Extruded capacitor films with high temperature performance, methods of manufacture, and articles containing the same

1. An extruded film comprising a composition, comprising:

65.0-99.85 wt % of a high heat copolycarbonate comprising

low heat bisphenol groups derived from a low heat monomer where the corresponding homopolycarbonate of the monomer has a Tg of lower than 155° C., determined according to ASTM E1640-13 with a 1° C./min heating rate, and

high heat bisphenol groups derived from a high heat bisphenol monomer where the corresponding homopolycarbonate of the monomer has a Tg of 155° C. or higher, determined according to ASTM E1640-13 with a 1° C./min heating rate,

the high heat copolycarbonate further having a number ratio of carbon atoms to a total of hydrogen, oxygen, and fluorine atoms of less than 1.12;

0.1-15.0 wt % of an organic slip agent, wherein the organic slip agent comprises pentaerythritol tetrastearate, dipentaerythritol hexastearate, glycerol tristearate, high density poly(ethylene), polymethylpentene, a poly(carbonate-siloxane), or a combination thereof;

0.05-0.5 wt % of a roughening agent comprising a particulate, crosslinked silicone; and

optionally, 1.0-50.0 wt % of a bisphenol A homopolymer comprising a weight average molecular weight of 19,000-21,000 Daltons, as measured by gel permeation chromatography (GPC), using a crosslinked styrene-divinylbenzene column and calibrated to bisphenol A homopolycarbonate references,

wherein each amount is based on the total weight of the composition and totals 100 wt %, and

wherein the extruded film has

a glass transition temperature of 170-250° C. determined in accordance with ASTM E1640-13; and

a Bosch Test clearing count of 0-10 at 300 V/μm.

2. The extruded film of claim 1 , wherein the roughening agent of the composition comprises a polymethylsilsesquioxane having a mean particle diameter of 0.5-2.5 μm as determined by scanning electron microscopy.

3. The extruded film of claim 1 , wherein the high heat copolycarbonate of the composition has a glass transition temperature of 170-250° C. determined according to ASTM E1640-13 with a 1° C./min heating rate.

4. The extruded film of claim 1 , wherein the high heat copolycarbonate is an N-phenylphenolphthaleinylbisphenol-bisphenol A copolycarbonate, or a combination of an N-phenylphenolphthaleinylbisphenol-bisphenol A copolycarbonate and a 3,3,5-trimethylcyclohexanone bisphenol-bisphenol A copolycarbonate.

5. The extruded film of claim 1 , wherein the organic slip agent of the composition comprises

0.1-1 wt % of the pentaerythritol tetrastearate, and

3.0-10 wt. % of the poly(carbonate-siloxane).

6. The extruded film of claim 1 wherein the composition comprises

65.0-99.85 wt % of a high heat copolycarbonate comprising an N-phenylphenolphthaleinylbisphenol-bisphenol A copolycarbonate, a 3,3,5-trimethylcyclohexanone bisphenol-bisphenol A copolycarbonate, or a combination thereof;

0.1-1 wt % of the pentaerythritol tetrastearate,

3.0-10 wt. % of the poly(carbonate-siloxane), and

0.05-0.5 wt % of a particulate polymethylsilsesquioxane roughening agent having a mean particle diameter of 0.5-2.5 um as determined by scanning electron microscopy;

wherein each amount is based on the total weight of the composition and totals 100 wt %.

7. The extruded film of claim 1 , wherein the composition further comprises a bisphenol A homopolymer in an amount of 1.0-50.0 wt %, based on the total weight of the composition.

8. The extruded film of claim 1 , wherein the composition further comprises an antioxidant in an amount of 0.02-0.06 wt %, based on the total weight of the composition.

9. The extruded film of claim 1 , having a thickness of 1-10 μm.

10. The extruded film of claim 1 , having a breakdown strength of greater than 700 V per μm as determined in accordance with ASTM D149 using a ball electrode.

11. The extruded film of claim 1 , wherein the film has at least one of the following properties:

a dielectric constant of greater than 2.5; and

a dissipation factor of less than 1.0%.

12. A capacitor, comprising

the extruded film of claim 1 ; and

an electrically conductive metal layer in contact with the film.

13. An electronic device comprising the capacitor of claim 12 .

14. The extruded film of claim 1 , wherein the high heat copolycarbonate of the composition comprises an N-phenylphenolphthaleinylbisphenol-bisphenol A copolycarbonate.

15. The extruded film of claim 1 , wherein the organic slip agent of the composition comprises 0.1-1 wt % -pentaerythritol tetrastearate.

16. The extruded film of claim 1 , wherein the high heat copolycarbonate of the composition comprises an N-phenylphenolphthaleinylbisphenol-bisphenol A copolycarbonate and wherein the organic slip agent comprises 0.1-1 wt % pentaerythritol tetrastearate.

17. The extruded film of claim 1 , wherein the high heat copolycarbonate of the composition comprises a 3,3,5-trimethylcyclohexanone bisphenol-bisphenol A copolycarbonate and wherein the organic slip agent comprises pentaerythritol tetrastearate.

18. A composition, comprising:

65.0-99.85 wt % of a high heat copolycarbonate comprising

low heat bisphenol groups derived from a low heat monomer where the corresponding homopolycarbonate of the monomer has a Tg of lower than 155° C., determined according to ASTM E1640-13 with a 1° C./min heating rate, and

high heat bisphenol groups derived from a high heat bisphenol monomer where the corresponding homopolycarbonate of the monomer has a Tg of 155° C. or higher, determined according to ASTM E1640-13 with a 1° C./min heating rate,

the high heat copolycarbonate further having a number ratio of carbon atoms to a total of hydrogen, oxygen, and fluorine atoms of less than 1.12;

0.1-15.0 wt % of an organic slip agent, wherein the organic slip agent comprises pentaerythritol tetrastearate, dipentaerythritol hexastearate, glycerol tristearate, high density poly(ethylene), polymethylpentene, a poly(carbonate-siloxane), or a combination thereof; and

0.05-0.5 wt % of a first roughening agent comprising a particulate, crosslinked silicone;

wherein each amount is based on the total weight of the composition and totals 100 wt %; and

a second roughening agent in an amount of 2.0-10.0 wt %, based on the total weight of the composition, wherein the second roughening agent comprises a cyclic olefin copolymer.

19. An extruded film comprising the composition of claim 18 .

20. A capacitor, comprising

the extruded film of claim 19 ; and

an electrically conductive metal layer in contact with the film.

21. An electronic device comprising the capacitor of claim 20 .

22. A composition, comprising:

65.0-99.85 wt % of a high heat copolycarbonate comprising

low heat bisphenol groups derived from a low heat monomer where the corresponding homopolycarbonate of the monomer has a Tg of lower than 155° C. determined according to ASTM E1640-13 with a 1° C./min heating rate, and

high heat bisphenol groups derived from a high heat bisphenol monomer where the corresponding homopolycarbonate of the monomer has a Tg of 155° C. or higher, determined according to ASTM E1640-13 with a 1° C./min heating rate,

the high heat copolycarbonate further having a number ratio of carbon atoms to a total of hydrogen, oxygen, and fluorine atoms of less than 1.12;

wherein the high heat copolycarbonate comprises a 3,3,5-trimethylcyclohexanone bisphenol-bisphenol A copolycarbonate;

0.1-15.0 wt % of an organic slip agent, wherein the organic slip agent comprises pentaerythritol tetrastearate, dipentaerythritol hexastearate, glycerol tristearate, high density poly(ethylene), polymethylpentene, a poly(carbonate-siloxane), or a combination thereof; and

0.05-0.5 wt % of a roughening agent comprising a particulate, crosslinked silicone;

wherein each amount is based on the total weight of the composition and totals 100 wt %.

23. An extruded film comprising the composition of claim 22 .

24. A capacitor, comprising

the extruded film of claim 23 ; and

an electrically conductive metal layer in contact with the film.

25. An electronic device comprising the capacitor of claim 24 .