Chip apparatus and electronic device
A chip apparatus and an electronic device, where the chip apparatus includes a housing and a chip assembly fastened to one side of inside of the housing. The chip apparatus further includes a heat sink disposed on an opposite side of the inside of the housing, and the heat sink is thermally connected to the chip assembly.
1 . A chip apparatus comprising:
a housing comprising an interior comprising a first side and a second side opposite to the first side;
a chip assembly fastened to the first side; and
a heat sink slidably coupled inside the interior of the housing to the second side and thermally coupled to the chip assembly, wherein the heat sink comprises:
a heat dissipation substrate thermally coupled to the chip assembly; and
a heat dissipation structure disposed on the heat dissipation substrate, wherein the heat dissipation substrate comprises through holes, and wherein the heat sink is connected to the housing by a set of limit screws penetrating the through holes.
2 . The chip apparatus of claim 1 , wherein the heat sink is slidable in a direction away from the chip assembly.
3 . The chip apparatus of claim 2 , further comprising a guiding assembly disposed in the housing, wherein the heat sink is slidably coupled to the housing using the guiding assembly.
4 . The chip apparatus of claim 3 , wherein the guiding assembly comprises:
a guiding post fixedly disposed in the housing, wherein the heat sink is slidably coupled to the guiding post; and
an elastic member sleeved on the guiding post, wherein the elastic member comprises:
a first end configured to press against the housing; and
a second end configured to press against the heat sink.
5 . The chip apparatus of claim 3 , wherein the guiding assembly comprises:
a sliding slot disposed in the housing, wherein the heat sink is slidably coupled to the sliding slot; and
an elastic member disposed in the sliding slot, wherein the elastic member comprises:
a first end configured to press against the housing; and
a second end configured to press against the heat sink.
6 . The chip apparatus of claim 4 , wherein the elastic member is a compression spring or a rubber ring.
7 . The chip apparatus of claim 5 , wherein the elastic member is a compression spring or a rubber ring.
8 . The chip apparatus of claim 4 ,
wherein the heat dissipation substrate is slidably coupled to the guiding post.
9 . The chip apparatus of claim 5 , wherein the
heat dissipation substrate is slidably coupled to the sliding slot.
10 . The chip apparatus of claim 8 , further comprising a chip thermally coupled to the heat dissipation substrate, wherein the chip assembly comprises a board fixed on the first side, and wherein the chip is disposed on the board.
11 . The chip apparatus of claim 1 , further comprising a thermally conductive material between the heat sink and the chip assembly.
12 . An electronic device comprising:
a chip apparatus comprising:
a housing comprising an interior comprising a first side and a second side opposite to the first side;
a chip assembly fastened to the first side; and
a heat sink slidably coupled inside the interior of the housing to the second side and thermally coupled to the chip assembly, wherein the heat sink comprises:
a heat dissipation substrate thermally coupled to the chip assembly; and
a heat dissipation structure disposed on the heat dissipation substrate, wherein the heat dissipation substrate comprises through holes, and wherein the heat sink is connected to the housing by a set of limit screws penetrating the through holes.
13 . The electronic device of claim 12 , wherein the heat sink is slidable in a direction away from the chip assembly.
14 . The electronic device of claim 13 , further comprising a guiding assembly disposed in the housing, wherein the heat sink is slidably coupled to the housing using the guiding assembly.
15 . The electronic device of claim 14 , wherein the guiding assembly comprises:
a guiding post fixedly disposed in the housing, wherein the heat sink is slidably coupled to the guiding post; and
an elastic member sleeved on the guiding post, wherein the elastic member comprises:
a first end configured to press against the housing; and
a second end configured to press against the heat sink.
16 . The electronic device of claim 14 , wherein the guiding assembly comprises:
a sliding slot disposed in the housing, wherein the heat sink is slidably coupled to the sliding slot; and
an elastic member disposed in the sliding slot, wherein the elastic member comprises:
a first end configured to press against the housing; and
a second end configured to press against the heat sink.
17 . The electronic device of claim 15 , wherein the elastic member is a compression spring or a rubber ring.
18 . The electronic device of claim 15 , wherein the heat dissipation substrate is slidably coupled to either the guiding post or a sliding slot of the guiding assembly.
19 . The electronic device of claim 18 , further comprising a chip thermally coupled to the heat dissipation substrate, wherein the chip assembly comprises a board fixed on the first side, and wherein the chip is disposed on the board.
20 . The electronic device of claim 12 , further comprising a thermally conductive material between the heat sink and the chip assembly.