Stimulation system with monolithic-lead component connected to skull mount package

1. A stimulation system comprising:

one or more stimulating components, wherein each of the one or more stimulating components includes:

one or more electrodes; and

one or more leads, wherein each lead of the one or more leads is connected at a first end of the lead to an electrode of the one or more electrodes and is connected at a second end of the lead to a bonding pad of one or more first bonding pads,

a cylindrical substrate, wherein the cylindrical substrate forms a hollow cylinder, and wherein each of the one or more stimulating components is secured to an outer surface of the cylindrical substrate along a length of the one or more leads; and

a skull-mount package that includes:

electronics that identify stimulation parameters; and

one or more second bonding pads, wherein a bonding pad of the one or more first bonding pads of each lead of the one or more leads is directly electrically and physically connected to a second bonding pad of the one or more second bonding pads.

2. The stimulation system of claim 1 , wherein each of the one or more stimulating components further includes an insulating substrate, and wherein each of the one or more electrodes is disposed on the insulating substrate.

3. The stimulation system of claim 1 , wherein each of the one or more stimulating components is wrapped around to an outer surface of the cylindrical substrate.

4. The stimulation system of claim 1 , wherein the cylindrical substrate comprises a thermoplastic or thermoset material.

5. The stimulation system of claim 1 , further comprising:

a fluoropolymer coating that at least partially surrounds the secured one or more stimulating components.

6. The stimulation system of claim 1 , wherein the one or more stimulating components includes a plurality of stimulating components, and wherein the plurality of stimulating components are secured to the surface of the cylindrical substrate such that the one or more stimulating components do not overlap with each other.

7. The stimulation system of claim 1 , wherein:

the one or more electrodes includes at least 32 electrodes; and

a diameter of the stimulation system across a length-wise portion that includes at least one of the one or more stimulating components is less than 10 mm.

8. The stimulation system of claim 1 , wherein:

the one or more electrodes includes less than 9 electrodes; and

a diameter of the stimulation system across a length-wise portion that includes at least one of the one or more stimulating components is less than 2 mm.

9. The stimulation system of claim 1 , wherein the one or more stimulating components includes a first set of stimulating components and a second set of stimulating components, wherein spacing between and/or sizes of electrodes within the first set of stimulating components differ from spacing between and/or sizes of electrodes within the second set of stimulating components.

10. A method of manufacturing a lead assembly comprising:

disposing a set of electrodes and a set of electrical traces on a substrate, wherein each of the set of electrodes is connected to an electrical trace of the set of electrical traces;

inserting a mandrel through a tubing;

wrapping the substrate around the tubing such that the substrate is in a helical shape;

heating the substrate-wrapped tubing and mandrel prior to inserting the substrate-wrapped tubing and mandrel into a heat-shrink tube;

inserting the substrate-wrapped tubing and mandrel into the heat-shrink tube;

heating, subsequent to the insertion, the heat-shrink tube;

removing the heat-shrink tube from the substrate-wrapped tubing; and

removing the mandrel from the substrate-wrapped tubing.

11. The method of claim 10 , wherein the tubing includes a thermoset material.

12. The method of claim 10 , wherein the tubing includes a thermoplastic material.

13. The method of claim 10 , wherein the mandrel includes a metal mandrel coated with a fluoro-polymer.

14. The method of claim 10 , wherein the substrate includes a thin-film material.

15. The method of claim 10 , wherein a first portion of the substrate is wrapped around the tubing and a second portion of the substrate remains unwrapped.

16. The method of claim 15 , further comprising disposing a set of bonding pads on the second portion, wherein each trace of the set of electrical traces connects to a bonding pad of the set of bonding pads.

17. A method of implanting an implantable device, the method comprising:

implanting a lead assembly into a brain of a person, wherein the lead assembly includes:

stimulating components including:

one or more electrodes;

one or more leads, wherein each lead of the one or more leads is connected at a first end of the lead to an electrode of the one or more electrodes and is connected at a second end of the lead to a bonding pad of the one or more bonding pads; and

a cylindrical substrate, wherein the cylindrical substrate forms a hollow cylinder, and wherein each lead of the one or more stimulating components is secured to an outer surface of the cylindrical substrate along a length of the lead;

mounting a neurostimulator to a skull of the person; and

bonding the lead assembly with the neurostimulator.

18. The method of claim 17 , wherein:

a lumen extends through a supporting structure;

implanting the lead assembly includes:

inserting a rigid stylus through the lumen;

moving a distal end of the lead assembly to a target location while the rigid stylus is inserted through the lumen; and

removing the rigid stylus from the lumen.