LDMOS with field plates

1. A semiconductor device comprising:

a first electroconductive type body region formed on a main surface of a semiconductor substrate;

a second electroconductive type source region formed on a surface of the body region;

a second electroconductive type drift region formed so as to have contact with the body region;

a second electroconductive type drain region formed on the drift region;

a first electroconductive type buried region having contact with the body region and formed below the drift region;

a gate electrode formed above the body region between the source region and the drift region and above the drift region nearer to the source region via a gate insulating film;

a first field plate that extends from the gate electrode toward the drain region and that is formed above the drift region via a first insulating film, a bottom surface of the first insulating film being lower than a top surface of the second electroconductive type drift region; and

a second field plate that has contact with the source region or the gate electrode and that is formed above the first field plate via a second insulating film,

wherein a distance between the buried region and the drain region is shorter than a distance between the first field plate and the drain region, and longer than a distance between the second field plate and the drain region,

wherein the semiconductor substrate has a first electroconductive type SOI layer formed with a buried insulating layer therebetween, and the first electroconductive type SOI layer separates the buried insulating layer from the first electroconductive type buried region and the second electroconductive type drift region.

2. The semiconductor device according to claim 1 ,

wherein the second field plate is composed of a plurality of wiring layers which have distances to the drain region different from one another;

a distance between any upper layer and the drain region is shorter than a distance between any lower layer and the drain region in the plurality of wiring layers;

a distance between a wiring layer, which is located in the uppermost layer, and the drain region is shorter than a distance between the buried region and the drain region; and

a distance between a wiring layer, which is located in the lowermost layer, and the drain region is shorter than a distance between the first field plate and the drain region.

3. The semiconductor device according to claim 1 ,

wherein the maximum impurity concentration of the drift region is equal to 1e16/cm 3 or larger, and

the maximum impurity concentration of the buried region is equal to one third of the maximum impurity concentration of the drift region on the buried region or larger or equal to the maximum impurity concentration of the drift region or smaller.

4. The semiconductor device according to claim 1 ,

wherein

the body region, the source region, the drift region, the drain region, and the buried region are formed in the SOI layer.

5. The semiconductor device according to claim 1 ,

wherein the gate electrode and the first field plate are electrically connected to the body region.

6. The semiconductor device according to claim 1 , the semiconductor device being an LDMOS,

wherein the drift region extends along the main surface of the semiconductor substrate between the body region and the drain region.

7. The semiconductor device according to claim 1 ,

wherein a voltage of the semiconductor substrate is equal to the voltage of the drain region.

8. The semiconductor device according to claim 1 ,

wherein a voltage of the semiconductor substrate is equal to a voltage intermediate between the voltage of the drain region and the voltage of the source region.

9. A semiconductor device comprising:

a first electroconductive type body region formed on a main surface of a semiconductor substrate;

a second electroconductive type emitter region formed on a surface of the body region;

a second electroconductive type drift region formed so as to have contact with the body region;

a first electroconductive type collector region formed on the drift region;

a first electroconductive type buried region having contact with the body region and formed below the drift region, a top surface of the first electroconductive type buried region being leveled with a bottom surface of the second electroconductive type drift region;

a gate electrode formed above the body region between the emitter region and the drift region and above the drift region nearer to the emitter region via a gate insulating film;

a first field plate that extends from the gate electrode toward the collector region and that is formed above the drift region via a first insulating film, a bottom surface of the first insulating film being lower than a top surface of the second electroconductive type drift region; and

a second field plate that has contact with the emitter region or the gate electrode and that is formed above the first field plate via a second insulating film,

wherein a distance between the buried region and the collector region is shorter than a distance between the first field plate and the collector region and longer than a distance between the second field plate and the collector region.

10. The semiconductor device according to claim 9 ,

wherein the semiconductor substrate has an SOI layer formed with a buried insulating layer therebetween, and

the body region, the emitter region, the drift region, the collector region, and the buried region are formed in the SOI layer.