Beam delivery system

1. A beam delivery system comprising:

a beam delivery photonic integrated circuit comprising:

one or more optical inputs;

a plurality of waveguide outputs, wherein each of the plurality of waveguide outputs are tapered;

a plurality of beam paths, each beam path connecting one of the plurality of waveguide outputs to at least one of the one or more optical inputs,

wherein at least one of the plurality of waveguide outputs that is connected to a first optical input of the one or more optical inputs is directed to a photodetector configured to measure an intensity of the waveguide output directed to the photodetector,

wherein each of the plurality of beam paths connected to the first optical input comprises a respective optical element configured to provide a respective beam having a respective power that is substantially constant by removing power fluctuations from the respective beam provided via a respective waveguide output of the plurality of waveguide outputs based on the intensity of the waveguide output measured by the photodetector, and

wherein the beam delivery photonic integrated circuit is on a chip;

a telecentric optical relay assembly, the telecentric optical relay assembly configured to receive beams provided by at least two of the plurality of waveguide outputs and focus each received beam on a corresponding one of a plurality of positions of an atomic object confinement apparatus in a telecentric manner.

2. The beam delivery system of claim 1 , wherein one or more beam paths of the plurality of beam paths comprises a respective optical element configured to tune a respective beam for at least one of frequency, phase, or intensity.

3. The beam delivery system of claim 1 , wherein the atomic object confinement apparatus is disposed within a vacuum chamber and the beam delivery system comprises one or more optical elements disposed within the vacuum chamber.

4. The beam delivery system of claim 1 , wherein the plurality of beam paths are defined lithographically.

5. The beam delivery system of claim 1 , wherein the plurality of waveguide outputs are located on a polished edge of the beam delivery photonic integrated circuit.

6. The beam delivery system of claim 1 , wherein each of the waveguide outputs are on one side of the beam delivery photonic integrated circuit and are parallel to each other.

7. The beam delivery system of claim 1 , wherein each of the plurality of waveguide outputs are at most 150 micrometers from the next closest of the plurality of waveguide outputs.

8. The beam delivery system of claim 1 , wherein the optical input is butt-coupled to an optical fiber providing an input beam.

9. The beam delivery system of claim 1 , wherein the atomic object confinement apparatus is disposed within a vacuum chamber and the beam delivery photonic integrated circuit is disposed within the vacuum chamber.

10. A beam delivery system comprising:

a beam delivery photonic integrated circuit comprising:

a first waveguide layer and a second waveguide layer;

the first waveguide layer comprising:

a first optical input;

a plurality of first waveguide outputs, wherein the plurality of first waveguide outputs are tapered;

a plurality of first beam paths, each first beam path connecting one of the plurality of first waveguide outputs to the first optical input,

wherein at least one of the plurality of waveguide outputs that is connected to a first optical input of the one or more optical inputs is directed to a photodetector configured to measure an intensity of the waveguide output directed to the photodetector, and

wherein each of the plurality of beam paths connected to the first optical input comprise a respective optical element configured to provide a respective beam having a respective power that is substantially constant by removing power fluctuations from the respective beam provided via a respective waveguide output of the plurality of waveguide outputs based on the intensity of the waveguide output directed to the photodetector,

the second waveguide layer comprising:

a second optical input;

a plurality of second waveguide outputs, wherein the plurality of second waveguide outputs are tapered;

a plurality of second beam paths, each second beam path connecting one of the plurality of second waveguide outputs to the second optical input;

wherein the beam delivery photonic integrated circuit is on a chip;

a telecentric optical relay assembly, the telecentric optical relay assembly configured to receive beams provided by at least one of the plurality of first waveguide outputs and at least one of the plurality of second waveguide outputs, and the telecentric optical relay assembly further configured to focus each received beam on a corresponding plurality of positions of an atomic object confinement apparatus in a telecentric manner.

11. The beam delivery system claim 10 , wherein the atomic object confinement apparatus is disposed within a vacuum chamber and the beam delivery system comprises one or more optical elements disposed within the vacuum chamber.

12. The beam delivery system claim 10 , wherein one or more of the plurality of first beam paths or the plurality of second beam paths comprises an optical element configured to tune a beam for at least one of frequency, phase, or intensity.

13. The beam delivery system claim 10 , wherein the plurality of first waveguide outputs and the plurality of second waveguide outputs are located on a polished edge of the beam delivery photonic integrated circuit.

14. The beam delivery system claim 10 , wherein each of the plurality of first waveguide outputs and the plurality of second waveguide outputs are on one side of the beam delivery photonic integrated circuit and are parallel to each other.

15. The beam delivery system claim 10 , wherein each of the plurality of first waveguide outputs are at most 150 micrometers from the next closest of the plurality of waveguide outputs.

16. The beam delivery system claim 10 , wherein at least one of the first waveguide layer or the second waveguide layer comprises a dielectric material.

17. A beam delivery system comprising:

a beam delivery photonic integrated circuit comprising:

a plurality of optical inputs;

a plurality of waveguide outputs, wherein each of the plurality of waveguide outputs is tapered,

a plurality of beam paths, each beam path connecting one of the plurality of waveguide outputs to one of the plurality of optical inputs,

wherein at least one of the plurality of waveguide outputs that is connected to a first optical input of the one or more optical inputs is directed to a photodetector configured to measure an intensity of the waveguide output directed to the photodetector,

wherein each of the plurality of beam paths connected to the first optical input comprises a respective optical element configured to provide a respective beam having a respective power that is substantially constant by removing power fluctuations from the respective beam provided via a respective waveguide output of the plurality of waveguide outputs based on the intensity of the waveguide output directed to the photodetector,

wherein the beam delivery photonic integrated circuit is on a chip;

wherein the respective beam is provided via the respective waveguide output to a respective position of an atomic object confinement apparatus, and

wherein the atomic object confinement apparatus and the beam delivery photonic integrated circuit are disposed within a vacuum chamber.

18. The beam delivery system of claim 17 , wherein one or more beam paths of the plurality of beam paths comprises a respective optical element configured to tune a respective beam for at least one of frequency, phase, or intensity.

19. The beam delivery system of claim 17 , wherein the atomic object confinement apparatus is disposed within a vacuum chamber and the beam delivery system comprises one or more optical elements disposed within the vacuum chamber.

20. The beam delivery system of claim 17 , wherein the plurality of beam paths are defined lithographically.