IP Library Granted Patent US 12,172,422
Granted Patent B2
US 12,172,422 · App. 17/317,190 · Granted Dec 24, 2024

Process for producing a molded thermoset composite part from unsaturated resin prepreg scrap

Inventors: Jonathan Mark McKay (Hilliard, OH); James William Emrick (Dublin, OH)
Assignee: INEOS COMPOSITIES IP, LLC
B32B5/26B29B17/0005B29B17/0412B29C43/003B29C43/02B29C70/00B29C70/0035B29C70/18B29C70/50B32B5/02B32B5/12C08J11/00C08J11/04B29C2043/5808B29C2043/5816B29C2793/00B29K2031/00B29K2101/10B29K2105/0872B29K2105/26B29K2307/04B29K2309/08C08J2367/06
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Quick Facts
Patent No.
US 12,172,422
App. No.
17/317,190
Granted
Dec 24, 2024
Kind
B2
Abstract

A process for preparing a composite part, the process comprising: recovering unsaturated resin prepreg scrap; combining the recovered unsaturated resin prepreg scrap with a second resinous thermosetting component; and co-molding the prepreg scrap and resinous thermosetting component together under a pressure of 25 to 4000 psi and at a temperature of 100-400° F.

Claims (22)

1. A composite part prepared by a process, the process comprising:

(i) recovering unsaturated resin prepreg scrap from an amount of unsaturated resin prepreg, wherein the unsaturated resin prepreg scrap is vinyl ester resin prepreg scrap, and further wherein the amount of unsaturated resin prepreg was prepared by a hot melt route or a solution route;

(ii) combining the recovered unsaturated resin prepreg scrap with a second resinous thermosetting component comprising an unsaturated resin, wherein the second resinous thermosetting component is unreinforced; and

(iii) co-molding the prepreg scrap and resinous thermosetting component together under a pressure of 25 to 4000 psi and at a temperature of 100-400° F., wherein chemical bonding occurs between the unsaturated resin prepreg scrap and the second resinous thermosetting component comprising an unsaturated resin, resulting in an increase in homogeneity and decrease in voids in the composite part compared to mechanical integration alone.

2. The composite part of claim 1 , wherein the unsaturated resin prepreg scrap contains a thermally-activated peroxide.

3. The composite part of claim 1 , wherein the unsaturated resin prepreg scrap is reinforced with carbon fiber.

4. The composite part of claim 1 , wherein the unsaturated resin prepreg scrap is reinforced with fiberglass.

5. The composite part of claim 1 , wherein the second resinous thermosetting component is sheet molding compound or bulk molding compound.

6. The composite part of claim 1 , wherein the co-molding is performed under a pressure of 25-4000 psi and at a temperature of 200-350° F.

7. The composite part of claim 1 , wherein the co-molding is performed under a pressure of 25-2000 psi and at a temperature of 250-350° F.

8. The composite part of claim 1 , wherein the co-molding is performed under a pressure of 500-4000 psi and at a temperature of 200-350° F.

9. A composite part prepared by a process, the process comprising:

(i) recovering unsaturated resin prepreg scrap wherein the unsaturated resin prepreg scrap contains a thermally-activated peroxide;

(ii) combining the recovered unsaturated resin prepreg scrap with a second resinous thermosetting component comprising an unsaturated resin; and

(iii) co-molding the prepreg scrap and resinous thermosetting component together under a pressure of 25 to 4000 psi and at a temperature of 100-400° F., wherein chemical bonding occurs between the unsaturated resin prepreg scrap and the second resinous thermosetting component comprising an unsaturated resin, resulting in an increase in homogeneity and decrease in voids in the composite part compared to mechanical integration alone.

10. The composite part of claim 9 , wherein the unsaturated resin prepreg scrap is reinforced with carbon fiber or with fiberglass.

11. The composite part of claim 9 , wherein the second resinous thermosetting component is sheet molding compound or bulk molding compound.

12. The composite part of claim 11 , wherein the sheet molding compound or bulk molding compound is reinforced with carbon fiber or with fiberglass.

13. The composite part of claim 9 , wherein the second resinous thermosetting component is unreinforced.

14. The composite part of claim 9 , wherein the co-molding is performed under a pressure of 25-4000 psi and at a temperature of 200-350° F.

15. The composite part of claim 9 , wherein the co-molding is performed under a pressure of 25-2000 psi and at a temperature of 250-350° F.

16. The composite part of claim 9 , wherein the co-molding is performed under a pressure of 500-4000 psi and at a temperature of 200-350° F.

Assignments (3)
SECURITY INTEREST Recorded Apr 1, 2025
From: INEOS COMPOSITES IP, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 070691/0328 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2021
From: MCKAY, JONATHAN MARK; EMRICK, JAMES WILLIAM
To: ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC
Reel/Frame 056203/0436 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2021
From: ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC
To: INEOS COMPOSITES IP, LLC
Reel/Frame 056207/0889 →
Continuity (3)
Continuation 16032365 · Jul 11, 2018
Provisional Application 62531241 · Jul 11, 2017
Related Publication 20210260792A1 · Aug 26, 2021