Submersible light fixture with multilayer stack for pressure transfer
Lighting apparatus for high pressure underwater use are disclosed. In one embodiment the lighting apparatus comprises a housing for withstanding ambient exterior pressure at a depth of approximately 500 feet or more, a transparent pressure bearing window positioned at a forward end of the housing, and a multilayered stack for bearing substantially all of the loading applied to the transparent pressure bearing window at a depth of approximately 500 feet or more disposed in the housing behind the transparent pressure bearing window is disclosed.
1. A lighting apparatus for high pressure underwater use, comprising:
a non-pressure compensated housing shaped and sized for withstanding ambient exterior pressure at a water depth of approximately 500 feet or more;
a transparent pressure bearing window positioned at a forward end of the non-pressure compensated housing;
a multilayered stack positioned directly behind and in contact with the transparent pressure bearing window, the multilayer stack comprising:
one or more substantially flat spacers of a high compressive strength material;
an electronic circuit element comprising a thermally conductive printed circuit board (PCB) configured and positioned within the housing behind the transparent pressure bearing window; and
a plurality of LEDs mounted on the PCB; and
a water-tight seal between the transparent pressure bearing window and the housing;
wherein the one or more substantially flat spacers have holes for allowing light output from the plurality of LEDs to pass through the spacers and to the transparent pressure bearing window, and wherein the one or more substantially flat spacer bear substantially all of the pressure applied to the transparent pressure bearing window by ambient water on the exterior side of the window.
2. The electronics assembly of claim 1 , wherein the electronic circuit board is a metal core printed circuit board (MCPCB).
3. The electronics assembly of claim 2 , wherein the MCPCB comprises copper.
4. The electronics assembly of claim 2 , wherein the MCPCB comprises aluminum.
5. The electronics assembly of claim 1 , further including thermal sensor electronics including a temperature sensor for measuring temperature and automatically reducing current applied to the plurality of LEDs when a predetermined temperature is reached.
6. The electronics assembly of claim 1 , further comprising one or more reflectors positioned around one or more of the plurality of LEDs.
7. The electronics assembly of claim 6 , further comprising one or more lenses positioned around one or more of the plurality of LEDs.
8. The lighting apparatus of claim 1 , further including thermal sensor electronics including a temperature sensor for measuring temperature and automatically reducing current applied to the solid state light source when a predetermined temperature is reached.
9. The lighting apparatus of claim 1 , further comprising one or more reflectors positioned around one or more of the plurality of LEDs.
10. The lighting apparatus of claim 9 , further comprising one or more lenses positioned around one or more of the plurality of LEDs.
11. The lighting apparatus of claim 1 , further comprising an underwater electrical connector disposed at or near a rearward end of the housing.
12. The lighting apparatus of claim 1 , wherein the multilayer stack further comprises a window retainer assembly positioned to retain the transparent pressure bearing window relative to the housing.
13. The electronics assembly of claim 1 , wherein the LEDs include silicone domes and wherein the silicone domes are trimmed to a width equal to or less than a width of the window support spacer.
14. The electronics assembly of claim 1 , wherein the electronic circuit board is a double sided metal core printed circuit board (MCPCB).
15. The electronics assembly of claim 1 , wherein the multilayer stack further comprises one or more thin layers of Kapton plastic sheets.
16. The apparatus of claim 1 , wherein the LEDs are domed LEDs and no spherical lens element is positioned in front of the LEDs.
17. The apparatus of claim 1 , wherein the housing comprises a thermally conductive metal and a portion of the thermally conductive PCB is in thermal contact with the housing.
18. The apparatus of claim 17 , wherein the PCB comprises an MCPCB.
19. A lighting apparatus for high pressure underwater use, comprising:
a non-pressure compensated housing shaped and sized for withstanding ambient exterior pressure at a water depth of approximately 500 feet or more;
a transparent pressure bearing window positioned at a forward end of the non-pressure compensated housing;
a multilayered stack positioned directly behind and in contact with the transparent pressure bearing window, the multilayer stack comprising:
one or more substantially flat spacers of a high compressive strength material;
an electronic circuit element comprising a thermally conductive printed circuit board (PCB) configured and positioned within the housing behind the transparent pressure bearing window; and
a plurality of LEDs mounted on the PCB; and
a water-tight seal between the transparent pressure bearing window and the housing;
wherein the one or more substantially flat spacers have holes for allowing light output from the plurality of LEDs to pass through the spacers and to the transparent pressure bearing window, and wherein the one or more substantially flat spacer bear substantially all of the pressure applied to the transparent pressure bearing window by ambient water on the exterior side of the window, and wherein the LEDs are domed LEDs and no spherical lens element is positioned in front of the LEDs.