IP Library Granted Patent US 11,477,911
Granted Patent B1
US 11,477,911 · App. 17/324,342 · Granted Oct 18, 2022

Heat pipe tapered down in fin stack region and oppositely tapered fin stack

Inventor: Qinghong He (Austin, TX)
Assignee: Dell Products L.P.
H05K7/20154G06F1/206H05K7/20336H01L23/4275
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Quick Facts
Patent No.
US 11,477,911
App. No.
17/324,342
Granted
Oct 18, 2022
Kind
B1
Abstract

A thermal module with a heat pipe configured on a first portion having a constant cross-section thickness and a tapered second end configured for contact with a fin stack. The heat pipe is tapered along a length of the second portion such that the cross-section thickness of the heat pipe decreases toward the end of the heat pipe. A fin stack coupled to the tapered portion comprises a plurality of fins of different heights, wherein the fin heights increase such that the combined fin height and heat pipe cross-section thickness remains approximately constant over the width of the fin stack. The tapered heat pipe and fin stack with fins with increasing fin heights provide increased cooling and decreased airflow impedance through the fin stack.

Claims (36)

1. A thermal module for use in a chassis for an information handling system, the thermal module comprising:

a fan for generating an airflow out a fan outlet in the direction of a vent;

a heat pipe comprising a first portion with a cross-section thickness configured for receiving heat from a set of components and a tapered second portion, wherein a cross-section thickness of the tapered second portion decreases from a first heat pipe cross-section thickness to a second heat pipe cross-section thickness along a length of the tapered second portion; and

a fin stack comprising a plurality of fins distributed over a width of the fin stack, wherein

each fin has a first end configured for contact with the tapered second portion of the heat pipe;

each fin has a fin height based on the position of the fin relative to the width of the fin stack;

a combined heat pipe cross-section thickness and fin height is approximately constant over the width of the fin stack, wherein the combined heat pipe cross-section thickness and fin height at each fin across the width of the fin stack is equal to a height of the fan outlet; and

the tapered second portion of the heat pipe and the fin stack are positioned near the fan outlet.

2. The thermal module of claim 1 , wherein the length of the tapered second portion of the heat pipe is substantially equal to the width of the fin stack.

3. The thermal module of claim 1 , wherein the fin height is based on the position of the fin in the fin stack.

4. The thermal module of claim 1 , wherein the fan outlet comprises a variable fan outlet height, wherein the combined heat pipe cross-section thickness and fin height at each fin across the width of the fin is equal to the variable fan outlet height.

5. The thermal module of claim 1 , wherein the tapered second portion of the heat pipe and the fin stack are positioned between the fan outlet and the vent.

6. A method of manufacturing a thermal module for use in a chassis for an information handling system, the method comprising:

forming a heat pipe with a first portion with a constant cross-section thickness and a second portion having a tapered cross-section, wherein a cross-section thickness of the second portion decreases from a first heat pipe cross-section thickness to a second heat pipe cross-section thickness along a length of the second portion; and

forming a fin stack comprising:

forming a plurality of fins with a first end configured for contact with the second portion of the heat pipe;

distributing the plurality of fins over a width of the fin stack; and

configuring the plurality of fins such that a combined fin height and heat pipe cross-section thickness is equal to a height of the fin stack over the width of the fin stack.

7. The method of claim 6 , wherein forming the heat pipe comprises compressing the second portion of the heat pipe.

8. The method of claim 6 , wherein forming the fin stack comprises:

forming each fin with a first end having an angle complementary to the tapered second portion of the heat pipe;

coupling the first end of each fin to the first end of an adjacent fin; and

cutting a second end of the plurality of fins such that the combined fin height and heat pipe cross-section thickness is constant over the width of the fin stack.

9. A chassis comprising:

a set of components;

a heat pipe comprising a first portion configured for receiving heat from the set of components and a tapered second portion, wherein a cross-section thickness of the tapered second portion decreases from a first heat pipe cross-section thickness to a second heat pipe cross-section thickness along a length of the heat pipe; and

a fin stack comprising a plurality of fins distributed over a width of the fin stack, wherein

each fin has an edge configured for contact with the tapered second portion of the heat pipe;

each fin has a fin height based on the position of the fin relative to the width of the fin stack; and

a combined heat pipe cross-section thickness and fin height is equal to a height of the fin stack over the width of the fin stack; and

a fan for generating an airflow out a fan outlet in the direction of a vent, wherein the fin stack is positioned near the fan outlet.

10. The chassis of claim 9 , wherein the width of the fin stack is substantially equal to the tapered second portion of the heat pipe.

11. The chassis of claim 9 , wherein the fin height is based on the position of the fin relative to the width of the fin stack.

12. The chassis of claim 9 , wherein the combined heat pipe cross-section thickness and fin height is equal to a height of the fan outlet.

13. The chassis of claim 9 , wherein the fan outlet comprises a variable fan outlet height, wherein the combined heat pipe cross-section thickness and fin height at each fin across the width of the fin is equal to the variable fan outlet height.

14. The chassis of claim 9 , wherein the tapered second portion of the heat pipe and the fin stack are positioned between the fan outlet and the vent.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (058014/0560) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0473 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057931/0392) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0382 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057758/0286) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 061654/0064 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 058014/0560 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057758/0286 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057931/0392 →
SECURITY AGREEMENT Recorded Oct 1, 2021
From: DELL PRODUCTS, L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 057682/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2021
From: HE, QINGHONG
To: DELL PRODUCTS L.P.
Reel/Frame 056286/0226 →
Cited By (3)
US 12,346,176 US 12,575,055 US 12,690,157