IP Library Granted Patent US 11,687,283
Granted Patent B2
US 11,687,283 · App. 17/306,566 · Granted Jun 27, 2023

Memory module interfaces

Inventor: Robert M. Walker (Raleigh, NC)
Assignee: Micron Technology, Inc.
G06F3/0659G06F3/061G06F3/0688G06F13/4282G11C7/1003
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Quick Facts
Patent No.
US 11,687,283
App. No.
17/306,566
Granted
Jun 27, 2023
Kind
B2
Abstract

The present disclosure includes apparatuses and methods related to memory module interfaces. A memory module, which may include volatile memory or nonvolatile memory, or both, may be configured to communicate with a host device via one interface and to communicate with another memory module using a different interface. Memory modules may thus be added or removed from a system without impacting a PCB-based bus to the host, and memory modules may communicate with one another without accessing a bus to the host. The host interface may be configured according to one protocol or standard, and other interfaces between memory modules may be configured according to other protocols or standards.

Claims (29)

1. An apparatus, comprising:

a first memory module coupled to a host via a first bus on a printed circuitry board (PCB) and comprising one or more types of memory media;

a second memory module coupled to the first memory module via a second bus off the PCB, wherein the second memory module is coupled only to the first memory module via the second bus; and

an interface configured to transfer data, commands, or both, between the first memory module and the second memory module.

2. The apparatus of claim 1 , wherein at least one of the one or more types of memory media comprises a non-volatile memory array.

3. The apparatus of claim 1 , wherein the interface is configured to transfer data, commands, or both, in response to receiving a read request, a write request, or both.

4. The apparatus of claim 1 , further comprising a different interface configured to transfer data, commands, or both, between the first memory module and the host in response to receiving a read request, a write request, or both.

5. The apparatus of claim 1 , further comprising a different interface configured to transfer data, commands, or both, between the second memory module and the host in response to receiving a read request, a write request, or both.

6. The apparatus of claim 1 , further comprising the second memory module coupled to a third memory module via a third bus.

7. A system, comprising:

a host;

a first memory module coupled to the host via a first bus on a printed circuitry board (PCB) and comprising one or more types of memory media, the first memory module configured to execute commands from the host to transfer data between the first memory module, a second memory module, and the host;

the second memory module coupled to the first memory module via a second bus off the PCB, wherein the second memory module is coupled only to the first memory module via the second bus; and

a first interface configured to transfer the data between the first memory module and the host in response to receiving a first read request, a first write request, or both; and

a second interface configured to transfer the data between the first memory module and the second memory module in response to receiving a second read request, a second write request, or both.

8. The system of claim 7 , wherein the one or more types of memory media comprises at least one non-volatile memory array.

9. The system of claim 7 , wherein the first bus is couplable to a third interface on the host.

10. The system of claim 9 , wherein the system is configured to transfer data between the host and the first memory module via the first interface, the third interface, and the first bus.

11. The system of claim 7 , wherein the second memory module comprises a further interface and is coupled to the first memory module via the second interface, the second bus, and the further interface.

12. The system of claim 7 , wherein the first memory module is an NVDIMM-P and the second memory module includes DRAM.

13. The system of claim 7 , wherein the first memory module is an NVDIMM-P and the second memory module includes storage class memory.

14. A method, comprising:

transferring a first portion of data between a host and a first memory module via a first bus located on a printed circuitry board (PCB), a first interface, and a second interface; and

transferring a second portion of data between the first memory module and a second memory module via a second bus located off the PCB, a third interface, and a fourth interface, wherein the second memory module is coupled only to the first memory module via the second bus.

15. The method of claim 14 , further comprising, transferring the first portion of data in response to receiving a read request, a write request, or both.

16. The method of claim 14 , further comprising, transferring the second portion of data in response to receiving a read request, a write request, or both.

17. The method of claim 14 , further comprising transferring the first portion of data while transferring the second portion of data.

18. The method of claim 14 , wherein transferring the first portion of data and transferring the second portion of data includes executing commands from the host.

19. The method of claim 14 , wherein transferring the second portion of data includes executing commands from the first memory module, the second memory module, or both.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2024
From: MICRON TECHNOLOGY, INC.
To: LODESTAR LICENSING GROUP LLC
Reel/Frame 067447/0112 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2021
From: WALKER, ROBERT M.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056118/0467 →