Temperature-controlled shield, material deposition apparatus and method for depositing a material onto a substrate
A temperature-controlled shield for an evaporation source is described. The temperature-controlled shield is configured to provide a pre-heating zone or a post-cooling zone.
1. A material deposition apparatus for depositing an evaporated material onto a substrate, the material deposition apparatus comprising:
an evaporation source comprising a plurality of nozzles including two outermost nozzles, the two outermost nozzles being tilted in different directions from each other; and
one or more temperature-controlled shields arranged at a wide-angle between 110° and 140° with respect to the evaporation source so that the evaporated material is deposited in an area having a width of at least 10% larger than a corresponding width of the evaporation source, each of the one or more temperature-controlled shields being configured to provide a pre-heating zone or a post-cooling zone.
2. The material deposition apparatus for depositing an evaporated material onto a substrate according to claim 1 , wherein the one or more temperature-controlled shields comprise one of a heating device or a cooling device.
3. The material deposition apparatus for depositing an evaporated material onto a substrate according to claim 1 , wherein the one or more temperature-controlled shields are arranged at the evaporation source and extends outward from the evaporation source.
4. The material deposition apparatus for depositing an evaporated material onto a substrate according to claim 1 , wherein the one or more temperature-controlled shields comprise a straight portion and a bent end.
5. The material deposition apparatus for depositing an evaporated material onto a substrate according to claim 4 , wherein the bent end extends away from the evaporation source in a direction towards a substrate support.