Light emitting device
A light-emitting device comprises a substrate; a first semiconductor layer formed on the substrate; a first patterned layer formed on the first semiconductor layer; and a second semiconductor layer formed on the first semiconductor layer, wherein the second semiconductor layer comprises a core layer comprising a group III or transition metal material formed along the first patterned layer.
1. A light-emitting device, comprising:
a substrate;
a first semiconductor layer formed on the substrate, wherein the first semiconductor layer comprises a plurality of first mesas protruding from the first semiconductor layer, and wherein the first semiconductor layer further comprises a first upper surface and a second upper surface, and the first upper surface is formed on the plurality of first mesas;
a first patterned layer formed on the plurality of first mesas of the first semiconductor layer; and
a second semiconductor layer formed on the first semiconductor layer, wherein the second semiconductor layer comprises a core layer comprising a group III element or a transition metal material formed along the first patterned layer.
2. The light-emitting device according to claim 1 , wherein the core layer is a discontinuous layer.
3. The light-emitting device according to claim 1 , wherein the core layer is a continuous layer.
4. The light-emitting device according to claim 3 , wherein the core layer comprises a thickness between 1 Å and 1000 Å.
5. The light-emitting device according to claim 1 , wherein the first semiconductor layer and the second semiconductor layer comprise a first conductivity type dopant.
6. The light-emitting device according to claim 1 , wherein the first semiconductor layer is undoped and the second semiconductor layer comprise a first conductivity type dopant.
7. The light-emitting device according to claim 1 , further comprising an active layer and a third semiconductor layer comprising a second conductivity type dopant formed on the active layer.
8. The light-emitting device according to claim 1 , wherein the first patterned layer comprises an insulating material.
9. The light-emitting device according to claim 8 , wherein the insulating material comprises TiO x , Al x N y , Al x O y , SiO x , or SiN x .
10. The light-emitting device according to claim 1 , wherein the first semiconductor layer and the second semiconductor layer comprise nitrogen.
11. The light-emitting device according to claim 1 , wherein a step difference is formed between the first upper surface and the second upper surface.
12. The light-emitting device according to claim 1 , wherein the first patterned layer is formed on the first upper surface, and the core layer is formed on the first patterned layer, the plurality of first mesas, and the second upper surface.
13. The light-emitting device according to claim 11 wherein the step difference comprises a height less than 500 nm.
14. The light-emitting device according to claim 1 , wherein the first patterned layer comprises a plurality of first convex portions comprising a width between 0.6 μm˜2 μm.
15. The light-emitting device according to claim 14 , wherein the substrate comprises a plurality of convex portions, and the plurality of convex portions and the plurality of first convex portions comprise same shape.
16. The light-emitting device according to claim 1 , wherein the second semiconductor layer comprises an aluminum content equal to that of the first semiconductor layer.
17. The light-emitting device according to claim 1 , wherein the second semiconductor layer comprises an aluminum content greater than that of the first semiconductor layer.
18. The light-emitting device according to claim 1 , wherein the second semiconductor layer comprises an aluminum content less than that of the first semiconductor layer.