Method for producing a circuit board arrangement

1. A method for producing a circuit board arrangement, comprising:

providing a first circuit board substrate,

providing a second circuit board substrate, which is arranged substantially planar-parallel to the first circuit board substrate, the first circuit board substrate having an underside and the second circuit board substrate having an upper face, the upper face and the underside being arranged opposite one another,

providing first terminal contacts, which are applied to the underside of the first circuit board substrate,

providing second terminal contacts, which are applied to the upper face of the second circuit board substrate,

applying solder paste cylinders to the first terminal contacts, the solder paste cylinders being applied directly to the first terminal contacts by a solder-paste application process with solder paste, the applied solder paste cylinders having in each case a solder-paste-cylinder upper face,

arranging the second terminal contacts of the second circuit board substrate directly on the solder-paste-cylinder upper faces of the solder paste cylinders, and

when applying the solder paste cylinders by the solder-paste application process, simultaneously applying at least one surface-mountable terminal area made of solder paste for fastening Surface Mount Device (SMD) components to a terminal pad arranged on the underside of the first circuit board substrate.

2. The method for producing a circuit board arrangement as claimed in claim 1 , the method further comprising: melting the solder paste cylinders to form a mechanical and electrically conductive connection between the first terminal contacts of the first circuit board substrate and the second terminal contacts of the second circuit board substrate.

3. The method for producing a circuit board arrangement as claimed in claim 2 , wherein the melting is accomplished by a reflow process or a wave soldering process.

4. The method for producing a circuit board arrangement as claimed in claim 3 , wherein at least one distortion point occurs during melting due to thermal expansion of the first circuit board substrate and/or the second circuit board substrate, so that the solder paste cylinders form a peanut-shaped form and/or a squat columnar form at the at least one distortion point.

5. The method for producing a circuit board arrangement as claimed in claim 2 , wherein at least one distortion point occurs during melting due to thermal expansion of the first circuit board substrate and/or the second circuit board substrate, so that the solder paste cylinders form a peanut-shaped form and/or a squat columnar form at the at least one distortion point.

6. The method for producing a circuit board arrangement as claimed in claim 1 , wherein the solder paste cylinders are applied to the first terminal contacts by a solder-paste printing process.

7. The method for producing a circuit board arrangement as claimed in claim 1 , wherein the solder paste cylinders are formed on the first terminal contacts by at least one first passage channel in a printing stencil and a terminal area is formed by at least one second passage channel in the printing stencil, the printing stencil having a stepped height profile with a first height and at least a second height, so that the first passage channel has the first height and the second passage channel has the second height.

8. The method for producing a circuit board arrangement as claimed in claim 1 , the method further comprising: providing a recess on the second circuit board substrate and arranging at least one SMD component on the underside of the first circuit board substrate, wherein the at least one SMD component protrudes at least partially into the recess.