Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board
This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
1. An apparatus, the apparatus comprising:
an air waveguide antenna configured to guide electromagnetic energy through channels filled with air, the air waveguide comprising:
an electrical interface to a circuit board, the electrical interface configures a portion of a surface of the circuit board to act as a floor for the channels filled with air; and
a single layer of material having conductive surfaces and positioned atop the electrical interface to define walls and a ceiling for the channels filled with air, wherein the electrical interface to the circuit board comprises at least one of:
a reflowed low-temperature solder that attaches the conductive surfaces of the single layer with the portion of the surface of the circuit board;
a non-conductive adhesive that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board;
a low-pressure sinter that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board; or
a hot bar solder that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board.
2. The apparatus of claim 1 , wherein the ceiling for the channels filled with air comprises one or more slots configured to radiate the electromagnetic energy.
3. The apparatus of claim 1 , wherein the electrical interface to the circuit board further comprises a conductive adhesive that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board.
4. The apparatus of claim 1 , wherein the single layer of material comprises metal.
5. The apparatus of claim 1 , wherein the electrical interface to the circuit board further comprises a pressure-sensitive adhesive that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board.
6. The apparatus of claim 1 , wherein the electrical interface to the circuit board further comprises a mechanical interface that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board.
7. The apparatus of claim 6 , wherein the mechanical interface to the circuit board comprises a pattern of teeth of the conductive surfaces that mate to a corresponding pattern of teeth in the portion of the surface of the circuit board.
8. The apparatus of claim 1 , wherein the single layer of material comprises a non-conductive core and an outer conductive surface.
9. The apparatus of claim 8 , wherein the non-conductive core comprises plastic and the outer conductive surface comprises metal.
10. The apparatus of claim 1 , wherein the floor for the channels filled with air is parallel to the ceiling for the channels filled with air.
11. The apparatus of claim 1 , wherein the walls for the channels filled with air are orthogonal to the floor for the channels filled with air.
12. The apparatus of claim 1 , wherein the single layer of material is positioned atop the electrical interface to further define a rectangular opening through a portion of one of the walls to the channels filled with air.
13. A method, the method comprising:
identifying a portion of a surface of a circuit board to act as an electrical interface to waveguide channels filled with air;
obtaining a single layer of material with conductive surfaces that define walls and a ceiling of the waveguide channels filled with air;
positioning the single layer of material atop the portion of the surface of the circuit board; and
attaching the single layer of material to the portion of the surface of the circuit board to form an air waveguide antenna that is configured to guide electromagnetic energy through the waveguide channels filled with air by forming, between the single layer of material and the circuit board, a mechanical interface that further provides an electrical connection between the single layer of material and a common potential of the circuit board, wherein forming the mechanical interface comprises one or more of:
reflow soldering the electrical interface to the circuit board using a low-temperature solder;
applying an adhesive to the single layer of material or the circuit board for attaching the electrical interface to the circuit board;
securing the single layer of material to the circuit board with a mechanical fastener for attaching the electrical interface to the circuit board;
performing a low-pressure sintering of the electrical interface to the circuit board; or
performing a hot bar soldering of the electrical interface to the circuit board.
14. A system, the system comprising:
a circuit board comprising a surface for mounting electrical components;
an air waveguide antenna configured to guide electromagnetic energy through channels filled with air;
an electrical interface between the air waveguide antenna and the circuit board including a portion of the surface configured as a floor for the channels filled with air,
the air waveguide antenna comprising a single layer of material having a non-conductive core and an outer conductive surface positioned above the electrical interface with the circuit board to define walls and a ceiling of the channels filled with air.
15. The system of claim 14 , wherein the non-conductive core comprises plastic and the outer conductive surface comprises metal.
16. The system of claim 14 , wherein the electrical interface to the circuit board comprises at least one of:
a reflowed low-temperature solder that attaches the conductive surfaces of the single layer with the portion of the surface of the circuit board;
a non-conductive adhesive that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board;
a low-pressure sinter that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board;
a hot bar solder that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board;
a conductive adhesive that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board;
a pressure-sensitive adhesive that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board; or
a mechanical interface that affixes the conductive surfaces of the single layer to the portion of the surface of the circuit board.
17. The system of claim 16 , wherein the mechanical interface to the circuit board comprises a pattern of teeth of the conductive surfaces that mate to a corresponding pattern of teeth in the portion of the surface of the circuit board.
18. The system of claim 14 , wherein the system comprises a radar system including the air waveguide antenna and the circuit board.
19. The system of claim 18 , wherein the radar system is configured to emit or detect the electromagnetic energy with an antenna including the air waveguide antenna.
20. The system of claim 18 , wherein the radar system comprises a processor configured to determine an object relative to the radar system in response to receiving the electromagnetic energy.