IP Library Granted Patent US 12,006,431
Granted Patent B2
US 12,006,431 · App. 17/294,174 · Granted Jun 11, 2024

Overmolding thermoplastic elastomer compounds having high bio-based content

Inventor: Liang Xu (Vernon Hills, IL)
Assignee: Avient Corporation
C08L67/00B32B27/08B32B27/302B32B27/36B32B27/365C08L53/025C08L67/025B32B25/08B32B25/14C08L2205/02C08L2205/035C08L2207/04
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Quick Facts
Patent No.
US 12,006,431
App. No.
17/294,174
Granted
Jun 11, 2024
Kind
B2
Abstract

Thermoplastic elastomer compounds include (a) hydrogenated styrene-farnesene-styrene block copolymer, (b) thermoplastic polyester elastomer having a bio-based content of at least about 45%, (c) polyolefin having a bio-based content of at least about 95%, (d) secondary styrenic block copolymer such as styrene-ethylene/butylene-styrene block copolymer, and (e) plasticizer. The thermoplastic elastomer compounds have a bio-based content of at least about 40%. Additionally, the thermoplastic elastomer compounds have an adhesion of at least about 10 pli according to a 90° Peel Test on at least one of acrylonitrile butadiene styrene, polycarbonate/acrylonitrile butadiene styrene, and polycarbonate. The thermoplastic elastomer compounds can be especially useful for making overmolded thermoplastic articles.

Claims (28)

1. A thermoplastic elastomer compound comprising:

(a) from about 10 to about 65 weight percent, by weight of the compound, of a hydrogenated styrene-farnesene-styrene block copolymer;

(b) from about 10 to about 65 weight percent, by weight of the compound, of a thermoplastic polyester elastomer having a bio-based content of at least about 45%;

(c) from about 2 to about 20 weight percent, by weight of the compound, of a polyolefin having a bio-based content of at least about 95%;

(d) from about 2 to about 20 weight percent, by weight of the compound, of a secondary styrenic block copolymer;

(e) from about 2 to about 20 weight percent, by weight of the compound, of a plasticizer;

(f) from 0 to about 15 weight percent, by weight of the compound, of a hydrocarbon resin; and

(g) from 0 to about 10 weight percent, by weight of the compound, of one or more additives selected from the group consisting of antioxidants; colorants; ultraviolet light absorbers; waxes; and combinations thereof;

wherein the compound has a bio-based content of at least about 40%; and

wherein the compound has an adhesion of at least about 10 pli according to a 90° Peel Test on at least one of acrylonitrile butadiene styrene, polycarbonate/acrylonitrile butadiene styrene, and polycarbonate.

2. The compound of claim 1 , wherein the compound has a bio-based content of at least about 50%.

3. The compound of claim 1 , wherein the compound has an adhesion of at least about 10 pli according to a 90° Peel Test on each of acrylonitrile butadiene styrene (ABS), polycarbonate/acrylonitrile butadiene styrene (PC/ABS), and polycarbonate (PC).

4. The compound of claim 1 , wherein the secondary styrenic block copolymer is selected from styrene-ethylene/butylene-styrene (SEBS) block copolymer, styrene-ethylene/propylene-styrene (SEPS) block copolymer, styrene-ethylene/ethylene/propylene-styrene (SEEPS) block copolymer, styrene-isobutylene-styrene (SIBS) block copolymer, styrene-butadiene-styrene (SBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, and combinations thereof.

5. The compound of claim 1 , wherein the compound includes from about 2 to about 10 weight percent, by weight of the compound, of the hydrocarbon resin.

6. The compound of claim 1 , wherein the compound further comprises two or more additives selected from the group consisting of antioxidants; colorants; ultraviolet light absorbers; waxes; and combinations thereof.

7. The compound of claim 1 , wherein the hydrogenated styrene-farnesene-styrene block copolymer and the thermoplastic polyester elastomer are present at a weight ratio ranging from about 1:2 to about 2:1.

8. The compound of claim 1 , wherein the hydrogenated styrene-farnesene-styrene block copolymer comprises a combination of a first grade of hydrogenated styrene-farnesene-styrene block copolymer and a second grade of hydrogenated styrene-farnesene-styrene block copolymer, wherein the first grade of hydrogenated styrene-farnesene-styrene block copolymer has a first melt flow rate and a first hardness and the second grade of hydrogenated styrene-farnesene-styrene block copolymer has a second melt flow rate different from the first melt flow rate and a second hardness different from the first hardness.

9. The compound of claim 8 , wherein the first grade of hydrogenated styrene-farnesene-styrene block copolymer and the second grade of hydrogenated styrene-farnesene-styrene block copolymer are present at a weight ratio ranging from about 1:3 to about 3:1.

10. A thermoplastic article molded from the thermoplastic elastomer compound of claim 1 .

11. An overmolded thermoplastic article comprising:

(a) an overmold portion molded from the thermoplastic elastomer compound of claim 1 ; and

(b) a substrate portion molded from a thermoplastic resin compound comprising thermoplastic resin selected from the group consisting of acrylonitrile butadiene styrene (ABS), polycarbonate/acrylonitrile butadiene styrene (PC/ABS), and polycarbonate (PC);

wherein the overmold portion is bonded onto the substrate portion at a bond interface, and the bond interface is free of adhesive.

12. A method of making an overmolded thermoplastic article having a substrate portion and an overmold portion, the method comprising the steps of:

(a) providing the thermoplastic elastomer compound of claim 1 ;

(b) providing a thermoplastic resin compound comprising thermoplastic resin selected from the group consisting of acrylonitrile butadiene styrene, polycarbonate/acrylonitrile butadiene styrene, and polycarbonate;

(c) molding the thermoplastic resin compound to provide the substrate portion; and

(d) overmolding the thermoplastic elastomer compound to provide the overmold portion, wherein the overmold portion is bonded onto the substrate portion at a bond interface, and wherein the bond interface is free of adhesive, thereby providing the overmolded thermoplastic article.

Assignments (4)
RELEASE OF SECURITY INTERESTS IN PATENTS RECORDED AT REEL 067697, FRAME 0369. Recorded Jun 24, 2025
From: WELLS FARGO CAPITAL FINANCE, LLC, AS ADMINISTRATIVE AGENT
To: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.
Reel/Frame 071708/0376 →
SECURITY AGREEMENT Recorded Jun 12, 2025
From: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.; COLORMATRIX GROUP, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 071574/0571 →
PATENT SECURITY AGREEMENT (TERM) Recorded Jun 12, 2024
From: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 067699/0676 →
SECURITY INTEREST Recorded Jun 11, 2024
From: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.
To: WELLS FARGO CAPITAL FINANCE, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 067697/0369 →