Sputtering Target and Method for Producing Same
Provided is a cylindrical sputtering target made of a metal material, which has reduced particles. The sputtering target includes at least a target material, wherein the target material includes one or more metal elements, and has a crystal grain size of 10 μm or less.
1 . A cylindrical sputtering target, wherein:
the sputtering target comprises at least a target material;
the target material comprises one or more metal elements; and
the target material has a crystal grain size of 10 μm or less.
2 . The sputtering target according to claim 1 , wherein there is at least one joined portion.
3 . The sputtering target according to claim 2 , wherein the joined portion is present in a longitudinal direction of the target.
4 . The sputtering target according to claim 2 , wherein the joined portion is present in a circumferential direction.
5 . The sputtering target according to claim 1 , wherein the metal element is titanium.
6 . A method for producing the sputtering target according to claim 1 , comprising the steps of:
bending one or more flat plate materials; and
welding ends of the bent materials.
7 . The method according to claim 6 , wherein the bending comprises bending the one flat plate material to form a cylindrical shape.
8 . The method according to claim 6 ,
wherein the bending comprises bending the flat plate materials to form a plurality of circular arcuate materials, and
wherein the welding comprises welding the plurality of circular arcuate materials to form a cylindrical shape.
9 . The method according to claim 6 , further comprising a step of welding a plurality of cylindrical materials in a longitudinal direction.