IP Library Granted Patent US 12,243,966
Granted Patent B2
US 12,243,966 · App. 17/354,922 · Granted Mar 4, 2025

Light-emitting device

Inventors: Heng-Ying Cho (Hsinchu, TW); Li-Yu Shen (Hsinchu, TW); Chih-Hao Chen (Hsinchu, TW); Keng-Lin Chuang (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/44H01L33/10
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Quick Facts
Patent No.
US 12,243,966
App. No.
17/354,922
Granted
Mar 4, 2025
Kind
B2
Abstract

A light-emitting device comprises a semiconductor stack emitting a light with a peak wavelength λ; and a light field adjustment layer formed on the semiconductor stack, wherein the light field adjustment layer comprises a plurality of first layers and a plurality of second layers alternately stacked on top of each other, the plurality of first layers each comprises a first optical thickness, and the plurality of second layers each comprises a second optical thickness.

Claims (23)

1. A light-emitting device, comprising:

a semiconductor stack emitting a light with a peak wavelength; and

a light field adjustment layer formed on the semiconductor stack, wherein the light field adjustment layer comprises a plurality of first layers and a plurality of second layers alternately stacked on top of each other, the plurality of first layers each comprises a first optical thickness, and the plurality of second layers each comprises a second optical thickness,

wherein the first optical thickness and the second optical thickness meet any one of the following:

the first optical thickness is less than 0.25 A, and the second optical thickness is larger than or approximately equal to 0.25 A,

the first optical thickness is equal to 0.25 A, and the second optical thickness is less than or larger than 0.25 A, or

the first optical thickness is larger than 0.25 A, and the second optical thickness is less than or approximately equal to 0.25 A,

wherein the light field adjustment layer comprises a first film region and a second film region, and a first optical thickness difference between any two of the plurality of first layers located in the first film region is larger than the first optical thickness difference between any two of the plurality of first layers located in the second film region,

wherein the first film region is closer to the semiconductor stack than the second film region to the semiconductor stack.

2. The light-emitting device according to claim 1 , wherein the first optical thickness of the plurality of first layers is decreased first and then is increased.

3. The light-emitting device according to claim 2 , wherein the second optical thickness of the plurality of second layers is decreased first and then is increased.

4. The light-emitting device according to claim 2 , wherein the second optical thickness of the plurality of second layers is increased first and then is decreased.

5. The light-emitting device according to claim 1 , wherein the first optical thickness of the plurality of first layers is increased first and then is decreased.

6. The light-emitting device according to claim 5 , wherein the second optical thickness of the plurality of second layers is decreased first and then is increased.

7. The light-emitting device according to claim 5 , wherein the second optical thickness of the plurality of second layers is increased first and then is decreased.

8. The light-emitting device according to claim 1 , wherein the plurality of first layers comprises TiO x , HfO 2 , ZnO, La 2 O 3 , CeO 2 , ZrO 2 , ZnSe, Si 3 N 4 , Nb 2 O 5 , or Ta 2 O 5 , and the plurality of second layers comprises SiO 2 , LaF 3 , MgF 2 , NaF, NasAlF 6 , CaF 2 , or AlF 3 .

9. The light-emitting device according to claim 1 , wherein the light-emitting device comprises a bat-wing light field distribution.

10. The light-emitting device according to claim 1 , wherein an optical thickness difference between two adjacent first layer and second layer is larger than 0.025λ.

11. The light-emitting device according to claim 1 , further comprising a substrate and a protective layer covering the semiconductor stack, wherein the semiconductor stack is located on the substrate, the light field adjustment layer is located on the substrate, and the protective layer comprises a Distributed Bragg Reflector (DBR) structure.

12. The light-emitting device according to claim 11 , wherein the Distributed Bragg Reflector (DBR) structure is formed by alternately stacking a third layer and the fourth layer, and an optical thickness difference between the third layer and the fourth layer is less than 0.05λ.

13. The light-emitting device according to claim 12 , wherein the optical thickness difference between the third layer and the fourth layer is less than 0.025λ.

14. The light-emitting device according to claim 1 , wherein a sum of the first optical thickness of the plurality of first layers and the second optical thickness of the plurality of second layers is between 1.5 μm˜2 μm.

15. The light-emitting device according to claim 1 , wherein the second optical thickness of the plurality of second layers and the first optical thickness of the plurality of first layers comprise a ratio larger than 2.5.

Assignments (2)
CHANGE OF NAME Recorded Feb 18, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075171/0402 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2021
From: CHO, HENG-YING; SHEN, LI-YU; CHEN, CHIH-HAO; CHUANG, KENG-LIN
To: EPISTAR CORPORATION
Reel/Frame 056639/0989 →