Slotted vias for circuit boards
A circuit board may include a traditional via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board and a slotted via formed within the circuit board proximate to the traditional via, the slotted via comprising an opening through a first surface and a second surface of the circuit board and a layer of conductive material formed on interior walls of the opening.
1. A circuit board, comprising:
a traditional via, including a circular upper surface, electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board; and
a slotted via formed within the circuit board proximate, but not connected, to the traditional via, the slotted via comprising:
a C-shaped opening through a first surface and a second surface of the circuit board; and
a layer of conductive material formed on interior walls of the opening;
wherein the C-shaped opening of the slotted via and the circular upper surface of the traditional via are concentric and wherein the C-shaped opening provides at least partial electromagnetic shielding of the traditional via.
2. The circuit board of claim 1 , further comprising a second slotted via formed within the circuit board proximate to the traditional via, the second slotted via comprising:
a second C-shaped opening through the first surface and the second surface; and
a second layer of conductive material formed on interior walls of the second opening, wherein the second C-shaped opening of the second slotted via, the C-shaped opening of the first slotted via, and the circular upper surface of the traditional via are concentric.
3. The circuit board of claim 2 , wherein the first and second C-shaped openings are symmetrically positioned on opposing sides of the circular traditional via.
4. The circuit board of claim 1 , further comprising:
a second traditional via; and
a second slotted via formed within the circuit board proximate to the second traditional via, the second slotted via comprising:
a second C-shaped opening through the first surface and the second surface; and
a second layer of conductive material formed on interior walls of the second opening;
wherein the second C-shaped opening of the second slotted via and the second traditional via are concentric.
5. The circuit board of claim 1 , wherein the layer of conductive material is electrically coupled to a reference plane of a layer of the circuit board.
6. The circuit board of claim 5 , wherein the reference plane carries a ground voltage.
7. The circuit board of claim 5 , wherein the reference plane carries a rail voltage.
8. The circuit board of claim 1 , wherein the C-shaped opening defines an inner arc and an outer arc and wherein inner arc, the outer arc, and the circular upper surface of the traditional via are concentric.
9. A method, comprising:
electrically coupling a traditional via to a first layer of a circuit board and to a second layer of the circuit board; and
forming a slotted via within the circuit board proximate, but not connected, to the traditional via, the slotted via comprising:
a C-shaped opening through a first surface and a second surface of the circuit board; and
a layer of conductive material formed on interior walls of the opening;
wherein the C-shaped opening of the slotted via and the circular upper surface of the traditional via are concentric and wherein the C-shaped opening provides at least partial electromagnetic shielding of the traditional via.
10. The method of claim 9 , further comprising forming a second slotted via within the circuit board proximate to the traditional via, the second slotted via comprising:
a second C-shaped opening through the first surface and the second surface; and
a second layer of conductive material formed on interior walls of the second opening, wherein the second C-shaped opening of the second slotted via, the C-shaped opening of the first slotted via, and the circular upper surface of the traditional via are concentric.
11. The method of claim 9 , further comprising:
forming a second traditional via in the circuit board; and
forming a second slotted via within the circuit board proximate to the second traditional via, the second slotted via comprising:
a second C-shaped opening through the first surface and the second surface; and
a second layer of conductive material formed on interior walls of the second opening;
wherein the second C-shaped opening of the second slotted via and the second traditional via are concentric.
12. The method of claim 9 , further comprising electrically coupling the layer of conductive material to a reference plane of a layer of the circuit board.
13. The method of claim 12 , wherein the reference plane carries a ground voltage.
14. The method of claim 12 , wherein the reference plane carries a rail voltage.
15. An information handling system comprising:
an enclosure; and
a circuit board housed in the enclosure, the circuit board comprising:
a traditional via, including a circular upper surface, electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board; and
a slotted via formed within the circuit board proximate, but not connected, to the traditional via, the slotted via comprising:
a C-shaped opening through a first surface and a second surface of the circuit board; and
a layer of conductive material formed on interior walls of the opening;
wherein the C-shaped opening of the slotted via and the circular upper surface of the traditional via are concentric and wherein the C-shaped opening provides at least partial electromagnetic shielding of the traditional via.
16. The information handling system of claim 15 , further comprising a second slotted via formed within the circuit board proximate to the traditional via, the second slotted via comprising:
a second C-shaped opening through the first surface and the second surface; and
a second layer of conductive material formed on interior walls of the second opening, wherein the second C-shaped opening of the second slotted via, the C-shaped opening of the first slotted via, and the circular upper surface of the traditional via are concentric.
17. The information handling system of claim 15 , further comprising:
a second traditional via; and
a second slotted via formed within the circuit board proximate to the second traditional via, the second slotted via comprising:
a second C-shaped opening through the first surface and the second surface; and
a second layer of conductive material formed on interior walls of the second opening;
wherein the second C-shaped opening of the second slotted via and the second traditional via are concentric.
18. The information handling system of claim 15 , wherein the layer of conductive material is electrically coupled to a reference plane of a layer of the circuit board.
19. The information handling system of claim 18 , wherein the reference plane carries a ground voltage.
20. The information handling system of claim 18 , wherein the reference plane carries a rail voltage.