Light-emitting diodes with light coupling and conversion layers
Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.
1. A pixel comprising:
a substrate;
a red sub-pixel on the substrate, the red sub-pixel comprising:
a first light-emitting diode;
a first dome-shaped scattering layer disposed over the first light-emitting diode; and
a red light-emission layer comprising red-emitting particles and scattering particles disposed in a polymeric matrix disposed over the first scattering layer;
a green sub-pixel on the substrate, the green sub-pixel comprising:
a second light-emitting diode;
a second dome-shaped scattering layer disposed over the second light-emitting diode; and
a green light-emission layer comprising green-emitting particles and scattering particles disposed in a polymeric matrix disposed over the second scattering layer; and
a blue sub-pixel on the substrate, the blue sub-pixel comprising:
a third light-emitting diode.
2. The pixel of claim 1 , wherein each of the first light-emitting diode, the second light-emitting diode, and the third light-emitting diode is a blue light-emitting diode.
3. The pixel of claim 2 , wherein the blue light-emitting diodes are gallium nitride-based diodes.
4. The pixel of claim 1 , wherein the first light-emitting diode, the second light-emitting diode, and the third light-emitting diode are ultraviolet light emitting-diodes, and the blue sub-pixel comprises:
a third dome-shaped scattering layer disposed over the third light-emitting diode; and
a blue light-emission layer comprising blue-emitting particles and scattering particles disposed in a polymeric matrix disposed over the third scattering layer.
5. The pixel of claim 1 , wherein the first scattering layer is localized over the first light-emitting diode, the second scattering layer is localized over the second light-emitting diode, or the first and second scattering layers are localized over the first and second light-emitting diodes, respectively.
6. The pixel of claim 1 , wherein an emission surface area of the green sub-pixel is larger than an emission surface area of the red sub-pixel, and the emission surface area of the red sub-pixel is larger than an emission surface area of the blue sub-pixel.
7. A pixel comprising:
a substrate;
a red sub-pixel on the substrate, the red sub-pixel comprising:
a first light-emitting diode;
a first dome-shaped scattering layer disposed over the first light-emitting diode; and
a red light-emission layer comprising red-emitting particles and scattering particles disposed in a polymeric matrix disposed over the first scattering layer;
a green sub-pixel on the substrate, the green sub-pixel comprising:
a second light-emitting diode;
a second dome-shaped scattering layer disposed over the second light-emitting diode; and
a green light-emission layer comprising green-emitting particles and scattering particles disposed in a polymeric matrix disposed over the second scattering layer; and
a blue sub-pixel on the substrate, the blue sub-pixel comprising:
a third light-emitting diode, wherein the first scattering layer is separated from the red light-emission layer by an interfacial region having a gradient in which the concentration of red-emitting particles in the interfacial region is lower near the first scattering layer than near the red light-emission layer, and/or wherein the second scattering layer is separated from the green light-emission layer by an interfacial region having a gradient in which the concentration of green-emitting particles in the interfacial region is lower near the second scattering layer than near the green light-emission layer.
8. A color conversion display device comprising:
a display device substrate;
a plurality of pixels arranged on the display device substrate, each pixel in the plurality of pixels comprising:
a substrate;
a red sub-pixel on the substrate, the red sub-pixel comprising:
a first light-emitting diode;
a first dome-shaped scattering layer disposed over the first light-emitting diode; and
red light-emission layer comprising red-emitting particles and scattering particles disposed in a polymeric matrix disposed over the first scattering layer;
a green sub-pixel on the substrate, the green sub-pixel comprising:
a second light-emitting diode;
a second dome-shaped scattering layer disposed over the second light-emitting diode; and
a green light-emission layer comprising green-emitting particles and scattering particles disposed in a polymeric matrix disposed over the second scattering layer; and
a blue sub-pixel on the substrate, the blue sub-pixel comprising:
a third light-emitting diode; and
a translucent protective layer disposed over the plurality of pixels.
9. A method of forming a pixel on a substrate comprising a first light emitting-diode, a second light-emitting diode, and a third light-emitting diode, the method comprising:
forming a first confinement feature over the first light-emitting diode;
depositing a first film-forming composition comprising scattering particles and curable organic molecules over the first light-emitting diode;
curing the first film-forming composition to form a first scattering layer;
depositing a first light emissive particle containing composition comprising red-emitting particles, scattering particles, and curable organic molecules over the first scattering layer;
curing the first light emissive particle containing composition to form a red light-emission layer;
forming a second confinement feature over the second light-emitting diode;
depositing a second film-forming composition comprising scattering particles and curable organic molecules over the second light-emitting diode;
curing the second film-forming composition to form a second scattering layer; depositing a second light emissive particle containing composition comprising green-emitting particles, scattering particles, and curable organic molecules over the second scattering layer; and
curing the second light emissive particle containing composition to form a green light-emission layer.
10. The method of claim 9 , wherein at least one of the first film-forming composition, the first light emissive particle containing composition, the second film-forming composition, and the second light emissive particle containing composition is deposited by inkjet printing.
11. The method of claim 9 , wherein each of the first light-emitting diode and the second light-emitting diode is a gallium nitride-based light-emitting diode integrated into the substrate.
12. The method of claim 9 , wherein each of the first light-emitting diode and the second light-emitting diode is a blue light-emitting diode.
13. The method of claim 9 , wherein each of the first light-emitting diode and the second light-emitting diode is an ultraviolet light-emitting diode.
14. The method of claim 13 , further comprising:
forming a third confinement feature over the third light-emitting diode;
depositing a third film-forming composition comprising curable organic molecules over the third light-emitting diode;
curing the third film-forming composition to form a coupling layer;
depositing a third light emissive particle containing composition comprising blue-emitting quantum dots, scattering particles, and curable organic molecules over the coupling layer; and
curing the third light emissive particle containing composition to form a blue light-emission layer.
15. The method of claim 9 , wherein the first film-forming composition is cured prior to depositing the first light emissive particle containing composition, and/or the second film-forming composition is cured prior to depositing the second light emissive particle containing composition, and/or the third film-forming composition is cured prior to depositing the third light emissive particle containing composition.
16. The method of claim 9 , wherein the first light emissive particle containing composition is deposited before the first film-forming composition is cured, and/or the second light emissive particle containing composition is deposited before the second film-forming composition is cured, and/or the third light emissive particle containing composition is deposited before the third film-forming composition is cured.
17. A method of forming a color conversion display device, the method comprising forming a plurality of pixels on a display device substrate, wherein the pixels are formed on the display device substrate using the method of claim 9 .
18. A method of forming a display, the method comprising:
forming a plurality of pixels on a semiconductor substrate each pixel comprising a red sub-pixel, a green sub-pixel, and a blue sub-pixel, wherein the pixels are formed by:
forming a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode on the semiconductor substrate;
forming a first confinement feature over the first light-emitting diode;
forming a second confinement feature over the second light-emitting diode;
forming a red light emission-layer over the first light-emitting diode by depositing an ink comprising red-emitting particles and scattering particles over the first light-emitting diode and curing the ink to provide the red sub-pixel;
forming a green light emission layer over the second light-emitting diode in the second confinement feature by depositing an ink comprising green-emitting particles and scattering particles over the second light-emitting diode and curing the ink to provide the green sub-pixel; and
forming a blue light emission layer over the third light-emitting diode by inkjet depositing an ink comprising blue-emitting particles and scattering particles over the third light-emitting diode and curing the ink;
dicing the substrate into pieces, each of the pieces comprising one or more, but not all, of the pixels; and
transferring one or more of the pieces to a display substrate.
19. The method of claim 18 , wherein each of the first, second, and third light-emitting diodes is a gallium nitride-based light-emitting diode integrated into the substrate.
20. The method of claim 18 , wherein the green sub-pixels have emission surface areas that are larger than emission surface areas of the red sub-pixels and the emission surface areas of the blue sub-pixels.
21. The method of claim 18 , wherein at least one of the ink comprising red-emitting quantum dots and the ink comprising blue-emitting quantum dots is deposited by inkjet printing.