Polyamide formulations for improved noise vibration and harshness
Provided herein are polyamide compositions including one or more semi-crystalline polyamides and either an amorphous polyamide or a semi-crystalline copolyamide such as PA66/6. The provided compositions are particularly useful as vibration isolators more effective at high-temperature noise and harshness damping than conventional polyamide compositions. Also provided are methods for making the provided compositions, and articles that include the provided compositions.
1. A composition comprising:
one or more amorphous polyamides;
one or more semi-crystalline polyamides; and
an additive;
wherein the difference between the heat distortion temperature and melting temperature of the composition is less than 45° C.;
wherein the composition exhibits a maximum viscoelastic loss factor (tan(δ)) at a temperature greater than 40° C. when the composition has a moisture content less than or equal to 0.2 wt %; and
wherein the maximum tan(δ) has a value ranging from 0.057 to 0.245 when the composition has a moisture content less than 0.2 wt %;
wherein the composition is free of non-polyamide polymers, flow enhancers, and flow aids.
2. The composition of claim 1 , wherein the combined concentration of the one or more amorphous polyamides in the composition ranges from 3 wt % to 65 wt %.
3. The composition of claim 1 , wherein the combined concentration of the one or more semi-crystalline polyamides in the composition ranges from 10 wt % to 70 wt %.
4. The composition of claim 1 , wherein the one or more semi-crystalline polyamides comprise one or more PA66 polyamides.
5. The composition of claim 1 , wherein the one or more semi-crystalline polyamides comprises PA66/6C.
6. The composition of claim 1 , wherein the composition demonstrates a tensile modulus greater than 9.5 GPa, and wherein the composition exhibits a maximum viscoelastic loss factor (tan(δ)) at a temperature greater than 42° C. when the composition has a moisture content less than 0.2 wt %.
7. The composition of claim 1 , wherein the composition demonstrates a tensile modulus greater than 9.5 GPa and the heat distortion temperature is greater than 185° C.
8. The composition of claim 1 , wherein the one or more amorphous polyamides comprises polyamide blends of MPMD-T and MPMD-I.
9. The composition of claim 1 , comprising:
from 20 wt % to 55 wt % semi-crystalline PA66 polyamide;
from 0 to 11 wt % semi-crystalline PA6 polyamide;
from 10 wt % to 70 wt % polyamide blends with MPMD-T/MPMD-I
from 15 wt % to 60 wt % glass fiber;
from 0.1 wt % to 2 wt % stearate;
from 0.1 wt % to 2 wt % heat stabilizer;
from 0 to 6 wt % colorant; and
a moisture content less than 0.2 wt %.
10. The composition of claim 1 , comprising:
from 10 wt % to 70 wt % semi-crystalline PA66/6C;
from 0 to 11 wt % semi-crystalline PA6 polyamide;
from 10 wt % to 70 wt % amorphous polyamide;
from 15 wt % to 60 wt % glass fiber;
from 0.1 wt % to 2 wt % stearate;
from 0.1 wt % to 2 wt % heat stabilizer;
from 0 to 6 wt % colorant; and
a moisture content less than 0.2 wt %.
11. A composition comprising:
from 1 wt % to 50 wt % of a semi-crystalline PA66/6 (co) polyamide;
from 30 wt % to 80 wt % of a material selected from the list consisting of a second semi-crystalline polyamide and an amorphous polyamide; and
an additive;
wherein the difference between the heat distortion temperature and melting temperature of the composition is less than 45° C.;
wherein the composition exhibits a maximum viscoelastic loss factor (tan(δ)) at a temperature greater than 40° C. when the composition has a moisture content less than or equal to 0.2 wt %; and
wherein the maximum tan(δ) has a value ranging from 0.057 to 0.245 when the composition has a moisture content less than 0.2 wt %;
wherein the composition is free of non-polyamide polymers, flow enhancers, and flow aids.
12. A composition comprising:
a high T g polymer with a T g from 100° C. to 200° C.,
a low T g polymer with a T g from 0° C. to 160° C., and
an additive;
wherein the difference between the heat distortion temperature and melting temperature of the composition is less than 45° C.;
wherein the composition exhibits a maximum viscoelastic loss factor (tan(δ)) at a temperature greater than 40° C. when the composition has a moisture content less than or equal to 0.2 wt %; and
wherein the maximum tan(δ) has a value ranging from 0.057 to 0.245 when the composition has a moisture content less than 0.2 wt %;
wherein the composition is free of non-polyamide polymers, flow enhancers, and flow aids.
13. A connecting part, the part comprising:
a part body for contacting a first component; and
a part tab for contacting a second component to connect the first and second components,
wherein at least one of the part body and the part tab comprise a composition comprising:
one or more amorphous polyamides;
one or more semi-crystalline polyamides; and
an additive;
wherein the difference between the heat distortion temperature and melting temperature of the composition is less than 45° C.;
wherein the composition exhibits a maximum viscoelastic loss factor (tan(δ)) at a temperature greater than 40° C. when the composition has a moisture content less than or equal to 0.2 wt %; and
wherein the maximum tan(δ) has a value ranging from 0.057 to 0.245 when the composition has a moisture content less than 0.2 wt %;
wherein the composition is free of non-polyamide polymers, flow enhancers, and flow aids.
14. The connecting part of claim 13 , further comprising a structural support piece.
15. The connecting part of claim 13 , wherein the part is an engine mount, a differential mount, a torque rod, and HVAC compressor bracket, a strut mount, a shock absorber mount, or a transmission mount, or a combination thereof.
16. A connecting part, the part comprising:
a part body for contacting a first component; and
a part tab for contacting a second component to connect the first and second components,
wherein at least one of the part body and the part tab comprise a composition comprising:
from 1 wt % to 50 wt % of a semi-crystalline PA66/6 (co) polyamide;
from 30 wt % to 80 wt % of a material selected from the list consisting of a second semi-crystalline polyamide and an amorphous polyamide; and
an additive;
wherein the difference between the heat distortion temperature and melting temperature of the composition is less than 45° C.;
wherein the composition exhibits a maximum viscoelastic loss factor (tan(δ)) at a temperature greater than 40° C. when the composition has a moisture content less than or equal to 0.2 wt %; and
wherein the maximum tan(δ) has a value ranging from 0.057 to 0.245 when the composition has a moisture content less than 0.2 wt %;
wherein the composition is free of non-polyamide polymers, flow enhancers, and flow aids.
17. A process for connecting a first component to a second component, the process comprising:
providing a connecting part comprising a part body and a part tab;
contacting the part body with the first component; and
contacting the part tab with the second component to connect first and second components,
wherein the difference between the heat distortion temperature and melting temperature of the part is less than 45° C.;
wherein the part comprises an additive;
wherein the part exhibits a maximum viscoelastic loss factor (tan(δ)) at a temperature greater than 40° C. when the part has a moisture content less than or equal to 0.2 wt %; and
wherein the maximum tan(δ) has a value ranging from 0.057 to 0.245 when the part has a moisture content less than 0.2 wt %;
wherein the part is free of non-polyamide polymers, flow enhancers, and flow aids.
18. The process of claim 17 , wherein the connecting part is an engine mount, the first component is an engine, and the second component is a chassis.