IP Library Granted Patent US 11,406,043
Granted Patent B2
US 11,406,043 · App. 17/267,578 · Granted Aug 2, 2022

Electronic control device having a heat radiation structure

Inventors: Minami Teranishi (Tokyo, JP); Shinya Kawakita (Tokyo, JP); Hideyuki Sakamoto (Hitachinaka, JP)
Assignee: Hitachi Astemo, Ltd.
H05K7/20409H01L23/3672H05K7/20854
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Quick Facts
Patent No.
US 11,406,043
App. No.
17/267,578
Granted
Aug 2, 2022
Kind
B2
Abstract

Provided is an electronic control device including a first electronic component having a first heat generation amount, a second electronic component having a second heat generation amount smaller than the first heat generation amount, a substrate on which the first and second electronic components are mounted, and a housing that accommodates the first electronic component, the second electronic component and the substrate, and includes a case for heat radiation having a heat radiation structure through which heat of the first and second electronic components is radiated. The heat radiation structure includes a heat radiation block that is heat-bonded to the first electronic component, and a plurality of plate-shaped heat radiation fins extending outward from an outer peripheral portion of the heat radiation block.

Claims (39)

1. An electronic control device comprising:

a first electronic component having a first heat generation amount;

a second electronic component having a second heat generation amount smaller than the first heat generation amount;

a substrate on which the first and second electronic components are mounted; and

a housing that accommodates the first electronic component, the second electronic component and the substrate, and includes a case for heat radiation having a heat radiation structure through which heat of the first and second electronic components is radiated,

wherein the heat radiation structure includes a heat radiation block that is heat-bonded to the first electronic component, and a plurality of plate-shaped heat radiation fins extending outward from an outer peripheral portion of the heat radiation block, and

wherein at least some of the heat radiation fins extend from the outer peripheral portion of the heat radiation block toward the second electronic component, and are connected to a peripheral side portion of the case for heat radiation.

2. The electronic control device according to claim 1 , wherein the first electronic component is bonded to the substrate by a conductive bonding material, and a heat conductive material is interposed between a surface of the first electronic component on a side opposite to the substrate and the heat radiation block.

3. The electronic control device according to claim 1 , wherein

the case for heat radiation has a rectangular shape having a pair of longitudinal direction side portions extending in a longitudinal direction and a pair of lateral direction side portions extending in a lateral direction,

wherein the first electronic component and the second electronic component are disposed apart from each other in the longitudinal direction, and

wherein at least some of the plurality of heat radiation fins extend in parallel in the longitudinal direction.

4. The electronic control device according to claim 3 , wherein the heat radiation block is disposed in a position closer to one side of the lateral direction side portion than a center portion of the case for heat radiation in the longitudinal direction.

5. The electronic control device according to claim 3 , wherein

the heat radiation block has a square or rectangular shape having four sides in a plan view, and

wherein the heat radiation fins are provided in the sides of the heat radiation block.

6. The electronic control device according to claim 3 , wherein

the heat radiation block has a circular or elliptical shape in a plan view, and

wherein at least some of the heat radiation fins are provided radially from the outer peripheral portion of the heat radiation block.

7. An electronic control device comprising:

a first electronic component having a first heat generation amount;

a second electronic component having a second heat generation amount smaller than the first heat generation amount;

a substrate on which the first and second electronic components are mounted; and

a housing that accommodates the first electronic component, the second electronic component and the substrate, and includes a case for heat radiation having a heat radiation structure through which heat of the first and second electronic components is radiated;

wherein the heat radiation structure includes a heat radiation block that is heat-bonded to the first electronic component, and a plurality of plate-shaped heat radiation fins extending outward from an outer peripheral portion of the heat radiation block, and

wherein the case for heat radiation includes a main body portion that holds a plurality of the heat radiation fins and the heat radiation block, the plurality of heat radiation fins have a predetermined height with which the heat radiation fins protrude substantially perpendicular to an opposite side of the first electronic component from the main body portion, and the heat radiation block includes an inner raised portion that protrudes to the first electronic component from the main body portion and an outer raised portion having a predetermined height with which the outer raised portion protrudes to the opposite side of the first electronic component from the main body portion.

8. The electronic control device according to claim 7 , wherein the inner raised portion of the heat radiation block has an area substantially equal to or larger than an area of a heat radiation surface of the first electronic component in a plan view, and the outer raised portion has a height substantially equal to that of the heat radiation fins.

9. An electronic control device comprising:

a first electronic component having a first heat generation amount;

a second electronic component having a second heat generation amount smaller than the first heat generation amount;

a substrate on which the first and second electronic components are mounted;

a housing that accommodates the first electronic component, the second electronic component and the substrate, and includes a case for heat radiation having a heat radiation structure through which heat of the first and second electronic components is radiated; and

at least one third electronic component having a heat generation amount smaller than that of the second electronic component,

wherein the heat radiation structure includes a heat radiation block that is heat-bonded to the first electronic component, and a plurality of plate-shaped heat radiation fins extending outward from an outer peripheral portion of the heat radiation block,

wherein the first electronic component and the third electronic component are disposed in a first region in which an electronic component having a large heat generation amount is disposed, and the second electronic component is disposed in a second region in which an electronic component having a heat generation amount smaller than that in the first region is disposed, and

wherein some of the heat radiation fins extend from the first region toward the second region, and are connected to a peripheral side portion of the case for heat radiation.

10. The electronic control device according to claim 9 , wherein

the housing is provided with a connector for power supply that supplies power to the first electronic component and the second electronic component, and

wherein the connector for power supply is disposed in the second region.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058481/0935 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2021
From: TERANISHI, MINAMI; KAWAKITA, SHINYA; SAKAMOTO, HIDEYUKI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 055218/0479 →
Priority Claims (1)
JP JP2018-176227 · Sep 20, 2018 · national
Continuity (1)
Related Publication 20210321539A1 · Oct 14, 2021
Cited By (1)
US 12,672,266