Power semiconductor apparatus
A power semiconductor apparatus includes a power semiconductor element having low and high potential side electrodes and a sense electrode, high and low potential side conductors electrically connected with the high potential side electrodes, respectively, a sense wiring electrically connected with the sense electrode, and a first metal portion facing the low potential side conductor or the low potential side conductor across the sense wiring. When viewed from an array direction of the sense wiring and the first metal portion, the sense wiring has a facing portion facing the high or low potential side conductor, the first metal portion forms a recess in a part overlapping the facing portion, and a depth of the recess is formed such that a distance between a bottom of the recess and the sense wiring is larger than a distance between the sense wiring and the high or low potential side conductor.
1. A power semiconductor apparatus, comprising:
a power semiconductor element having a low potential side electrode, a high potential side electrode, and a sense electrode;
a high potential side conductor electrically connected with the high potential side electrode;
a low potential side conductor electrically connected with the low potential side electrode;
a sense wiring electrically connected with the sense electrode; and
a first metal portion facing the low potential side conductor or the low potential side conductor across the sense wiring,
wherein when viewed from a front view of the sense wiring and the first metal portion,
the sense wiring has a facing portion facing the high potential side conductor or the low potential side conductor,
the first metal portion forms a first recess in a part overlapping the facing portion, and
a depth of the first recess is formed such that a distance between a bottom of the fir recess and the sense wiring is larger than a distance between the sense wiring and the high potential side conductor or the low potential side conductor.
2. The power semiconductor apparatus according to claim 1 ,
wherein a width of the first recess is formed so as to be greater than a width of the sense wiring.
3. The power semiconductor apparatus according to claim 1 , comprising:
a second metal portion facing the first metal portion across the sense wiring and the low potential side electrode.
4. The power semiconductor apparatus according to claim 3 ,
wherein the second metal portion forms a second recess in a part of the sense wiring that overlaps the facing portion, and
a depth of the second recess is formed such that a distance between a bottom surface of the second recess and the sense wiring is greater than a distance between the sense wiring and the low potential side conductor.
5. The power semiconductor apparatus according to claim 4 ,
wherein a width of the second recess is formed so as to be greater than a width of the sense wiring.
6. The power semiconductor apparatus according to claim 1 ,
wherein the sense wiring includes a negative electrode sense wiring, and
comprises a positive electrode sense wiring different from the negative electrode sense wiring, and
when viewed from the front view of the sense wiring and the first metal portion,
the negative electrode sense wiring is provided so as to overlap the first recess or a second recess, and
the positive electrode sense wiring is provided so as not to overlap the first recess or the second recess.