Electronic control unit
An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.
1. An electronic control unit comprising:
a wiring substrate having a first surface on which a conductor wire is formed;
a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount;
a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and
a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface, wherein
a distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.
2. The electronic control unit according to claim 1 , wherein a distance between an outer surface of the resin immediately above the first electronic component, and the first surface of the wiring substrate is the same as a distance between the outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.
3. The electronic control unit according to claim 1 , wherein a distance between an outer surface of the resin immediately below the second electronic component, and the second surface of the wiring substrate is shorter than a distance between the outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate.
4. The electronic control unit according to claim 1 , wherein a distance between an outer surface of the resin immediately above the first electronic component, and the first surface of the wiring substrate is longer than a distance between the outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.
5. The electronic control unit according to claim 4 , wherein a distance between an outer surface of the resin immediately below the second electronic component, and the second surface of the wiring substrate is shorter than a distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate.
6. The electronic control unit according to claim 1 , wherein the wiring substrate has a via that thermally couples the first surface and the second surface.
7. The electronic control unit according to claim 1 , wherein
the wiring substrate is a multilayer lamination substrate having an inner layer conductor, and
a thickness of the inner layer conductor is greater than the conductor wire formed on the first surface of the wiring substrate.
8. The electronic control unit according to claim 1 , wherein
the first electronic component has a semiconductor element, a heat spreader that is thermally coupled to the semiconductor element, and a sealing member, and
one surface of the heat spreader opposite to the semiconductor element is exposed through the sealing member.
9. The electronic control unit according to claim 8 , further comprising a thermally conductive material that thermally couples the heat spreader, and the conductor wire of the wiring substrate.
10. The electronic control unit according to claim 1 , wherein
the wiring substrate has a via that thermally couples the first surface and the second surface,
the wiring substrate is a multilayer lamination substrate having an inner layer conductor thicker than the conductor wire formed on the first surface of the wiring substrate, and
the electronic control unit further comprises a thermally conductive material that thermally couples the second electronic component and the conductor wire of the wiring substrate.
11. The electronic control unit according to claim 1 , wherein a distance between an outer surface of the resin immediately above the first electronic component, and the first surface of the wiring substrate is shorter than a distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate.