Semiconductor laser
The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.
1. A semiconductor laser comprising:
a carrier,
an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area,
an optical element which covers the facet,
a connecting material which is arranged between the optical element and the facet,
a molded body which covers the laser diode and the optical element at least in places, wherein
the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and
the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation,
the optical element has a radiation exit side, and
a photocatalytically acting layer is applied on the radiation exit side of the optical element to support decomposition reactions on the radiation exit side.
2. The semiconductor laser according to claim 1 , in which the molded body completely covers the laser diode on at least one side.
3. The semiconductor laser according to claim 1 , in which the main radiation direction of the laser diode is transverse or perpendicular to the main radiation direction of the semiconductor laser.
4. The semiconductor laser according to claim 1 , in which the carrier is surrounded at least in places by the molded body in lateral directions, the lateral directions being parallel to the main extension plane of the carrier.
5. The semiconductor laser according to claim 1 , in which the molded body is formed by means of a casting and/or injection molding process.
6. The semiconductor laser according to claim 1 , which has a radiation exit surface that is free of the molded body.
7. The semiconductor laser according to claim 1 , in which the optical element completely covers the facet.
8. The semiconductor laser according to claim 1 , in which an anti-reflective layer is applied on the optical element on the side facing the radiation exit area.
9. The semiconductor laser according to claim 1 , in which a further anti-reflective layer is applied on the radiation exit side of the optical element.
10. The semiconductor laser according to claim 1 , in which the optical element is designed to shape the laser radiation entering the optical element during operation.
11. The semiconductor laser according to claim 1 , which comprises two further edge-emitting laser diodes, each of which is arranged on a carrier.
12. The semiconductor laser according to claim 11 , which comprises a beam combiner.
13. The semiconductor laser according to claim 1 , in which the optical element is followed by a conversion element which is designed to convert the wavelength of the radiation emitted by the laser diode during operation.