Temperature modulation assembly and a multi-layer retention mechanism for a temperature therapy device
A temperature modulation assembly and a multi-layer retention mechanism for such a temperature therapy device are disclosed. According to one embodiment, a temperature modulation assembly for a temperature therapy device has a heat spreader and a mounting plate coupled to a bottom portion of a spacer, wherein the heat spreader is disposed between the mounting plate and the spacer. The temperature modulation assembly has a heatsink and a fan coupled to a top portion of the spacer, wherein the heatsink is disposed between the top portion of the spacer and the fan. The temperature modulation assembly further includes a heating and/or cooling device disposed within a central opening of the spacer, wherein the heating and/or cooling device is located between the heatsink and the heat spreader.
1. A temperature modulation assembly for a temperature therapy device, the temperature modulation assembly comprising:
a heat spreader;
a spacer comprising a central opening and a support structure, wherein the support structure directly contacts a fan;
a mounting plate coupled to a bottom portion of the spacer, wherein the heat spreader is disposed between the mounting plate and the spacer;
a heatsink; and
a heating and/or cooling device disposed within the central opening of the spacer, wherein the heating and/or cooling device is located between the heatsink and the heat spreader,
wherein the fan is coupled to a top portion of the spacer, wherein the heatsink is disposed between the top portion of the spacer and the fan.
2. The temperature modulation assembly of claim 1 , wherein the mounting plate comprises aluminum or anodized aluminum.
3. The temperature modulation assembly of claim 1 , wherein the spacer comprises one or more materials selected from the group consisting of Nylon 66, Dupont 801, and Dupont 2801.
4. The temperature modulation assembly of claim 1 , wherein the heatsink comprises a skived heatsink.
5. The temperature modulation assembly of claim 1 , wherein the heat spreader comprises graphene and/or graphite.
6. The temperature modulation assembly of claim 1 , wherein the heat spreader comprises:
a top layer comprising silicone adhesive;
a middle layer comprising graphene and/or graphite; and
a bottom layer comprising silicone adhesive, wherein the middle layer is disposed between the top layer and the bottom layer.
7. The temperature modulation assembly of claim 1 , wherein one or more strain relief fingers are formed in the heat spreader.
8. The temperature modulation assembly of claim 7 , wherein the one or more strain relief fingers extend radially from an edge of the heat spreader toward a central portion of the heat spreader.
9. The temperature modulation assembly of claim 1 , further comprising a primer layer disposed between the heat spreader and the mounting plate.
10. The temperature modulation assembly of claim 1 , further comprising:
a cover disposed over the spacer and disposed circumferentially around the heatsink and fan; and
a portion of a multi-layer retention mechanism disposed between the cover and the spacer.
11. The temperature modulation assembly of claim 10 , wherein the portion of the multi-layer retention mechanism disposed between the cover and the spacer includes a portion of a top layer of the multi-layer retention mechanism and a ring feature of the multi-layer retention mechanism.
12. The temperature modulation assembly of claim 11 , further comprising a cap coupled to the cover, wherein the cap comprises a plurality of openings configured to provide air flow into and/or out of the temperature modulation assembly.
13. The temperature modulation assembly of claim 1 , wherein the heating and/or cooling device comprises a thermoelectric cooler (TEC).
14. The temperature modulation assembly of claim 1 , wherein the support structure comprises a columnal structure.
15. The temperature modulation assembly of claim 1 , wherein the support structure comprises an opening configured to receive a screw.
16. The temperature modulation assembly of claim 1 , wherein a portion of the fan that this is in direct contact with the support structure extends past the heatsink.