Methods for laser processing transparent workpieces using modified pulse burst profiles
A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration T bd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size w o , and a Rayleigh range Z R that is greater than F D π w o 2 λ , where F D is a dimensionless divergence factor comprising a value of 10 or greater.
1. A method for processing a transparent workpiece, the method comprising:
directing a pulsed laser beam into the transparent workpiece, wherein:
the pulsed laser beam comprises pulse bursts having 2 sub-pulses per pulse burst or more;
each pulse burst of the pulsed laser beam comprises a burst duration T bd of 380 ns or greater; and
the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece; and
the pulsed laser beam focal line comprises:
a wavelength λ;
a spot size w o ; and
a Rayleigh range Z R that is greater than
F
D
π
w
o
2
λ
,
where F D is a dimensionless divergence factor comprising a value of 10 or greater; and
translating at least one of the transparent workpiece and the pulsed laser beam relative to each other along an open contour line to form an open contour comprising a plurality of the defects in the transparent workpiece; and
directing an infrared laser beam into the transparent workpiece along the open contour line to induce thermal stress in the transparent workpiece and thereby initiate separation along the open contour line, wherein:
the open contour is linear and comprises a directionally homogenous break resistance that does not vary greater than 25% over any direction along a surface of the transparent workpiece, and
wherein a diameter of each defect of the plurality of defects of the open contour and a spacing between adjacent defects of the open contour are increased with an increase in burst duration T bd .
2. The method of claim 1 , wherein each pulse burst of the pulsed laser beam comprises a sub-pulse period T p of 25 ns or greater.
3. The method of claim 1 , wherein the spacing between adjacent defects of the plurality of the defects is from 10 μm to 30 μm.
4. The method of claim 1 , wherein each pulse burst of the pulsed laser beam comprises from 2 sub-pulses to 5 sub-pulses.
5. The method of claim 1 , wherein each pulse burst of the pulsed laser beam comprises a pulse burst energy of greater than 100 μJ.
6. The method of claim 1 , wherein an energy of each sub-pulse of the pulse burst differs from the energy of other sub-pulses of the pulse burst by 10% or less.
7. The method of claim 1 , wherein the break resistance is 20 MPa or less when measured with either a laser incidence side in tension (LIT) or a laser incidence side in compression (LIC).
8. The method of claim 1 , wherein the pulsed laser beam traverses an aspheric optical element before irradiating the transparent workpiece.
9. The method of claim 1 , wherein the dimensionless divergence factor F D comprises a value from 10 to 2000.
10. The method of claim 1 , wherein a cross section of the pulsed laser beam focal line comprises a non-axisymmetric cross-sectional shape such that the defect comprises a non-axisymmetric cross-sectional shape.
11. The method of claim 1 , wherein the wavelength λ of the pulsed laser beam is less than 600 nm.