Laser component comprising a laser chip

1. A laser component comprising:

a laser chip;

the laser chip being arranged between a first component and a second component;

the first component and the second component each being thermally and electrically conductive;

the laser chip having a first side face, the laser chip having a second side face opposite to the first side face;

wherein the first side face of the laser chip is connected in an extensive manner to a first side face of the first component;

wherein the second side face of the laser chip is connected in an extensive manner to a first side face of the second component;

wherein the laser chip has an emission side;

the laser chip being embodied to emit electromagnetic radiation via the emission side;

the emission side being arranged between the first component and the second component;

the emission side being arranged inwardly set-back at a predetermined distance with regard to first front faces of the first component and the second component;

wherein an emission space is formed between the first side face of the first component and the first side face of the second component and adjacent to the emission side of the laser chip;

the emission space extending from the emission side of the laser chip to the first front faces of the first component and the second component;

wherein the first component and the second component are fixed on a carrier by side faces or by second front faces, and

wherein the carrier comprises an electrical conduction layer, wherein an electrical insulation layer is applied to a part of the electrical conduction layer, wherein a further electrical conduction layer is applied to the electrical insulation layer, and wherein the first component is fixed on the electrical conduction layer and electrically connected to the electrical conduction layer, and wherein the second component is fixed on the further electrical conduction layer and electrically connected to the further electrical conductive layer.

2. The laser component according to claim 1 , wherein a conversion element is arranged in front of the emission side of the laser chip, wherein the conversion element is thermally coupled to the first component and the second component in an extensive manner, and wherein the conversion element is at least partially or completely, arranged in the emission space.

3. The laser component according to claim 1 , wherein a conversion element is arranged in front of the emission side of the laser chip, wherein the conversion element is at least partially arranged outside of the emission space or completely outside of the emission space, wherein the conversion element is thermally coupled to the first front faces of the first component and the second component.

4. The laser component according to claim 1 , wherein the laser chip projects into the emission space with a side face which is closer to an active zone of the laser chip than another side face.

5. The laser component according to claim 1 , an intermediate space being formed between the first side face of the first component and the first side face of the second component laterally adjacent to the laser chip, the intermediate space being at least partially filled with an electrically insulating material, the electrically insulating material adjoining the first side of the first component and the first side face of the second component.

6. The laser component according to claim 1 , wherein the emission space is at least partially filled with an insulating material transparent to the electromagnetic radiation of the laser chip.

7. The laser component according to claim 1 , wherein a further thermally and electrically conductive component is provided between the laser chip and one of the first component or the second component, the further thermally and electrically conductive component having a coefficient of thermal expansion which has a smaller difference to the coefficient of thermal expansion of the laser chip than the coefficient of thermal expansion of the first component or the second component connected to the further thermally and electrically conductive component.

8. The laser component according to claim 1 , wherein at least one of the first component or the second component is formed of a lead-frame section.

9. The laser component according to claim 1 , wherein the recesses have been formed in the first side face of the first component and first side face of the second component by an etching process.

10. The laser component according to claim 1 , wherein the first component and the second component have second front faces, wherein the first side face of the first component and the first side face of the second component have a greater distance adjacent to the second front faces than adjacent to the laser chip.

11. The laser component according to claim 10 , wherein an intermediate space widens in a direction of the second front faces of the first component and the second component.

12. The laser component according to claim 1 , wherein the first component and the second component have edges, ridges, or both the edges and the ridges at further side faces, on the first front faces, second front faces, or the further side faces, the first front faces, and the second front faces, wherein covering material covers the edges, ridges, or both the edges and the ridges of surfaces of the first component and the second component at least partially or completely.

13. A method for producing a laser component according to claim 1 , wherein a laser chip is arranged between the first component and the second component;

wherein the first component and the second component comprise a thermally and electrically conductive material; wherein the laser chip has a first side face;

wherein the laser chip has a second side face opposite to the first side face;

wherein the first side face of the laser chip is connected in an extensive manner to a first side face of the first component;

wherein the second side face of the laser chip is connected in an extensive manner to a first side face of the second component;

the laser chip having an emission side;

the laser chip being embodied to emit electromagnetic radiation via the emission side;

the laser chip being arranged between the first component and the second component in such a way that the emission side of the laser chip is arranged between the first component and the second component and is set back inwardly at a predetermined distance with regard to first front faces of the first component and the second component;

wherein an emission space is formed between the first side face of the first component and the first side face of the second component and adjacent to the emission side of the laser chip;

the emission space extending from the emission side of the laser chip to the first front faces of the first component and the second component;

wherein the first component and the second component are fixed on a carrier by side faces, in particular by second front faces, and

wherein the carrier comprises an electrical conduction layer, wherein an electrical insulation layer is applied to a part of the electrical conduction layer, wherein a further electrical conduction layer is applied to the electrical insulation layer, and wherein the first component is fixed on the electrical conduction layer and electrically connected to the electrical conduction layer, and wherein the second component is fixed on the further electrical conduction layer and electrically connected to the further electrical conductive layer.

14. The method according to claim 13 , wherein a conversion element is arranged in front of the emission side of the laser chip, wherein the conversion element is thermally coupled to the first component and the second component in an extensive manner, wherein the conversion element is either arranged at least partially or completely, in the emission space, or wherein the conversion element is arranged completely outside of the emission space.

15. The method according to claim 13 , wherein a first composite with a plurality of first lead-frame sections is provided, wherein a laser chip is positioned on each of the first lead-frame sections, wherein a second composite is provided with second lead-frame sections, wherein the second composite is positioned on the first composite in such a way that a second lead-frame section is positioned on a laser chip in each case, wherein first and second lead-frame sections between which a laser chip is arranged are connected to one another in each case.

16. The method according to claim 13 , wherein the first component, the second component, or both the first component and the second component are manufactured a layer deposition processes, a 3D printing process, a laser sintering process, or a galvanic deposition process.

17. The method according to claim 13 , wherein, before mounting the first component and the second component, recesses are introduced into the first side face of the first component and the first side face of the second component by an etching process,

wherein the first component and the second component are mounted in such a way that the recesses of the first side face of the first component and the first side face of the second component form at least part of the emission space.

18. The laser component according to claim 1 , wherein the first side face of the first component and the first side face of the second component have recesses at least in a region of the emission space; and

wherein the recesses of the first side face of the first component and the first side face of the second component form a part of the emission space.

19. A laser component comprising:

a laser chip, wherein the laser chip being arranged between a first component and a second component,

wherein the first component and the second component being thermally and electrically conductive,

wherein the laser chip having a first side face and a second side face opposite to the first side face,

wherein the first side face of the laser chip is connected in an extensive manner to a first side face of the first component,

wherein the second side face of the laser chip is connected in an extensive manner to a first side face of the second component,

wherein the laser chip has an emission side,

wherein the laser chip being embodied to emit electromagnetic radiation via the emission side,

wherein the emission side being arranged between the first component and the second component,

wherein the emission side being arranged inwardly set-back at a predetermined distance with regard to first front faces of the first component and the second component,

wherein an emission space is formed between the first side face of the first component and the first side face of the second component and adjacent to the emission side of the laser chip,

wherein the emission space extending from the emission side of the laser chip to the first front faces of the first component and the second component, and

wherein a further thermally and electrically conductive component is provided between the laser chip and one of the first component or the second component, the further thermally and electrically conductive component having a coefficient of thermal expansion which has a smaller difference to the coefficient of thermal expansion of the laser chip than the coefficient of thermal expansion of the first component or the second component connected to the further thermally and electrically conductive component.