IP Library Granted Patent US 12,595,980
Granted Patent B2
US 12,595,980 · App. 17/285,508 · Granted Apr 7, 2026

Composite member

Inventors: Ryota Matsugi (Osaka, JP); Isao Iwayama (Osaka, JP); Chieko Tanaka (Toyama, JP); Hideaki Morigami (Toyama, JP)
Assignees: Sumitomo Electric Industries, Ltd.; A.L.M.T. Corp.
F28F21/089B23K35/3006C22C5/08C22C26/00H10W40/255B23K2101/40B23K2103/08B23K2103/16
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Quick Facts
Patent No.
US 12,595,980
App. No.
17/285,508
Granted
Apr 7, 2026
Kind
B2
Abstract

A composite member having an excellent heat resistance is provided. The composite member includes: a substrate composed of a composite material including a non-metal phase and a metal phase; and a metal layer that covers at least a portion of a surface of the substrate, wherein a metal included in each of the metal phase and the metal layer is mainly composed of Ag, and a ratio of a content of Cu to a total content of Ag and Cu in a boundary region of the metal layer with the substrate is less than or equal to 20 atomic %.

Claims (27)

1 . A composite member comprising:

a substrate composed of a composite material including a non-metal phase and a metal phase; and

a metal layer that covers at least a portion of a surface of the substrate, wherein

a metal included in each of the metal phase and the metal layer is mainly composed of Ag,

a boundary region of the metal layer with the substrate includes Cu,

a ratio of a content of Cu to a total content of Ag and Cu in the boundary region of the metal layer with the substrate is more than or equal to 7.99 atomic % and less than or equal to 15.93 atomic %,

the boundary region includes Ti and Sn,

a content of Ti in the boundary region is more than or equal to 0.1 atomic % and less than or equal to 2.0 atomic % when a composition of the boundary region is assumed to be 100 atomic %,

a content of Sn in the boundary region is more than 0 atomic % and less than or equal to 3.0 atomic % when the composition of the boundary region is assumed to be 100 atomic %,

the composite member is a heat radiation member,

the non-metal phase includes a plurality of coated grains that include diamond grains and carbide layers coating and provided on each of the diamond grains, the carbide layers consist of at least one selected from the group consisting of SiC, TiC, ZrC, HfC, TaC, and Cr 3 C 2 ,

the content of non-metal phase to the composite material is more than or equal to 40 vol % and less than or equal to 90 vol %, and

the metal layer includes a precipitate composed of Cu and is in contact with non-metal phase.

2 . The composite member according to claim 1 , wherein a thickness of the metal layer is more than or equal to 20 μm and less than or equal to 200 μm.

3 . The composite member according to claim 1 , wherein a surface roughness Ra of the metal layer is less than or equal to 2.0 μm.

4 . The composite member according to claim 1 , wherein a content of Cu in a surface of the metal layer is less than or equal to 1.0 atomic % when a composition of the surface is assumed to be 100 atomic %.

5 . The composite member according to claim 1 , wherein the boundary region further includes one or more elements selected from Zn and In.

6 . The composite member according to claim 5 , wherein, a content of the one or more elements is less than or equal to 3.0 atomic %.

7 . The composite member according to claim 1 , wherein the content of Sn is more than or equal to 1.02 atomic % and less than or equal to 1.25 atomic %.

8 . The composite member according to claim 1 , wherein the content of Ti is more than or equal to 0.85 atomic % and less than or equal to 1.15 atomic %.

9 . The composite member according to claim 1 , wherein

the content of non-metal phase to the composite material is more than or equal to 60 vol % and less than or equal to 90 vol %.

10 . A manufacturing method of the composite member according to claim 1 , comprising:

preparing the substrate composed of the composite material including the non-metal phase and the metal phase mainly composed of Ag, and a metal member mainly composed of Ag;

joining the substrate and the metal member by a brazing material including Ag and Cu; and

performing heat treatment after joining the substrate and the metal member,

wherein, the heat treatment is performed at a temperature of less than the melting point of the eutectic alloy of Ag and Cu.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2023
From: SUMITOMO ELECTRIC INDUSTRIES, LTD.
To: A.L.M.T. CORP.
Reel/Frame 064453/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2021
From: MATSUGI, RYOTA; IWAYAMA, ISAO; TANAKA, CHIEKO; MORIGAMI, HIDEAKI
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.; A.L.M.T. CORP.
Reel/Frame 055925/0925 →
Priority Claims (1)
JP 2018-201235 · Oct 25, 2018 · national
Continuity (1)
Related Publication 20210381782A1 · Dec 9, 2021
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