IP Library Granted Patent US 11,675,401
Granted Patent B2
US 11,675,401 · App. 17/335,315 · Granted Jun 13, 2023

Thermal venting in a portable information handling system

Inventors: Patrick A. Hampton (Round Rock, TX); Qinghong He (Austin, TX); Ernesto Ramirez (Austin, TX)
Assignee: Dell Products L.P.
G06F1/206G06F1/203H05K7/2039H05K7/20145G06F1/1616
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Quick Facts
Patent No.
US 11,675,401
App. No.
17/335,315
Granted
Jun 13, 2023
Kind
B2
Abstract

A main housing portion of a portable information handing system. The main housing portion includes: a top cover portion; a bottom cover portion; and, an internal air intake ducting system, the internal air intake ducting system comprising a fan and a thermal channeling component thermally coupled to the fan, the thermal channeling component extending from an interior of a side of the bottom cover portion to the fan, the thermal channeling component and the bottom cover portion defining an air channel between the side of the bottom cover portion and the fan.

Claims (36)

1. A main housing portion of a portable information handing system, comprising:

a top cover portion;

a bottom cover portion; and,

an internal air intake ducting system, the internal air intake ducting system comprising a fan and a thermal channeling component thermally coupled to the fan, the thermal channeling component extending from an interior of a side of the bottom cover portion to the fan, the thermal channeling component and the bottom cover portion defining an air channel between the side of the bottom cover portion and the fan, the thermal channeling component being affixed to an internal surface of the side of the bottom cover portion; and wherein

providing the air channel between the side of the bottom cover portion and the fan provides a thermal venting solution that does not rely on one or both of bottom venting and thermal feet.

2. The main housing portion of claim 1 , wherein:

the thermal channeling component is thermally coupled to the fan via a gasket.

3. The main housing portion of claim 1 , wherein:

the thermal channeling component is thermally coupled to the fan via a fan thermal channeling component mounting portion.

4. The main housing portion of claim 1 , wherein:

the thermal channeling component comprises a step portion, the step portion providing a taller air channel along a portion of the air channel between the side of the bottom cover and the fan.

5. The main housing portion of claim 4 , wherein:

the taller air channel is proximate with the fan.

6. The main housing portion of claim 1 , wherein:

the bottom cover comprises an angled side wall demarcation portion, the angled side wall demarcation portion extending downwardly from a front of the main housing portion to a rear of the main housing portion; and,

an air intake is integrated into the angled side wall demarcation portion, the air intake extending downwardly from the front of the main housing portion to the rear of the main housing portion along the angled side wall demarcation portion.

7. An information handling system comprising:

a processor;

a data bus coupled to the processor; and

an information handling system chassis housing, the housing comprising

a base chassis, the base chassis housing the processor, the base chassis comprising

a top cover portion;

a bottom cover portion; and,

an internal air intake ducting system, the internal air intake ducting system comprising a fan and a thermal channeling component thermally coupled to the fan, the thermal channeling component extending from an interior of a side of the bottom cover portion to the fan, the thermal channeling component and the bottom cover portion defining an air channel between the side of the bottom cover portion and the fan, the thermal channeling component being affixed to an internal surface of the side of the bottom cover portion; and wherein

providing the air channel between the side of the bottom cover portion and the fan provides a thermal venting solution that does not rely on one or both of bottom venting and thermal feet.

8. The information handling system of claim 7 , wherein:

the thermal channeling component is thermally coupled to the fan via a gasket.

9. The information handling system of claim 7 , wherein:

the thermal channeling component is thermally coupled to the fan via a fan thermal channeling component mounting portion.

10. The information handling system of claim 7 , wherein:

the thermal channeling component comprises a step portion, the step portion providing a taller air channel along a portion of the air channel between the side of the bottom cover and the fan.

11. The information handling system of claim 10 , wherein:

the taller air channel is proximate with the fan.

12. The information handling system of claim 7 , wherein:

the bottom cover comprises an angled side wall demarcation portion, the angled side wall demarcation portion extending downwardly from a front of the main housing portion to a rear of the main housing portion; and,

an air intake is integrated into the angled side wall demarcation portion, the air intake extending downwardly from the front of the main housing portion to the rear of the main housing portion along the angled side wall demarcation portion.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (058014/0560) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0473 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057931/0392) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0382 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057758/0286) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 061654/0064 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 058014/0560 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057758/0286 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057931/0392 →
SECURITY AGREEMENT Recorded Oct 1, 2021
From: DELL PRODUCTS, L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 057682/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2021
From: HAMPTON, PATRICK A.; HE, QINGHONG; RAMIREZ, ERNESTO
To: DELL PRODUCTS L.P.
Reel/Frame 056404/0980 →
Continuity (1)
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