Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

1. A curable resin composition, containing:

(A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2),

(B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups,

(C) a curing agent, and

(D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene;

wherein in the formula (1), R represents a linear alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or a linear alkyl group having 1 to 12 carbon atoms, as a substituent; and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, at least one Z represents a linking group, and benzoxazine rings are linked by the linking group;

wherein in the formula (2), L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 1 to 10 carbon atoms, and the organic group and the alkylene group optionally comprise oxygen and/or sulfur.

2. The curable resin composition according to claim 1 , wherein the curing accelerator (D) is represented by a structure of formula (9) or (10):

wherein in the formula (9), R represents an alkylene group optionally having a substituent, a carbonyl group, a sulfonyl group or a sulfide bond;

wherein in the formula (10), R represents an alkylene group optionally having a substituent, a carbonyl group, a sulfonyl group or a sulfide bond.

3. The curable resin composition according to claim 2 , further containing (E) an inorganic filler.

4. The curable resin composition according to claim 3 , wherein the curing agent (C) is at least one selected from the group consisting of imidazoles, aromatic amines and multifunctional phenols.

5. A cured product obtained by curing the curable resin composition according to claim 4 .

6. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 4 .

7. A cured product obtained by curing the curable resin composition according to claim 2 .

8. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 2 .

9. The curable resin composition according to claim 1 , further containing (E) an inorganic filler.

10. The curable resin composition according to claim 9 , wherein the curing agent (C) is at least one selected from the group consisting of imidazoles, aromatic amines and multifunctional phenols.

11. A cured product obtained by curing the curable resin composition according to claim 9 .

12. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 9 .

13. The curable resin composition according to claim 1 , wherein the curing agent (C) is at least one selected from the group consisting of imidazoles, aromatic amines and multifunctional phenols.

14. A cured product obtained by curing the curable resin composition according to claim 13 .

15. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 13 .

16. A cured product obtained by curing the curable resin composition according to claim 1 .

17. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 1 .

18. A method of producing a curable resin composition, the method comprising the steps of: mixing

(A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2),

(B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups,

(C) a curing agent, and

(D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene,

to obtain a mixture; and

processing the mixture into a powdery, pelletized, or granular curable resin composition;

wherein in the formula (1), R represents a linear alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or a linear alkyl group having 1 to 12 carbon atoms, as a substituent; and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, at least one Z represents a linking group, and benzoxazine rings are linked by the linking group;

wherein in the formula (2), L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 1 to 10 carbon atoms, and the organic group and the alkylene group optionally comprise oxygen and/or sulfur.

19. The production method according to claim 18 , wherein the step of obtaining a mixture comprises further mixing (E) an inorganic filler to obtain the mixture.

20. A method of producing a cured product, the method comprising a step of heating the curable resin composition produced by the method according to claim 18 , at 180 to 300° C., for curing.

21. The method according to claim 18 , wherein the curing accelerator (D) is represented by a structure of formula (9) or (10):

wherein in the formula (9), R represents an alkylene group optionally having a substituent, a carbonyl group, a sulfonyl group or a sulfide bond;

wherein in the formula (10), R represents an alkylene group optionally having a substituent, a carbonyl group, a sulfonyl group or a sulfide bond.