IP Library Granted Patent US 11,398,104
Granted Patent B2
US 11,398,104 · App. 17/272,577 · Granted Jul 26, 2022

Optical fingerprint sensor module and method for operating optical fingerprint sensor module

Inventors: Jun Liu (Shanghai, CN); Ehsan Hashemi (Gothenburg, SE); Hans Martinsson (Gothenburg, SE); René Nilsson (Eslöv, SE); Farzan Ghavanini (Gothenburg, SE)
Assignee: FINGERPRINT CARDS ANACATUM IP AB
G06V40/13H03K17/9625G06F21/32
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Quick Facts
Patent No.
US 11,398,104
App. No.
17/272,577
Granted
Jul 26, 2022
Kind
B2
Abstract

There is an optical biometric imaging device configured to capture an image of an object in contact with an outer surface of the biometric imaging device, the biometric imaging device comprising: an image sensor comprising a photodetector pixel array and image sensor circuitry configured to capture an image of the object in contact with the outer surface of the imaging device; the image sensor comprising a first electrically conductive structure arranged adjacent to an active sensing area of the photodetector pixel array; a display panel arranged on top of and at a distance from the image sensor, the display panel comprising a second electrically conductive structure on a bottom side of the display panel and arranged to face the first electrically conductive structure of the image sensor; and capacitive readout circuitry arranged and configured to detect a capacitance between the first electrically conductive structure and the second electrically conductive structure.

Claims (31)

1. An optical biometric imaging device configured to capture an image of an object in contact with an outer surface of the biometric imaging device, the biometric imaging device comprising:

an image sensor comprising a carrier, a photodetector pixel array arranged upon the carrier, and image sensor circuitry configured to capture an image of the object in contact with the outer surface of the imaging device;

the image sensor comprising a first electrically conductive structure integrated into the carrier and arranged adjacent to an active sensing area of the photodetector pixel array;

a display panel arranged on top of and at a distance from the image sensor, the display panel comprising a second electrically conductive structure on a bottom side of the display panel and arranged to face the first electrically conductive structure of the image sensor; and

capacitive readout circuitry arranged and configured to detect a capacitance between the first electrically conductive structure and the second electrically conductive structure.

2. The optical biometric imaging device according to claim 1 , further comprising a frame, wherein a cover glass of the display panel is arranged to rest on the frame and the image sensor is arranged within the frame.

3. The optical biometric imaging device according to claim 1 , further comprising a spacer arranged on the carrier adjacent to the first electrically conductive structure.

4. The optical biometric imaging device according to claim 1 , further comprising a spacer arranged between the carrier and the first electrically conductive structure.

5. The optical biometric imaging device according to claim 1 , comprising a plurality of said first electrically conductive structures.

6. The optical biometric imaging device according to claim 5 , wherein the display panel comprises a plurality of said second electrically conductive structures.

7. The optical biometric imaging device according to claim 2 , wherein the frame comprises a floor portion, thereby forming a U-shaped bracket cross section.

8. The optical biometric imaging device according to claim 7 , and wherein the image sensor is arranged on the floor portion of the bracket.

9. The optical biometric imaging device according to claim 7 , wherein the floor portion comprises a recess, wherein the image sensor is arranged in the recess of the floor portion.

10. The optical biometric imaging device according to claim 7 , wherein the floor portion comprises a through-opening, wherein the image sensor is arranged in the through-opening of the floor portion.

11. The optical biometric imaging device according to claim 7 , wherein the floor portion comprises a through-opening, wherein the image sensor is arranged below the through-opening of the floor portion.

12. A method for detecting a force on a surface of an optical biometric imaging device configured to capture an image of an object in contact with an outer surface of the biometric imaging device, the biometric imaging device comprising:

an image sensor comprising a carrier, a photodetector pixel array arranged upon the carrier, and image sensor circuitry configured to capture an image of an object in contact with an outer surface of the imaging device;

the image sensor comprising a first electrically conductive structure integrated into the carrier and arranged adjacent to an active sensing area of the photodetector pixel array;

a display panel arranged on top of and at a distance from the image sensor;

the display panel comprising a second electrically conductive structure on a bottom side of the display arranged to face the first electrically conductive structure of the image sensor; and

capacitive readout circuitry arranged and configured to detect a capacitance between the first electrically conductive structure and the second electrically conductive structure;

the method comprising detecting a change in capacitance between the first and second electrically conductive structures.

13. The method according to claim 12 , further comprising determining a force on the outer surface of the imaging device based on a known relation between the capacitance and the distance between the first and second electrically conductive structures.

14. A method for detecting a force on a surface of an optical biometric imaging device configured to capture an image of an object in contact with an outer surface of the biometric imaging device, the biometric imaging device comprising:

an image sensor comprising a photodetector pixel array and image sensor circuitry configured to capture an image of an object in contact with an outer surface of the imaging device;

the image sensor comprising a first electrically conductive structure arranged on a top surface of the image sensor and adjacent to an active sensing area of the photodetector pixel array;

a display panel arranged on top of and at a distance from the image sensor;

the display panel comprising a second electrically conductive structure on a bottom side of the display arranged to face the first electrically conductive structure of the image sensor; and

capacitive readout circuitry arranged and configured to detect a capacitance between the first electrically conductive structure and the second electrically conductive structure;

the method comprising detecting a change in capacitance between the first and second electrically conductive structures, and

determining a demagnification factor of the biometric imaging device based on a known relation between the capacitance and the distance between the first and second electrically conductive structures.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2024
From: FINGERPRINT CARDS ANACATUM IP AB
To: FINGERPRINT CARDS IP AB
Reel/Frame 066866/0365 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 10945920 WHICH SHOULD HAVE BEEN ENTERED AS 10845920 PREVIOUSLY RECORDED ON REEL 058218 FRAME 0181. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 15, 2022
From: FINGERPRINT CARDS AB
To: FINGERPRINT CARDS ANACATUM IP AB
Reel/Frame 064053/0400 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2021
From: FINGERPRINT CARDS AB
To: FINGERPRINT CARDS ANACATUM IP AB
Reel/Frame 058218/0181 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2021
From: LIU, JUN; HASHEMI, EHSAN; MARTINSSON, HANS; NILSSON, RENÉ; GHAVANINI, FARZAN
To: FINGERPRINT CARDS AB
Reel/Frame 055931/0071 →
Continuity (1)
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