IP Library Granted Patent US 12,247,113
Granted Patent B2
US 12,247,113 · App. 17/321,599 · Granted Mar 11, 2025

High strength, silane-modified polymer adhesive composition

Inventors: Christopher Verosky (Coventry, CT); Matthias Kohl (Heidelberg, DE)
Assignee: Henkel AG & Co. KGaA
C08K3/22C08K5/544C09J151/003C08K3/36C08K9/06
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Quick Facts
Patent No.
US 12,247,113
App. No.
17/321,599
Granted
Mar 11, 2025
Kind
B2
Abstract

Disclosed is a moisture curable adhesive composition comprising at least one silane-modified polymer, a filler comprising a surface modified fumed silica and one of a surface modified cristobalite and a silica; and optionally, at least one of an aminosilane adhesion promotor, an organotin catalyst, a dehydration shelf life enhancer, a light stabilizer, titanium dioxide, a rheology modifier, and mixtures thereof. The adhesive composition finds special use in bonding metal substrates to each other with significantly higher bond strength than that provided by silane-modified polymer adhesives alone.

Claims (40)

1. A high strength, moisture curable adhesive composition comprising:

a silane-modified poly(meth) acrylate polymer component;

a first filler comprising a surface modified fumed silica;

a second filler selected from surface modified cristobalite and surface modified quartz;

a catalyst selected from the group consisting of bismuth compounds, organotin compounds, tertiary amines, zirconium complexes, aluminum chelates, organometallic compounds based on Zn, Co, Ni, and Fe, and combinations thereof; and

optionally an additive selected from the group consisting of adhesion promotor, moisture scavenger, light stabilizer, further filler, rheology modifier, colorant and mixtures thereof.

2. The high strength, moisture curable adhesive composition of claim 1 , wherein the silane-modified polymer component further comprises a silane modified polymer selected from the group consisting of silane-modified polyether polymer, silane-modified polyurethane polymer and mixtures thereof.

3. The high strength, moisture curable adhesive composition of claim 1 , wherein the silane-modified polymer component comprises both the silane-modified poly(meth) acrylate polymer and a silane-modified polyether polymer.

4. The high strength, moisture curable adhesive composition of claim 1 , wherein the silane-modified polymer component comprises both poly(meth) acrylate and polyether moieties.

5. The high strength, moisture curable adhesive composition of claim 1 , wherein said at least one silane-modified polymer is present in an amount of up to 60% by weight based on the total weight of the adhesive composition.

6. The high strength, moisture curable adhesive composition of claim 1 , wherein said first filler is present in an amount of from 10 to 20% by weight and said second filler is present in an amount of from 15 to 25% by weight, each based on the total weight of the adhesive composition.

7. The high strength, moisture curable adhesive composition of claim 1 , wherein said composition comprises 0.05 to 0.50% by weight of an organotin catalyst based on the total weight of the adhesive composition.

8. The high strength, moisture curable adhesive composition of claim 1 , wherein said composition comprises from 1 to 4% by weight of an aminosilane adhesion promotor based on the total weight of the adhesive composition.

9. The high strength, moisture curable adhesive composition of claim 1 , wherein said composition comprises from 1 to 5% by weight of a moisture scavenger based on the total weight of the adhesive composition.

10. The high strength, moisture curable adhesive composition of claim 1 , wherein said composition comprises from 1 to 3% by weight of a light stabilizer based on the total weight of the adhesive composition.

11. The high strength, moisture curable adhesive composition of claim 1 , wherein said composition comprises from 3 to 6% by weight of titanium dioxide based on the total weight of the adhesive composition as the further filler.

12. The high strength, moisture curable adhesive composition of claim 1 , wherein the composition comprises from 15% to 25% by weight of the surface modified cristobalite based on the total weight of the adhesive composition.

13. The high strength, moisture curable adhesive composition of claim 1 , wherein the composition is a one component composition.

14. The high strength, moisture curable adhesive composition of claim 1 , wherein the composition is a two-component curable adhesive composition, the two-component comprising:

a first part including the silane-modified polymer component;

a second part maintained separately from the first part, the second part including water;

the first filler present in the first part, the second part or both;

the second filler present in the first part, the second part or both; and

the additive optionally present in the first part, the second part or both.

15. Cured reaction products of the high strength, moisture curable adhesive composition of claim 1 .

16. An article comprising the high strength, moisture curable adhesive composition of claim 1 .

17. An article comprising cured reaction products of the high strength, moisture curable adhesive composition of claim 1 .

18. The high strength, moisture curable adhesive composition of claim 1 , wherein the composition is free of clay.

19. A high strength, moisture curable adhesive composition comprising:

a silane-modified poly(meth) acrylate polymer component;

a first filler comprising a surface modified fumed silica;

a second filler selected from surface modified cristobalite and surface modified quartz; and

optionally an additive;

wherein the composition is free of clay.

20. A high strength, moisture curable adhesive composition comprising:

up to 60 wt. % of a silane-modified polymer component;

10 to 20 wt. % of a first filler comprising a surface modified fumed silica;

15 to 25 wt. % of a second filler selected from surface modified cristobalite and surface modified quartz; and

optionally an additive;

wherein the composition is free of clay.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2025
From: KOHL, MATTHIAS
To: HENKEL AG & CO. KGAA
Reel/Frame 069879/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2025
From: VEROSKY, CHRISTOPHER
To: HENKEL IP & HOLDING GMBH
Reel/Frame 069879/0485 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059207/0627 →
Continuity (3)
Continuation PCTUS2019065390 · Dec 10, 2019
Provisional Application 62779083 · Dec 13, 2018
Related Publication 20210269685A1 · Sep 2, 2021
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