Pump sensor system
A device, system, and methods are provided for remotely monitoring pump equipment. A sensor device is provided as a one-piece unit that is mechanically mounted to a pump by a single threaded connection. The sensor device includes a vibration sensor and temperature sensor. The sensor device connects to a user device via a wireless personal area network (WPAN) connection to upload a current snapshot of vibration data and temperature data for the pump equipment. An application on the user device may add location data for the time of the data collection and connects to a provider network to upload the vibration data and temperature data.
1. A sensor device for pump equipment, the sensor device comprising:
an enclosure for an electronics assembly, wherein the enclosure includes a top enclosure portion and a base enclosure portion;
a bolt protruding from the base enclosure portion, the bolt configured to be inserted into a threaded receiving bore of the pump equipment;
a threaded insert, the threaded insert including a threaded bore configured to receive the bolt, the threaded insert extending past an outside surface of the base enclosure portion and preventing the enclosure from contacting the pump equipment when the bolt is inserted into the threaded receiving bore; and
the electronics assembly comprising:
two or more internal sensors, the two or more internal sensors including a vibration sensor and a temperature sensor,
a wireless communications interface for exchanging data with a user device,
an internal battery, and
a processor configured to transmit, to the user device and via the wireless communications interface:
a unique identifier associated with the pump equipment,
a current reading from the vibration sensor, and
a current reading from the temperature sensor,
wherein the top enclosure portion and the base enclosure portion are joined and permanently sealed over the electronics assembly.
2. The sensor device of claim 1 , wherein the sensor device is configured to attach to the pump equipment as a single piece.
3. The sensor device of claim 1 , wherein the enclosure includes a plastic material, and wherein the threaded insert includes a metal material.
4. The sensor device of claim 1 , wherein the threaded insert includes multiple ridges that engage the base enclosure portion to prevent axial movement of the threaded insert relative to the base enclosure portion.
5. The sensor device of claim 1 , further comprising:
potting material within the enclosure that provides mechanical coupling among the enclosure, the bolt, and the electronics assembly.
6. The sensor device of claim 1 , wherein the base enclosure portion further comprises a vent hole and a fill hole that provides access to a cavity of the enclosure when the base enclosure portion and the top enclosure portion are joined together, and wherein the enclosure further comprises:
potting material that fills the cavity.
7. The sensor device of claim 6 , wherein the potting material prevents relative movement among the enclosure, the bolt, and the electronics assembly.
8. The sensor device of claim 1 , wherein the top enclosure portion and the base enclosure portion form a cavity,
wherein the sensor device further includes cured potting material within the cavity to form a potted cavity, and
wherein the potted cavity provides a tamperproof component for the electronics assembly.
9. A system for monitoring pump equipment, the system comprising:
a sensor device including:
an enclosure for an electronics assembly, wherein the enclosure includes a top enclosure portion and a base enclosure portion;
a bolt protruding from the base enclosure portion, the bolt configured to be inserted into a threaded receiving bore of the pump equipment;
a threaded insert, the threaded insert including a threaded bore configured to receive the bolt, the threaded insert extending past an outside surface of the enclosure and preventing the enclosure from contacting the pump equipment when the bolt is inserted into the threaded receiving bore; and
the electronics assembly comprising:
a vibration sensor,
a temperature sensor,
a first wireless communications interface for exchanging data with a user device,
an internal battery, and
a processor configured to transmit, to the user device and via the first wireless communications interface:
a unique identifier associated with the pump equipment,
a current reading from the vibration sensor, and
a current reading from the temperature sensor,
wherein the top enclosure portion and the base enclosure portion are joined and permanently sealed over the electronics assembly.
10. The system of claim 9 , further comprising:
a user device including:
a second wireless communications interface for exchanging data with the sensor device;
a memory to store instructions; and
a processor configured to execute the instructions to:
establish a communication session with the sensor device;
receive, from the sensor device, the unique identifier, the current reading from the vibration sensor, and the current reading from the temperature sensor, and
forward, to a provider network, the unique identifier, the current reading from the vibration sensor, and the current reading from the temperature sensor.
11. The system of claim 10 , wherein the processor of the user device is further configured to:
identify a location of the user device at the time of receiving from the sensor device, the unique identifier, the current reading from the vibration sensor, and the current reading from the temperature sensor, and
forwarding the identified location with the unique identifier, the current reading from the vibration sensor, and the current reading from the temperature sensor.
12. The system of claim 10 , further comprising:
a network configured to:
receive, from the user device, the unique identifier, the current reading from the vibration sensor, and the current reading from the temperature sensor, and
store the unique identifier, the current reading from the vibration sensor, and the current reading from the temperature sensor associated with other data for the pump equipment.
13. The system of claim 9 , wherein the sensor device is configured to attach to the pump equipment as a single piece.
14. The system of claim 9 , wherein the electronics assembly of the sensor device is potted within the enclosure and does not move relative to the bolt.
15. The system of claim 9 , wherein the enclosure includes a plastic material, and wherein the threaded insert and the bolt include a metal material.
16. The system of claim 9 , wherein the first wireless communications interface includes an interface for a wireless personal area network (WPAN).
17. The system of claim 9 , wherein the enclosure for the sensor device includes a hexagonal perimeter having a standard bolt size.
18. The system of claim 9 , further comprising:
the pump equipment, wherein the pump equipment includes the threaded receiving bore in a bearing housing of the pump equipment.