Holder on glass imaging module
Coverglass is disposed over an image sensor. The coverglass includes a trench extending a depth into the coverglass. The trench is configured to receive a lens assembly and the lens assembly may be bonded to the trench.
1. A camera assembly comprising:
an image sensor for imaging incident image light;
a lens assembly including a first optical element; and
coverglass disposed between the image sensor and the lens assembly, wherein the coverglass includes a trench, and wherein a bottom of the lens assembly is configured to align with the trench and be bonded to the trench to reduce a z-height between the image sensor and a first optical element of the lens assembly.
2. The camera assembly of claim 1 , wherein the trench has a depth that is a portion of a thickness of the coverglass.
3. The camera assembly of claim 1 , wherein the trench is keyed to align the lens assembly with the image sensor.
4. The camera assembly of claim 1 further comprising:
an optical layer disposed on the coverglass between the lens assembly and the coverglass, wherein the trench extends through the optical layer.
5. The camera assembly of claim 1 , wherein the trench is disposed on an outside boundary of the coverglass.
6. The camera assembly of claim 1 , wherein the trench has two sidewalls.
7. The camera assembly of claim 1 , wherein the lens assembly is bonded to the trench.
8. The camera assembly of claim 1 further comprising:
adhesive-reservoirs extending into the coverglass, wherein the adhesive-reservoirs are configured to accept excess adhesive flowing from the trench.
9. The camera assembly of claim 8 further comprising:
channels extending into the coverglass to guide the excess adhesive to the adhesive-reservoirs.
10. The camera assembly of claim 9 , wherein the channels are shallower than a depth of the trench and the adhesive-reservoirs have a reservoir-depth that is deeper than the channels.
11. The camera assembly of claim 1 , wherein the lens assembly includes a plurality of optical elements.
12. The camera assembly of claim 1 further comprising:
adhesive disposed at a bottom of the trench, wherein the adhesive bonds the lens assembly to the trench.
13. The camera assembly of claim 1 , wherein the bottom of the trench has a surface roughness greater than a roughness of the coverglass.
14. The camera assembly of claim 1 , wherein the trench is etched in the coverglass.
15. The camera assembly of claim 1 , wherein the trench has a depth into the coverglass between 50 microns and 400 microns.
16. An image sensor module comprising:
an image sensor for imaging incident image light; and
coverglass disposed over the image sensor, wherein the coverglass includes a trench extending a depth into the coverglass, and wherein the trench is configured to receive an assembly body of a lens assembly.
17. The image sensor module of claim 16 further comprising:
an optical layer disposed on the coverglass, wherein the trench extends through the optical layer.
18. The image sensor module of claim 16 , wherein the trench is disposed on an outside boundary of the coverglass.
19. The image sensor module of claim 16 , wherein the trench has two sidewalls, and wherein the trench is offset from an outside boundary of the coverglass.
20. The image sensor module of claim 16 , wherein the trench is formed over the image sensor, but not over an image pixel array of the image sensor.