IP Library Granted Patent US 12,130,095
Granted Patent B2
US 12,130,095 · App. 17/316,055 · Granted Oct 29, 2024

Thermal interface materials

Inventors: Yong Joon Lee (Burlington, MA); William J. Scimeca (Boston, MA); Nicolo Brambilla (Brookline, MA); Daniel Rich (Cambridge, MA)
Assignee: Henkel AG & Co. KGaA
F28F21/065B29C43/003B29C43/203B29C43/32B29C69/001B32B25/08B32B27/20H01L23/3675H01L23/3733H05K7/20481B29K2101/12B29K2507/04B29K2995/0013B29L2031/18B32B2307/302
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Quick Facts
Patent No.
US 12,130,095
App. No.
17/316,055
Granted
Oct 29, 2024
Kind
B2
Abstract

Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.

Claims (22)

1. A thermal interface material comprising:

a sheet extending between a first major surface and a second major surface, the sheet comprising:

a base material; and

a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements;

wherein the thermally conductive elements are oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction;

wherein the base material is substantially free of silicone;

wherein the thermal conductivity of the sheet along the primary direction is at least 20 W/mK; and wherein the thermal interface material comprises carbon elements continuously extending through the sheet from the first major surface to the second major surface along the primary direction and configured to promote heat flow from the first surface to the second surface.

2. The thermal interface material of claim 1 , wherein the sheet comprises a slice separated from a stack of a plurality of layers of base material compressed together,

each of said layers is embedded with filler material, and wherein the filler material in each layer comprises anisotropically oriented thermally conductive elements;

wherein the orientation of the slice during separation from the stack is such that the B thermally conductive elements are oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction.

3. The thermal interface material of claim 1 , wherein the base material comprises a self-supporting flexible layer.

4. The thermal interface material of claim 1 , wherein the base material comprises a thermoplastic material.

5. The thermal interface material of claim 1 , wherein the thermal conductivity of the sheet along the primary direction is at least 30 W/mK.

6. The thermal interface material of claim 1 , wherein the sheet is characterized by a Shore hardness in the range of 40 to 90.

7. The thermal interface material of claim 1 , wherein the filler material comprises ceramic flakes.

8. The thermal interface material of claim 1 , wherein the filler material comprises flakes of boron nitrite.

9. The thermal interface material of claim 1 , wherein the filler material comprises graphite flakes.

10. The thermal interface material of claim 1 , wherein the filler material comprises graphene flakes.

11. The thermal interface material of claim 1 , wherein the filler material comprises at least one selected from the list consisting of: carbon nanotubes, bundles of carbon nanotubes, and agglomerates of aligned carbon nanotubes.

12. The thermal interface material of claim 1 , wherein the sheet comprises a region proximal the first major surface or second major surface of the sheet, said region containing a subset of the thermally conductive elements of the filler are that less anisotropically oriented than the thermally conductive elements located more distal to said surface.

13. The thermal interface material of claim 1 , wherein the sheet comprises a first region proximal the first major surface of the sheet and a second region proximal to the second major surface of the sheet, wherein each of the first and second regions contain a respective subset of the thermally conductive elements of the filler that are less anisotropically oriented than the thermally conductive elements located more distal to said surfaces.

14. The thermal interface material of claim 1 , wherein at least one of the first major surface and the second major surface of the sheet comprise a solvent-treated surface region.

Assignments (5)
TERMINATION OF SECURITY AGREEMENT Recorded Dec 4, 2024
From: WINDSAIL CAPITAL FUND, L.P.
To: FASTCAP SYSTEMS CORPORATION; BR CHROM LLC
Reel/Frame 070946/0799 →
RELEASE OF SECURITY INTEREST Recorded Jan 22, 2024
From: WINDSAIL CAPITAL FUND, L.P.
To: FASTCAP SYSTEMS CORPORATION; FASTCAP EXPLORATION TECHNOLOGIES LTD.
Reel/Frame 066200/0511 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2023
From: FASTCAP SYSTEMS CORPORATION
To: HENKEL AG & CO. KGAA
Reel/Frame 062916/0787 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2022
From: LEE, YONG JOON; SCIMECA, WILLIAM J.; BRAMBILLA, NICOLO; RICH, DANIEL
To: FASTCAP SYSTEMS CORPORATION
Reel/Frame 061729/0834 →
SECURITY INTEREST Recorded Oct 18, 2022
From: FASTCAP SYSTEMS CORPORATION
To: WINDSAIL CREDIT FUND, L.P.
Reel/Frame 062738/0152 →
Continuity (4)
Continuation 17165363 · Feb 2, 2021
Continuation PCTUS2020044286 · Jul 30, 2020
Provisional Application 62880370 · Jul 30, 2019
Related Publication 20210265234A1 · Aug 26, 2021