IP Library Granted Patent US 11,415,283
Granted Patent B2
US 11,415,283 · App. 17/356,182 · Granted Aug 16, 2022

Retrofit LED lamp for a vehicle light

Inventors: Marcus Jozef Henricus Kessels (Echt, NL); Wilbert Heffels (Middelburg, NL)
Assignee: Lumileds LLC
F21S41/148F21S45/47F21V23/007F21V23/06
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Quick Facts
Patent No.
US 11,415,283
App. No.
17/356,182
Granted
Aug 16, 2022
Kind
B2
Abstract

An LED lamp ( 1 ) for a vehicle light, the LED lamp ( 1 ) comprising a retrofit body ( 112 ) defining a longitudinal direction and being integrally configured as a heat sink, a conductive structure ( 13 ) being arranged in a cavity of the retrofit body ( 12 ) and at least one LED module ( 11 ) being electrically connected to the conductive structure ( 13 ), the at least one LED module ( 11 ) comprising a substrate ( 111 ) and a diode semiconductor ( 112 ) applied onto the substrate ( 111 ); a retrofit body ( 12 ), a conductive structure ( 13 ), and a method for manufacturing an LED lamp ( 1 ) for a vehicle.

Claims (27)

1. An LED lamp ( 1 ) for a vehicle light, the LED lamp ( 1 ) comprising:

a retrofit body ( 12 ) defining a longitudinal direction ( 127 ) and configured to dissipate heat, the retrofit body comprising a cavity including a central bore ( 123 ) and a duct ( 124 ) narrower than and extending from the central bore ( 123 ) to a lateral opening ( 122 );

a conductive structure ( 13 ) comprising a driver circuit ( 133 ) arranged in the central bore ( 123 ) of the retrofit body ( 12 ) and a finger-like portion ( 131 ) narrower than and extending from the driver circuit ( 133 ), the finger-like portion ( 131 ) arranged in the duct ( 124 ) of the retrofit body ( 12 );

at least one LED module ( 11 ) being electrically connected to the conductive structure ( 13 ) and configured to be driven by the driver circuit ( 133 ), the at least one LED module ( 11 ) comprising a substrate ( 111 ) and a diode semiconductor ( 112 ) disposed on the substrate ( 111 ), the substrate ( 111 ) being attached to the retrofit body ( 12 ) with a joining material ( 15 ) between the substrate ( 111 ) and the retrofit body ( 12 ).

2. The LED lamp ( 1 ) as claimed in claim 1 , wherein the retrofit body ( 12 ) comprises a support portion ( 121 ) being laterally adjacent to the lateral opening ( 122 ) of the retrofit body ( 12 ), the support portion ( 121 ) supporting the at least one LED module ( 11 ).

3. The LED lamp ( 1 ) as claimed in claim 2 , wherein the finger-like portion ( 131 ) of the conductive structure ( 13 ) is arranged laterally adjacent to the support portion ( 121 ).

4. The LED lamp ( 1 ) as claimed in claim 2 , wherein the finger-like portion ( 131 ) comprises two electrical contacts ( 132 ) for contacting the at least one LED module ( 11 ) with the electrical contacts ( 132 ), the finger-like portion ( 131 ) being accessible through the lateral opening ( 122 ).

5. The LED lamp ( 1 ) as claimed in claim 4 , comprising a pair of conductive elements ( 14 ) electrically connecting the at least one LED module ( 11 ) to the electrical contacts ( 132 ) of the conductive structure ( 13 ).

6. The LED lamp ( 1 ) as claimed in claim 4 , wherein the central bore ( 123 ) extends longitudinal from an end face of the retrofit body ( 12 ), the lateral opening ( 122 ) and the duct ( 124 ) extending longitudinal from a bottom portion of the central bore ( 123 ) to the lateral opening ( 122 ).

7. The LED lamp ( 1 ) as claimed in claim 2 , wherein an edge region of the retrofit body ( 12 ) surrounding the lateral opening ( 122 ) widens in a light emission direction of the at least one LED module ( 11 ).

8. The LED lamp ( 1 ) as claimed in claim 2 , comprising two LED modules ( 11 ) being attached to opposite sides of the support portion ( 121 ).

9. The LED lamp ( 1 ) as claimed in claim 1 , wherein the central bore ( 123 ) extends longitudinal from an end face of the retrofit body ( 12 ), and the duct ( 124 ) extends longitudinal from a bottom portion of the central bore ( 123 ) to the lateral opening ( 122 ).

10. The LED lamp ( 1 ) as claimed in claim 1 , wherein the duct ( 124 ) is arranged eccentrically with respect to the central bore ( 123 ).

11. The LED lamp ( 1 ) as claimed in claim 1 , wherein the conductive structure ( 13 ) is arranged spaced apart from the substrate ( 111 ) of the LED module ( 11 ).

12. The LED lamp ( 1 ) as claimed in claim 1 , wherein the conductive structure comprises a printed circuit board or a lead frame.

13. The LED lamp ( 1 ) as claimed in claim 12 , wherein the printed circuit board or lead frame is arranged in the central bore ( 123 ).

14. The LED lamp ( 1 ) as claimed in claim 1 , further comprising a luminescent layer ( 113 ) disposed on the diode semiconductor ( 112 ).

15. The LED lamp ( 1 ) as claimed in claim 1 , further comprising a plurality of fins ( 125 ) at least partially surrounding the central bore ( 123 ).

16. A method for manufacturing an LED lamp ( 1 ) for a vehicle, the method comprising:

providing at least one LED module ( 11 ), the LED module ( 11 ) comprising a substrate ( 111 ) and a diode semiconductor ( 112 ) applied onto the substrate ( 111 );

providing a retrofit body ( 12 ) configured as a heat sink for the at least one LED module ( 11 ), the retrofit body ( 12 ) comprising a central bore ( 123 ) extending longitudinal from an end face of the retrofit body ( 12 ), a lateral opening ( 122 ), and a duct ( 124 ) extending longitudinal from a bottom portion of the central bore ( 123 ) to the lateral opening ( 122 );

attaching the substrate ( 111 ) of the at least one LED module ( 11 ) to the retrofit body ( 12 ) adjacent to the lateral opening ( 122 ) with at most a joining material ( 15 ) being arranged between the substrate ( 111 ) and the retrofit body ( 12 );

providing a conductive structure ( 13 ) configured to be inserted into and fixed within the central bore ( 123 ) of the retrofit body ( 12 ), the conductive structure ( 13 ) comprising a driver circuit ( 133 ) configured to drive the at least one LED module ( 11 ) and comprising a finger-like portion ( 131 ) fitting in the duct ( 124 ) of the retrofit body ( 12 ), the finger-like portion ( 131 ) narrower than and extending from the driver circuit ( 133 ), the finger-like portion ( 131 ) comprising two electrical contacts ( 132 ) for contacting the at least one LED module ( 11 ) with the electrical contacts ( 132 ), and, in an inserted state of the conductive structure ( 13 ), being accessible through the lateral opening ( 122 );

inserting the driver circuit ( 133 ) of the conductive structure ( 13 ) into the central bore ( 123 ) and the finger-like portion ( 131 ) of the conductive structure ( 13 ) into the duct ( 124 ) of the retrofit body ( 12 );

electrically connecting the at least one LED module ( 11 ) with the electrical contacts ( 132 ) of the conductive structure ( 13 ) via a pair of conductive elements ( 14 ).

17. The method as claimed in claim 16 , wherein electrically connecting the at least one LED module ( 11 ) comprises an ultrasonic welding of the conductive elements ( 14 ) both to the at least one LED module ( 11 ) and to the electrical contacts ( 132 ) of the conductive structure ( 13 ).

18. The method as claimed in claim 16 or 17 , wherein two LED modules ( 11 ) are attached to the support portion ( 121 ) of the retrofit body ( 12 ) on opposite sides of the support portion ( 121 ).

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2021
From: KESSELS, MARCUS JOZEF HENRICUS; HEFFELS, WILBERT
To: LUMILEDS LLC
Reel/Frame 056662/0320 →