Semiconductor device active region profile and method of forming the same
Semiconductor device and the manufacturing method thereof are disclosed. An exemplary method of manufacture comprises receiving a substrate including a semiconductor material stack formed thereon, wherein the semiconductor material stack includes a first semiconductor layer of a first semiconductor material and second semiconductor layer of a second semiconductor material that is different than the first semiconductor material. Patterning the semiconductor material stack to form a trench. The patterning includes performing a first etch process with a first etchant for a first duration and then performing a second etch process with a second etchant for a second duration, where the second etchant is different from the first etchant and the second duration is greater than the first duration. The first etch process and the second etch process are repeated a number of times. Then epitaxially growing a third semiconductor layer of the first semiconductor material on a sidewall of the trench.
1. A method comprising:
receiving a substrate including a semiconductor material stack formed thereon, wherein the semiconductor material stack includes a first semiconductor layer of a first semiconductor material and second semiconductor layer of a second semiconductor material that is different than the first semiconductor material;
patterning the semiconductor material stack to form a trench, wherein the patterning includes:
performing a first etch process with a first etchant and a first etch duration;
performing a second etch process with a second etchant and a second etch duration, wherein the second etchant is different from the first etchant and the second etch duration is greater than the first etch duration;
repeating the first etch process and the second etch process a predetermined number of times; and
epitaxially growing a third semiconductor layer of the first semiconductor material on a sidewall of the trench.
2. The method of claim 1 , wherein the first etchant includes a chlorine-containing chemical.
3. The method of claim 1 , wherein the second etchant includes a fluorine-containing chemical.
4. The method of claim 1 , wherein the second etch duration is between about 1.3 to about 1.6 times greater than the first etch duration.
5. The method of claim 1 , further comprising performing a flush process after the performing the second etch process.
6. The method of claim 5 , wherein the flush process includes SO 2 /O 2 .
7. The method of claim 1 , further comprises:
decreasing the first etch duration each time the first etch process is repeated; and
increasing the second etch duration each time the second etch process is repeated.
8. A method comprising:
providing a semiconductor layer stack over a substrate, the semiconductor layer stack including a first semiconductor material layer and a second semiconductor material layer in an interleaving fashion;
etching the semiconductor layer stack as part of a first etching process;
etching the semiconductor layer stack as part of a second etching process, wherein the second etching process has a lateral etch rate greater than that of the first etching process, and
wherein the second etching process is longer than the first etching process; and
repeating the first etching process and the second etching process;
epitaxially growing a third semiconductor layer on a sidewall of the semiconductor layer stack; and
forming a dielectric fin adjacent the third semiconductor layer.
9. The method of claim 8 , wherein the first etching process includes a chlorine-containing etchant.
10. The method of claim 8 , wherein the second etching process includes a fluorine-containing etchant.
11. The method of claim 8 , wherein the second etching process is between about 1.3 to about 1.6 times longer than the first etching process.
12. The method of claim 8 , further comprising:
flushing a byproduct from the semiconductor layer stack after etching the semiconductor layer stack as part of the second etching process; and
repeating the flushing after each repetition of the second etching process.
13. The method of claim 12 , wherein the flushing of the byproduct includes using SO 2 /O 2 for the flushing.
14. The method of claim 8 , wherein the first etching process and the second etching process are repeated 4 to 6 times.
15. A semiconductor structure, comprising:
a substrate;
a plurality of channels of a semiconductor material vertically stacked on the substrate;
a gate stack disposed on the plurality of channels and extended to wrap around each of the plurality of channels, wherein the gate stack includes a gate dielectric layer and a gate electrode, wherein the plurality of channels span dimensions different from each other such that each one of the plurality of channels spans a dimension greater than that of any one of the plurality of channels below; and
a dielectric fin disposed adjacent the plurality of channels of the semiconductor material, wherein the dielectric fin includes a top portion having a high-k dielectric and a bottom portion having a dielectric fill layer.
16. The semiconductor structure of claim 15 , further comprising a shallow trench isolation structure disposed under the dielectric fin.
17. The semiconductor structure of claim 15 , wherein a first distance in a first direction of the top portion of the dielectric fin is less than a second distance in the first direction of the bottom portion of the dielectric fin.
18. The semiconductor structure of claim 15 , wherein the plurality of channels of the semiconductor material include Si.
19. The semiconductor structure of claim 15 , wherein a topmost channel of the plurality of channels of the semiconductor channels spans about 24 nm.
20. The semiconductor structure of claim 15 , further comprising a dielectric liner surrounding side surfaces of the dielectric fin.