IP Library Patent Application 17362519
Patent Application
App. No. 17/362,519

METHOD FOR CUTTING SEPARATION MEMBRANE FOR BATTERY, AND SEPARATION MEMBRANE FOR BATTERY MANUFACTURED THEREBY

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Quick Facts
Patent No.
US None
App. No.
17/362,519
Abstract

The present invention relates to a method for cutting a separation membrane for a battery, in which the separation membrane is cut by laser radiation on the separation membrane, wherein the pulse repetition rate of the laser is 10 to 500 kHz; a separation membrane manufactured by the method; and a battery comprising the separation membrane. The present invention, in contrast with physical cutting, has the advantage of being capable of cutting a separation membrane for a battery so as to have a uniform cut surface, which was impossible by conventional physical cutting methods.

Claims (13)

1 . A method for cutting separation membranes for a battery, in which ten or more separation membranes are cut by laser radiation on the separation membranes,

wherein a pulse repetition rate of the laser is 10 to 40 kHz.

2 . The method of claim 1 , wherein a cutting speed of the laser is 700 to 1,000 mm/s.

3 . The method of claim 2 , wherein a cutting speed of the laser is 800 to 1,000 mm/s.

4 . The method of claim 1 , wherein the laser is a pulse laser or a CO 2 laser.

5 . The method of claim 1 , wherein an output capacity of the laser is 20 to 500 W.

6 . The method of claim 5 , wherein the output capacity of the laser is 50 to 200 W.

7 . The method of claim 6 , wherein the output capacity of the laser is 50 to 100 W.

8 . The method of claim 1 , wherein a wavelength of the laser is 300 to 1,200 nm.

9 . The method of claim 1 , wherein a pulse width of the laser is 5 to 500 ns.

10 . The method of claim 4 , wherein a spot size of the CO 2 laser is 50 to 200 um.

11 . The method of claim 1 , wherein the separation membrane is an irregular shaped separation membrane.

12 . A separation membrane cutting device using the cutting method of claim 1 , wherein the separation membrane cutting device uses a biaxial beam scanner and an F-theta lens, which are capable of transmitting 2-D light for light transfer.