERRONEOULSY FILED APPLICATION NUMBERS 07823814, 17893696, 17887215, 77895449, 17821431 AND 63397172 PREVIOUSLY RECORDED AT REEL: 061092 FRAME: 0669. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 26, 2023
From: BAE SYSTEMS PLC
To: SNAP INC.
Reel/Frame 063789/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2023
From: THE UNIVERSITY OF SHEFFIELD
To: SNAP INC.
Reel/Frame 062342/0850 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO REMOVE THE ASSIGNMENT ERRONEOUSLY FILED FOR APPLICATION #S 09727095, 09727132, 09737418, 09792133, 09311804, AND 09369685 PREVIOUSLY RECORDED AT REEL: 061092 FRAME: 0669. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 7, 2022
From: BAE SYSTEMS PLC
To: SNAP INC.
Reel/Frame 062219/0544 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE THE ASSIGNMENT ERRONEOUSLY FILED FOR APPLICATION #S 09999093, 10217152, 17815831, 60062731, AND 17823810 PREVIOUSLY RECORDED AT REEL: 061092 FRAME: 0669. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 7, 2022
From: BAE SYSTEMS PLC
To: SNAP INC.
Reel/Frame 062219/0586 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE ASSIGNMENT ERRONEOUSLY FILED FOR 17788985, 17939256, 17597699, 17939296, 17597698 AND 17250997. PREVIOUSLY RECORDED AT REEL: 061092 FRAME: 0669. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 7, 2022
From: BAE SYSTEMS PLC
To: SNAP INC.
Reel/Frame 062112/0237 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2022
From: BAE SYSTEMS PLC
To: SNAP INC.
Reel/Frame 061092/0669 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2021
From: WANG, TAO
To: THE UNIVERSITY OF SHEFFIELD
Reel/Frame 056168/0498 →