Granted Patent B2

US 12,202,970 · App. 17/290,832 · Granted Jan 21, 2025

Inventors: Mian Dai (Shanghai, CN); Kazuhiko Mitsui (Tokyo, JP); Hariharan Ramalingam (Bangalore, IN); Tsutomu Kinoshita (Tokyo, JP); Katsura Hayashi (Tokyo, JP)

Assignee: SHPP GLOBAL TECHNOLOGIES B.V.

C08L71/00H01B3/306H01B3/427H01B7/0275C08L2203/202C08L2205/03H01B1/02

Abstract

Claims (57)

1. A thermoplastic composition comprising:

50 to 99.8 weight percent of an aromatic poly(ketone);

0.1 to 49.9 weight percent of a poly(etherimide) consisting of repeating units of the formula

wherein

R is p-phenylene, and

T is a group of the formula —O—Z—O— wherein the divalent bonds of the —O— or the —O—Z—O— group are in the 3,3′, 3,4′, 4,3′, or the 4,4′ positions and Z is a divalent group of the formula

wherein Q is —O—, —S—, —C(O)—, —SO 2 —, —SO—, —P(R a )(═O)— wherein R a is a C 1-8 alkyl or C 6-12 aryl, or —C y H 2y — wherein y is an integer from 1 to 5 or a halogenated derivative thereof;

0.1 to 20 weight percent of a reactive additive, wherein the reactive additive comprises

a functionalized phenylene ether oligomer, or

a novolac phenolic resin;

wherein weight percent of each component is based on the total weight of the composition.

2. The thermoplastic composition of claim 1 , wherein the aromatic poly(ketone) comprises a poly(ether ketone), poly(ether ether ketone), poly(ether ketone ketone), or a combination comprising at least one of the foregoing.

3. The thermoplastic composition of claim 1 , wherein Z is a divalent group of the formula

wherein Q is 2,2-isopropylidene.

4. The thermoplastic composition of claim 1 , wherein the composition further comprises up to 5 wt. % of an additive composition.

5. The thermoplastic composition of claim 4 , wherein the additive composition comprises an antioxidant, a thermal stabilizer, a hydrostabilizer, an ultraviolet absorber, a processing aid, a colorant, or a combination thereof.

6. The thermoplastic composition of claim 1 , wherein the composition exhibits one or more of:

a crystallization temperature greater than or equal to 250° C., as measured from a molten polymer mixture cooled at a rate of 20° C./min;

a melt temperature of 250 to 450° C.;

a flexural modulus of greater than 2500 MPa determined according to ASTM D 790;

a flexural stress of greater than 100 MPa, determined according to ASTM D 790;

a tensile stress of greater than 50 MPa determined according to ASTM D 638;

a HDT of greater than 100° C. determined according to ASTM D 648 at 1.82 MPa.

7. An electrical wire comprising:

a conductor wire; and

an insulating layer disposed over the conductor wire, wherein the insulating layer comprises an extrusion layer formed from the thermoplastic composition of claim 1 ,

optionally, wherein the insulating layers further comprises one or more intervening layers positioned between the conductor wire and the extrusion layer.

8. The electrical wire of claim 7 , wherein the extrusion layer coating the conductor wire has one or more of the following properties:

a tensile elongation of greater than 5%;

a breakdown voltage of greater than 10 kV;

a adhesion strength of greater than 2.5 MPa.

9. The electrical wire of claim 7 , wherein

the conductor wire comprises copper, aluminum, lead, gold, silver, iron, nickel, chromium, or an alloy comprising at least one of the foregoing; and

the conductor wire has a rectangular cross-section.

10. The electrical wire of claim 7 , wherein the extrusion layer has a thickness of less than 250 micrometers.

11. An article comprising the electrical wire of claim 7 .

12. The article of claim 11 , wherein the article is an electrical device component, a railway vehicle component, an auto-mobile component, a marine vehicle component, a construction component, construction component, a building component, or an aircraft component.

13. The thermoplastic composition of claim 1 , wherein the reactive additive is the functionalized phenylene ether oligomer.

14. The thermoplastic composition of claim 13 , wherein the functionalized phenylene ether oligomer is of the formula:

wherein

Q 1 and Q 2 are each independently halogen, unsubstituted or substituted C 1-12 primary or secondary hydrocarbyl, C 1-12 hydrocarbylthio, C 1-12 hydrocarbyloxy, and C 2-12 halohydrocarbyloxy wherein at least two carbon atoms separate the halogen and oxygen atoms;

Q 3 and Q 4 are each independently hydrogen, halogen, unsubstituted or substituted C 1-12 primary or secondary hydrocarbyl, C 1-12 hydrocarbylthio, C 1-12 hydrocarbyloxy, and C 2-12 halohydrocarbyloxy wherein at least two carbon atoms separate the halogen and oxygen atoms;

x and y are independently 0 to 30, provided that the sum of x and y is at least 2;

X is independently at each occurrence a hydrogen or a (meth)acrylate group; and

L has the structure

wherein

each occurrence of R 3 and R 4 and R 5 and R 6 is independently hydrogen, halogen, unsubstituted or substituted C 1-12 primary or secondary hydrocarbyl, C 1-12 hydrocarbylthio, C 1-12 hydrocarbyloxy, and C 2 -12 halohydrocarbyloxy wherein at least two carbon atoms separate the halogen and oxygen atoms;

z is 0 or 1; and

Y has a structure of

wherein each occurrence of R a , R b , R c , R d , and R e is independently hydrogen, C 1-12 hydrocarbyl, or C 1-6 hydrocarbylene, optionally wherein R a and R b or R c and R d together are a C 4 -C 8 cycloalkylene group.

15. The thermoplastic composition of claim 1 , wherein the functionalized phenylene ether oligomer is of the structure

wherein

each occurrence of Q 5 and Q 6 is independently methyl, di-n-butylaminomethyl, or morpholinomethyl;

each occurrence of a and b is independently 0 to 20, with the proviso that the sum of a and b is at least 2; and

X is independently at each occurrence a hydrogen or a (meth)acrylate group.

16. The thermoplastic composition of claim 1 , wherein the reactive additive is the novolac phenolic resin.

17. The thermoplastic composition of claim 16 , wherein the novolac phenolic resin is bisphenol A novolac resin.

Assignments (2)

Continuity (2)

References Cited (23)