Electronic control unit
An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20 . The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28 . The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20 . A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25 a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole. The sealing material 28 has penetrated into the exposed portion 25 a of the base material.
1. An electronic control unit comprising:
a printed wiring board in which electronic components are provided;
a base material;
a case in which the printed wiring board is accommodated; and
a cover that is provided on the case,
wherein the case and the cover have joint surfaces that face each other and are connected via an adhesive,
each joint surface is provided with a screw that passes through the cover or the case,
a plating layer is provided in a surface of the case or the cover that is provided with a through hole through which the screw penetrates,
the plating layer includes a peeled off portion that forms an exposed portion of the base material, the peeled off portion being formed inside the case or the cover and on an inner side of the case from the through hole, and
a sealing material penetrates into the exposed portion of the base material.
2. The electronic control unit according to claim 1 , wherein
the peeled off portion is formed by providing a processing portion inside the cover.
3. The electronic control unit according to claim 1 , wherein
the exposed portion of the base material formed by partially peeling the plating layer by performing a beading process on an inner side of the case of a contact surface between an inside of the cover and a case pedestal.
4. The electronic control unit according to claim 1 , wherein
the exposed portion of the base material formed by partially peeling the plating layer by performing a process for plating cracks inside the cover.
5. The electronic control unit according to claim 1 , wherein
the exposed portion of the base material formed by partially peeling the plating layer by performing a marking-off process for removing plating on an inner side of the case of a contact surface between an inside of the cover and a case pedestal.
6. The electronic control unit according to claim 1 ,
wherein the exposed portion of the base material formed by partially peeling the plating layer by performing a sanding process for removing plating on an inner side of the case of a contact surface between an inside of the cover and a case pedestal.