Smart ring and methods for manufacturing

1. A method for fabricating a smart ring comprising:

receiving a printed circuit board having a plurality of components including a processor, a memory, a temperature sensor, a wireless transceiver, and a perturbation sensor;

receiving a power source characterized by a first radius of curvature within a range of 9 mm to 13 mm;

coupling the printed circuit board and the power source together to form a first assembly characterized by the first radius of curvature;

encapsulating at least a first portion of the first assembly to form a flexible second assembly, wherein a flexibility of the flexible second assembly enables the flexible second assembly to be compatible with a plurality of fixed band sizes, each fixed band size corresponding to a respective ring size within a first range of ring sizes spanning a plurality of ring sizes, wherein the flexible second assembly includes a plurality of physical anchors; and

coupling a rigid band associated with a first fixed band size of the plurality of fixed band sizes to the flexible second assembly via the plurality of physical anchors to form an enclosed circle-like shape that permanently fixes the smart ring to a rigid, non-adjustable ring size included within the plurality of ring sizes, the non-adjustable ring size corresponding to the first fixed band size.

2. The method of claim 1 wherein encapsulating the first portion of the first assembly comprises:

receiving an upper enclosure and a lower enclosure;

disposing the first assembly between the upper enclosure and the lower enclosure;

coupling the upper enclosure to the lower enclosure; and

wherein the upper enclosure and the lower enclosure together form an interior region for the first assembly;

wherein the upper enclosure comprises a material that inhibits bending of the first assembly.

3. The method of claim 2 wherein receiving the upper enclosure and the lower enclosure comprises:

receiving the upper enclosure, wherein the upper enclosure is characterized by an outer radius of curvature that is compatible with a plurality of ranges of ring sizes, including at least the first range of ring sizes spanning the plurality of ring sizes and a second range of ring sizes spanning a different plurality of ring sizes; and

selecting a first lower enclosure from a set of lower enclosures based at least in part on the non-adjustable ring size being included within the plurality of ring sizes, the set of lower enclosures including at least the first lower enclosure associated with the first range of ring sizes and a second lower associated with the second range of ring sizes.

4. The method of claim 1 wherein encapsulating the first portion of the first assembly comprises:

disposing the first assembly within a mold; and

injecting a material within the mold.

5. The method of claim 1 wherein coupling the rigid band to the flexible second assembly comprises:

disposing the flexible second assembly within a mold; and

injecting a material within the mold to thereby overmold the material over the plurality of physical anchors and to form the rigid band, wherein the material is selected from a group consisting of: silicone material, rubber, plastic, and epoxy.

6. The method of claim 1 wherein coupling the rigid band to the flexible second assembly comprises:

receiving a pre-formed band associated with the non-adjustable ring size; and

coupling the band to the flexible second assembly via the plurality of physical anchors.

7. The method of claim 1 further comprising:

receiving a bare printed circuit board;

disposing the plurality of components upon the bare printed circuit board; and

disposing an encapsulant above the plurality of components.

8. The method of claim 1 wherein the wireless transceiver is selected from a group consisting of: Bluetooth, Bluetooth Low Energy (BLE), ZigBee, ultrawide band (UWB), radio frequency (RF), laser, optical, and near field communication (NFC).

9. The method of claim 1 :

wherein encapsulating the first portion of the first assembly further comprises inhibiting encapsulating a second portion of the first assembly;

wherein the second portion is selected from a group consisting of: metal electrodes, light input/output guides or pipes, metallic sensors, ceramic sensors, capacitive sensors, and infrared sensors and imaging sensors.

10. The method of claim 1 wherein the rigid band comprises a plurality of anchor points configured to be coupled to the plurality of physical anchors.

11. A smart ring comprising:

a first assembly characterized by a rigid, non-adjustable ring size included within a plurality of ring sizes, the non-adjustable ring size corresponding to a first fixed band size of a plurality of fixed band sizes, wherein each fixed band size corresponds to a respective ring size within the plurality of ring sizes, wherein the non-adjustable ring size is permanently fixed to the non-adjustable ring size in response to coupling a rigid band associated with the first fixed band size to a flexible second assembly via a plurality of physical anchors to form an enclosed circle-like shape, the first assembly comprising:

the flexible second assembly characterized by an inner radius of curvature within a range of 9 mm to 13 mm, wherein a flexibility of the flexible second assembly enables the flexible second assembly to be compatible with each fixed band size of the plurality of fixed band sizes, the flexible second assembly comprising:

a printed circuit board having a plurality of components including a processor, a memory, a temperature sensor, a wireless transceiver and a perturbation sensor;

a power source;

a plurality of interconnects coupled between the printed circuit board and the power source;

an encapsulating material disposed about at least a first portion of the flexible second assembly;

the plurality of physical anchors; and

the rigid band coupled to the first assembly via the plurality of physical anchors forming the enclosed circle-like shape that permanently fixes the smart ring to the rigid, non-adjustable ring size included within the plurality of ring sizes.

12. The smart ring of claim 11 :

wherein the encapsulating material comprises an upper enclosure and a lower enclosure that are coupled to form an interior region where the first portion of the flexible second assembly is disposed;

wherein the upper enclosure comprises a material that inhibits bending of the first assembly.

13. The smart ring of claim 12 :

wherein the upper enclosure is characterized by an outer radius of curvature that is compatible with a plurality of ranges of ring sizes, including at least a first range of ring sizes spanning the plurality of ring sizes and a second range of ring sizes spanning a different plurality of ring sizes;

wherein the lower enclosure comprises a first lower enclosure selected from a set of lower enclosures, the set of lower enclosures including at least the first lower enclosure associated with the first range of ring sizes and a second lower associated with the second range of ring sizes.

14. The smart ring of claim 12 :

wherein the rigid band comprises a material over molded upon the plurality of physical anchors;

wherein the material is selected from a group consisting of: silicone material, rubber, plastic, and epoxy.

15. The smart ring of claim 11 :

wherein the rigid band is pre-formed and comprises a plurality of anchoring regions;

wherein the plurality of physical anchors are configured to be physically coupled to and decoupled from the plurality of anchoring regions.

16. The smart ring of claim 11 wherein the wireless transceiver is selected from a group consisting of: Bluetooth, Bluetooth Low Energy (BLE), ZigBee, ultrawide band (UWB), radio frequency (RF), laser, optical and near field communication (NFC).

17. The smart ring of claim 11 wherein the encapsulating material is not disposed upon a second portion of the flexible second assembly.

18. The smart ring of claim 17 further comprising:

one or more light-emitting diodes (LEDs);

wherein the second portion is coupled to components selected from a group consisting of: the temperature sensor, the power source and the one or more LEDs.

19. The smart ring of claim 17 wherein the second portion is selected from a group consisting of: metal electrodes, light input/output guides or pipes, metallic sensors, ceramic sensors, capacitive sensors, infrared sensors, fingerprint sensors, ultrasonic sensors, and imaging sensors.

20. The smart ring of claim 11 wherein the encapsulating material is transparent.