Wearable device and methods of manufacturing
A smart ring includes a shell having an internal surface and sidewalls define an interior, a battery within a first sector of the interior, a PCB within a second sector of the interior having components including a fingerprint sensor, a temperature sensor, a memory and a processing unit coupled to the temperature sensor and the fingerprint sensor and configured to determine whether an incoming fingerprint data is authenticated, and a potting compound disposed within the interior and encapsulating the components, wherein the potting compound forms an inner portion of the smart ring characterized by a first curved portion, a first and second flat regions within the second sector and a third region within the second sector between the first and second flat regions, wherein the fingerprint sensor is disposed below the first flat region, and wherein the temperature sensor is associated with the second flat region.
1. A smart ring comprises:
a round shell comprising an external surface, an internal surface, and sidewalls, wherein the external surface defines an outer diameter portion of the smart ring, and wherein the internal surface and the sidewalls bound an interior region that is characterized by a u-shaped cross-section;
a curved power source disposed within the interior region and within a first annulus sector of the smart ring, wherein the curved power source is configured to provide operating power;
a circuit board coupled to the curved power source and disposed within the interior region and within a second annulus sector of the smart ring;
a plurality of electronic components disposed upon the circuit board, wherein the plurality of electronic components comprises:
a temperature sensor configured to provide a plurality of output signals in response to a heat source coupled to the temperature sensor;
a fingerprint sensor configured to provide incoming fingerprint data in response to a fingerprint provided to the fingerprint sensor;
a memory configured to store authorized fingerprint data; and
a processing unit coupled to the temperature sensor and the fingerprint sensor, wherein the processing unit is configured to determine whether the incoming fingerprint data is authenticated in response to the authorized fingerprint data; and
a potting compound disposed within the interior region and encapsulating the curved power source, the circuit board and the plurality of electronic components, wherein the potting compound forms an inner portion of the smart ring, wherein the interior portion of the smart ring is characterized by a first curved portion, a first flat region within a first portion of the second annulus sector, a second flat region within a second portion of the second annulus sector, and a third portion of the second annulus sector disposed between the first flat region and the second flat region;
wherein the fingerprint sensor is disposed below the first flat region; and
wherein the temperature sensor is associated with the second flat region.
2. The smart ring of claim 1
wherein the fingerprint sensor comprises an ultrasonic sensor; and
wherein the fingerprint sensor is covered by the potting compound within the first flat region.
3. The smart ring of claim 1
wherein the fingerprint sensor is selected from a group consisting of: an imaging sensor and an infrared sensor; and
wherein the fingerprint sensor is exposed through the potting compound within the first flat region.
4. The smart ring of claim 1 further comprising:
one or more contacts coupled to the temperature sensor, wherein the one or more contacts are configured to thermally conduct heat to the temperature sensor; and
wherein the plurality of contacts are exposed through the potting compound within the second flat region.
5. The smart ring of claim 1
wherein the temperature sensor is selected from a group consisting of: an infrared device, and a near infrared device;
wherein a transparent material is disposed above the temperature sensor; and
wherein the transparent material is exposed through the potting compound within the second flat region.
6. The smart ring of claim 1 further comprising
an electromagnetic coil disposed below the first flat region, wherein the electromagnetic coil is configured to receive communications from an external electromagnetic source, and wherein the electromagnetic coil is covered by the potting compound within the first flat region.
7. The smart ring of claim 1 wherein the shell comprises a material selected from a group consisting of: plastic, ceramic, metal, silicone, titanium, non-conductive material, and carbon fiber.
8. The smart ring of claim 1 wherein the potting compound is selected from a group consisting of: epoxy, silicone, and rubber; and wherein the potting compound is over molded over the circuit board and the plurality of electronic components.
9. The smart ring of claim 1
wherein the memory is configured to store a digitally signed token;
wherein the plurality of electronic components further includes a first transceiver configured to output the digitally signed token.
10. The smart ring of claim 9 wherein the first transceiver comprises a Bluetooth low energy (BLE) transceiver.
11. A method for fabricating a smart ring comprises:
receiving a round shell comprising an external surface, an internal surface, and sidewalls, wherein the external surface defines an outer diameter portion of the smart ring, and wherein the internal surface and the sidewalls bound an interior region that is characterized by a u-shaped cross-section;
receiving a curved power source configured to provide operating power;
receiving a circuit board having a plurality of electronic components comprising:
a fingerprint sensor configured to provide incoming fingerprint data in response to a fingerprint provided to the fingerprint sensor;
a temperature sensor coupled to the curved power supply, wherein the temperature sensor is configured to determine a temperature associated with a user;
a memory configured to store authorized fingerprint data; and
a processing unit coupled to the temperature sensor and the fingerprint sensor, wherein the processing unit is configured to determine whether the incoming fingerprint data is authenticated in response to the authorized fingerprint data;
coupling the curved power source to the circuit board;
disposing the curved power source within the interior region within a first annulus sector of the smart ring and the circuit board within a second annulus sector of the smart ring;
disposing the round shell within a mold; and
disposing a potting compound into the mold to thereby encapsulate the curved power source and the circuit board, wherein the potting compound forms an inner portion of the smart ring, wherein the interior portion of the smart ring is characterized by a first curved portion, a first flat region within a first portion of the second annulus sector, a second flat region within a second portion of the second annulus sector, and a third portion of the second annulus sector disposed between the first flat region and the second flat region;
wherein the fingerprint sensor is disposed below the first flat region; and
wherein the temperature sensor is associated with the second flat region.
12. The method of claim 11
wherein the fingerprint sensor comprises an ultrasonic sensor; and
wherein the potting compound is disposed above the ultrasonic sensor within the first flat region.
13. The method of claim 11
wherein the fingerprint sensor is selected from a group consisting of: an imaging sensor and an infrared sensor; and
wherein the potting compound exposes the fingerprint sensor within the first flat region.
14. The method of claim 11 further comprising:
coupling a thermal contact to the temperature sensor, wherein the thermal contact is configured to thermally convey heat to the temperature sensor; and
wherein the potting compound exposes the thermal contact within the second flat region.
15. The smart ring of claim 11
wherein the temperature sensor is selected from a group consisting of: an infrared device, and a near infrared device; and
wherein the method further comprises disposing a transparent material above the temperature sensor; and
wherein the transparent material is exposed through the potting compound within the second flat region.
16. The method of claim 11 further comprising molding the round shell with a material selected from a group consisting of: plastic, ceramic, metal, silicone, titanium, non-conductive material, and carbon fiber.
17. The method of claim 11 wherein the potting compound is selected from a group consisting of: epoxy, silicone, and rubber; and wherein the disposing the potting compound comprises over molding the circuit board and the plurality of electronic components.
18. The method of claim 11
wherein the coupling the curved power source to the circuit board comprises coupling a first end of the curved power source to a first end of the circuit board; and
wherein the disposing the curved power source and the circuit board within the interior region comprises:
overlapping a second end of the curved power source to a second end of the circuit board into an O-shaped configuration;
disposing the curved power source and the circuit board in the O-shaped configuration into the interior region; and
unoverlapping the second end of the curved power source from the second end of the circuit board into an C-shaped configuration.
19. The method of claim 18 further comprising:
securing a registration frame within the interior region; and
coupling at least a portion of the circuit board or the curved power source to the registration frame within the interior region.
20. The method ring of claim 19 wherein the registration frame comprises a magnetic material.