Thermal module with a hyperbaric fan system for cooling multiple fin stacks and components in a sealed chassis
A thermal module for cooling a plurality of component and cooling a bottom cover of a sealed chassis. A pair of fans are positioned in the chassis, wherein each fan has a first fan outlet directing a first portion of the airflow toward a first fin stack near a vent in the back cover, a second fan outlet for directing a second portion of the airflow to a second fin stack near a vent in a side cover, and a third fan outlet for directing a third portion of the airflow to a set of components in the chassis or a surface of the chassis. The size of each fan outlet and the size and impedance of the first fin stack and the second fin stack are configured to ensure the airflow is distributed according to a ratio based on cooling a set of components in the chassis and a bottom cover of the chassis.
1. A thermal module for cooling a sealed chassis for an information handling system, the thermal module comprising:
at least one fan comprising:
a fan housing for a fan motor and a plurality of fan blades, the fan housing having an intake for drawing airflow into the fan and a plurality of fan outlets for directing the airflow out of the fan housing, wherein:
a fan-body ratio defined as a ratio of a first dimension comprising a diameter of the plurality of fan blades relative to a second dimension comprising one of a width of the fan housing or a length of the fan housing is at least 80%;
a first fan outlet is configured to direct a first portion of the airflow to a first fin stack with a first impedance toward a rear cover vent on the chassis to an ambient environment;
a second fan outlet is configured to direct a second portion of the airflow to a second fin stack with a second impedance toward a side cover vent on the chassis to the ambient environment; and
a third fan outlet is configured to direct a third portion of the airflow toward a plurality of components inside the chassis, wherein the first fan outlet, the first fin stack, the second fan outlet, the second fin stack and the third fan outlet are configured to distribute the first portion of the airflow, the second portion of the airflow and the third portion of the airflow according to a ratio, wherein the second portion of the airflow is less than the first portion of the airflow and the third portion of the airflow.
2. The thermal module of claim 1 , wherein the first portion of the airflow has a first flow rate, the second portion of the airflow has a second flow rate portion of the airflow has a third flow rate, wherein the second flow rate is less than the first flow rate and the third flow rate.
3. The thermal module of claim 1 , wherein:
the ratio comprises the first portion of the airflow between 30-40% of the airflow and the third portion of the airflow between 30-40% of the airflow, wherein the second portion of the airflow comprises a remaining percentage of the airflow.
4. The thermal module of claim 2 , wherein:
the ratio comprises the first portion of the airflow between 35-40% and the third portion of the airflow between 25-45%, wherein the second portion of the airflow comprises a remaining percentage of the airflow.
5. The thermal module of claim 1 , wherein at least a portion of the fan housing is curvilinear.
6. The thermal module of claim 5 , wherein the fan-body ratio is greater than 85%.
7. A chassis for an information handling system, the chassis comprising:
a bottom cover;
at least two side covers;
a top cover;
a plurality of components located in the chassis;
a gasket positioned in the chassis and configured to seal the chassis; and
a thermal module comprising:
at least one fan comprising:
a fan housing for a fan motor and a plurality of fan blades, the fan housing having an intake open to a bottom cover of the chassis for drawing airflow into the fan and a plurality of fan outlets for directing the airflow out of the fan housing, wherein:
a fan-body ratio defined as a ratio of a first dimension comprising a diameter of the plurality of fan blades relative to a second dimension comprising one of a width of the fan housing or a length of the fan housing is at least 80%;
a first fan outlet is configured to direct a first portion of an airflow to a first fin stack with a first impedance toward a back cover vent on the chassis to an ambient environment;
a second fan outlet is configured to direct a second portion of the airflow to the second fin stack with a second impedance toward a a side cover vent on the chassis to the ambient environment; and
a third fan outlet is configured to direct a third portion of the airflow toward a plurality of components inside the chassis, wherein the first fan outlet, the first fin stack, the second fan outlet, the second fin stack and the third fan outlet are configured to distribute the first portion of the airflow, the second portion of the airflow and the third portion of the airflow according to a ratio, wherein the second portion of the airflow is less than the first portion of the airflow and the third portion of the airflow.
8. The chassis of claim 7 , wherein the first portion of the airflow has a first flow rate, the second portion of the airflow has a second flow rate and the third portion of the airflow has a third flow rate, wherein the second flow rate is less than the first flow rate and the third flow rate.
9. The chassis of claim 7 , wherein:
the ratio comprises the first portion of the airflow between 30-40% of the airflow and the third portion of the airflow between 30-40% of the airflow, wherein the second portion of the airflow comprises a remaining percentage of the airflow.
10. The chassis of claim 7 , wherein:
the ratio comprises the first portion of the airflow between 35-40% and the third portion of the airflow between 25-45%, wherein the second portion of the airflow comprises a remaining percentage of the airflow.
11. The chassis of claim 7 , wherein at least a portion of the fan housing is curvilinear.
12. The chassis of claim 7 , wherein the fan-body ratio is greater than 85%.
13. An information handling system, comprising:
a chassis comprising a bottom cover, at least two side covers and a top cover;
a plurality of components located in the chassis;
a gasket positioned in the chassis and configured to seal the chassis; and
a thermal module comprising:
at least one fan comprising:
a fan housing for a fan motor and a plurality of fan blades, the fan housing having an intake open to a bottom cover of the chassis for drawing an airflow into the fan and a plurality of fan outlets for directing the airflow out of the fan housing, wherein:
a fan-body ratio defined as a ratio of a first dimension comprising a diameter of the plurality of fan blades relative to a second dimension comprising one of a width of the fan housing or a length of the fan housing is at least 80%;
a first fan outlet is configured to direct a first portion of the airflow through a first fin stack with a first impedance toward a back cover vent on the chassis to an ambient environment;
a second fan outlet is configured to direct a second portion of the airflow through a second fin stack with a second impedance toward a side cover vent on the chassis to the ambient environment; and
a third fan outlet is configured to direct a third portion of the airflow toward a plurality of components inside the chassis wherein the first fan outlet, the first fin stack, the second fan outlet, the second fin stack and the third fan outlet are configured to distribute the first portion of the airflow, the second portion of the airflow and the third portion of the airflow according to a ratio, wherein the second portion of the airflow is less than the first portion of the airflow and the third portion of the airflow.
14. The information handling system of claim 13 , wherein the first portion of the airflow has a first flow rate, the first fin stack, the second portion of the airflow has a second flow rate and the third portion of the airflow has a third flow rate, wherein the second flow rate is less than the first flow rate and the third flow rate.
15. The information handling system of claim 14 , wherein:
the ratio comprises the first portion of the airflow between 30-40% of the airflow and the third portion of the airflow between 30-40% of the airflow, wherein the second portion of the airflow comprises a remaining percentage of the airflow.
16. The information handling system of claim 14 , wherein:
the ratio comprises the first portion of the airflow between 35-40% and the third portion of the airflow between 25-45%, wherein the second portion of the airflow comprises a remaining percentage of the airflow.
17. The information handling system of claim 13 , wherein at least a portion of the fan housing is curvilinear.
18. The information handling system of claim 13 , wherein the fan-body ratio is greater than 85%.
19. The information handling system of claim 13 , wherein a first fan is configured to rotate in a first direction and a second fan is configured to rotate in a second direction opposite the first direction.