Systems and methods for varying an impedance of a cable
A system may include a circuit board comprising a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein the plurality of electrically-conductive layers comprises a ground plane and the layers of insulating material comprise a surface layer having one or more openings through which the ground plane is exposed through the one or more openings. The system may also include a plurality of electrically-conductive pads formed on a surface of the surface layer and a cable comprising a first signal conductor mechanically contacted to a first pad of the plurality of electrically-conductive pads and a first drain conductor mechanically contacted to the ground plane through the one or more openings.
1. A system, comprising:
a circuit board comprising:
a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein:
the plurality of electrically-conductive layers comprises a ground plane; and
the layers of insulating material comprise a surface layer having one or more openings through which the ground plane is exposed through the one or more openings; and
a plurality of electrically-conductive pads formed on a surface of the surface layer; and
a cable comprising:
a first signal conductor directly mechanically contacted to a first pad of the plurality of electrically-conductive pads; and
a first drain conductor directly mechanically contacted to the ground plane through the one or more openings.
2. The system of claim 1 , wherein:
the first signal conductor is adhesively contacted to the first pad; and
the first drain conductor is adhesively contacted to the ground plane.
3. The system of claim 1 , wherein the cable further comprises:
a second signal conductor mechanically contacted to a second pad of the plurality of electrically-conductive pads; and
a second drain conductor mechanically contacted to the ground plane through the one or more openings.
4. A method, comprising:
directly mechanically contacting a first signal conductor of a cable to a first pad of a plurality of electrically-conductive pads formed on a surface of a surface layer of a circuit board comprising a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein the plurality of electrically-conductive layers comprises a ground plane and the layers of insulating material comprise a surface layer; and
directly mechanically contacting a first drain conductor of the cable to the ground plane through one or more openings formed in the surface layer through which the ground plane is exposed through the one or more openings.
5. The method of claim 4 , wherein:
mechanically contacting the first signal conductor to the first pad comprises adhesively contacting the first signal conductor to the first pad; and
mechanically contacting the first drain conductor to the ground plane comprises adhesively contacting the first drain conductor to the ground plane.
6. The method of claim 5 , wherein mechanically contacting the first signal conductor to the first pad and mechanically contacting the first drain conductor to the ground plane comprises:
applying heat to adhesive material disposed on the first pad and the ground plane; and
applying mechanical pressure between the first signal conductor to the first pad and between the first drain conductor to the ground plane.
7. The method of claim 4 , further comprising:
mechanically contacting a second signal conductor of the cable to a second pad of the plurality of electrically-conductive pads; and
mechanically contacting a second drain conductor of the cable to the ground plane through the one or more openings.