IP Library Granted Patent US 12,200,984
Granted Patent B2
US 12,200,984 · App. 17/363,563 · Granted Jan 14, 2025

Display panel, display device and manufacturing method for display panel

Inventors: Jingru Lu (Kunshan, CN); Xiangqian Wang (Kunshan, CN)
Assignee: KunShan Go Visionox Opto Electronics Co., Ltd
H10K59/131H10K50/8426H10K71/00H10K77/111
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Quick Facts
Patent No.
US 12,200,984
App. No.
17/363,563
Granted
Jan 14, 2025
Kind
B2
Abstract

A display panel including a display area and a non-display area located on peripheral side of the display area, wherein the display panel includes: an array substrate comprising a first substrate and a second substrate that are laminated, wherein the second substrate is a flexible substrate, the second substrate comprises a first extension portion and a second extension portion, the first extension portion is located at the display area, the second extension portion extends from the first extension portion along a direction away from the first extension portion to the outside of the first substrate via the non-display area, and the second extension portion is disposed with a connection circuit for being electrically connected with an external device; a package cover plate located on one side of the second substrate away from the first substrate to encapsulate the array substrate.

Claims (23)

1. A display panel comprising a display area and a non-display area located on peripheral side of the display area, wherein the display panel comprises:

an array substrate comprising:

a first substrate and

a second substrate that are laminated, wherein the second substrate is a flexible substrate the first substrate comprises a first surface facing the second substrate, a second surface away from the second substrate, and a side surface connecting the first surface and the second surface, and the second substrate comprises:

a first extension portion that is transparent, wherein a transparency of the first extension portion is greater than or equal to 60%, and

a second extension portion, the second extension portion extends from the first extension portion along a direction away from the first extension portion to the outside of the first substrate via the non-display area, is disposed with a connection circuit for being electrically connected with an external device, and the connection circuit is exposed to the surface of the second extension portion facing the first substrate; and

a package cover plate located on one side of the second substrate away from the first substrate that is configured to encapsulate the array substrate, wherein a drive device layer and a pixel layer of the display panel are disposed correspondingly to the display area, the drive device layer is located on one side of the pixel layer away from the second substrate, and a connection pin of the drive device layer is exposed by the side surface to be connected with the connection circuit.

2. The display panel of claim 1 , wherein a connection end of the connection circuit is exposed to the surface of the second extension portion close to the first substrate and the connection pin of the drive device extends from the display area to the non-display area and is exposed to the first surface in the non-display area to be connected with the connection circuit.

3. The display panel of claim 1 , wherein the wire is disposed at the surface of the wire layer toward the first substrate.

4. The display panel of claim 1 , wherein the wire is located within the wire layer, the wire is exposed by the surface of the wire layer towards the first substrate, and the connection pin and the wire are connected with each other.

5. The display panel of claim 1 , wherein the second extension portion further comprises:

a connecting section connected with the first extension portion.

6. The display panel of claim 1 , wherein the control circuit is disposed on one side of the free end away from the first substrate.

7. The display panel of claim 1 , wherein the control circuit is located on one side of the free end close to the first substrate.

8. A display device comprising the display panel according to claim 1 .

9. A method of manufacturing a display panel comprising a display area and a non-display area disposed on peripheral side of the display area, wherein the method comprises:

providing a first substrate;

forming a second substrate on the first substrate, wherein the second substrate is a flexible substrate, the first substrate comprises a first surface facing the second substrate, a second surface away from the second substrate, and a side surface connecting the first surface and the second surface, and the second substrate comprises:

a first extension portion that is transparent, wherein a transparency of the first extension portion is greater than or equal to 60%, and

a second extension portion, and the second extension portion is provided with a connection circuit and the connection circuit is exposed to the surface of the second extension portion facing the first substrate;

peeling off at least part of the first substrate and the second substrate from an edge of the first substrate;

cutting off the stripped portion of the first substrate so that the second extension portion extends from the first extension portion along a direction away from the first extension portion to the outside of the first substrate via the non-display area; and

providing a package cover plate on one side of the second substrate away from the first substrate to encapsulate the second substrate and the first substrate, wherein a drive device layer and a pixel layer of the display panel are disposed correspondingly to the display area, the drive device layer is located on one side of the pixel layer away from the second substrate, and a connection pin of the drive device layer is exposed by the side surface to be connected with the connection circuit.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2025
From: KUNSHAN GO VISIONOX OPTO ELECTRONICS CO., LTD
To: SUZHOU GOVISIONOX INNOVATION TECHNOLOGY CO., LTD.
Reel/Frame 073320/0655 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 24, 2025
From: KUNSHAN GO VISIONOX OPTO ELECTRONICS CO., LTD
To: SUZHOU GOVISIONOX INNOVATION TECHNOLOGY CO., LTD.
Reel/Frame 073309/0183 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2025
From: KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
To: SUZHOU GOVISIONOX INNOVATION TECHNOLOGY CO., LTD.
Reel/Frame 073852/0233 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2021
From: LU, JINGRU; WANG, XIANGQIAN
To: KUNSHAN GO VISIONOX OPTO ELECTRONICS CO., LTD
Reel/Frame 057269/0030 →
Priority Claims (1)
CN 201910548295.9 · Jun 24, 2019 · national
Continuity (2)
Continuation PCTCN2020075545 · Feb 17, 2020
Related Publication 20210384285A1 · Dec 9, 2021
References Cited (34)
US 9276055B1 · Son et al. · 2016 [cited by applicant]
US 20150036300A1 · Park et al. · 2015 [cited by applicant]
US 20150362812A1 · Aoki et al. · 2015 [cited by applicant]
US 20160064466A1 · Son · 2016 [cited by examiner]
US 20170179423A1 · Kwon · 2017 [cited by examiner]
US 20180108722A1 · Nishikawa · 2018 [cited by examiner]
US 20180158893A1 · Tokuda · 2018 [cited by examiner]
US 20180159055A1 · Namkung et al. · 2018 [cited by applicant]
US 20180197933A1 · Son et al. · 2018 [cited by applicant]
US 20190058028A1 · Won · 2019 [cited by applicant]
US 20190165049A1 · Kim · 2019 [cited by examiner]
CN 106910429A · 2017 [cited by applicant]
CN 107357068A · 2017 [cited by applicant]
CN 108681123A · 2018 [cited by applicant]
CN 108803103A · 2018 [cited by applicant]
CN 208384313U · 2019 [cited by applicant]
CN 109648979A · 2019 [cited by applicant]
CN 109686251A · 2019 [cited by applicant]
CN 110246882A · 2019 [cited by applicant]
EP 3182474A1 · 2017 [cited by applicant]
JP 2018063386A · 2018 [cited by applicant]
JP 2018092018A · 2018 [cited by applicant]
JP 2018156116A · 2018 [cited by applicant]
KR 1020170047269A · 2017 [cited by applicant]
TW 201913332A · 2019 [cited by applicant]
WO 2019074332A1 · 2019 [cited by applicant]
Office Action issued on Jul. 18, 2023, in corresponding Korean Application No. 10-2021-7023281, 12 pages. [cited by applicant]
Search Report issued on Jul. 19, 2022 in connection with corresponding European Application No. 20832646.2; 8 pages. [cited by applicant]
Office Action issued on Jan. 4, 2023, in corresponding Japanese Application No. 2021-549078, 10 pages. [cited by applicant]
PCT International Search Report for PCT/CN2020/075545, dated Apr. 21, 2020, 12 pages. [cited by applicant]
The first office action and search report dated Dec. 24, 2020 for Chinese Application No. 201910548295.9, 8 pages. [cited by applicant]
The first office action and search report dated Jan. 21, 2021 for TW Application No. 109105359, 5 pages. [cited by applicant]
The First Office Action issued on Sep. 13, 2022, in connection with corresponding Japanese Application No. 2021-549078 (24 pp., including machine-generated English translation). [cited by applicant]
Office Action issued on Nov. 24, 2023, in corresponding European Application No. 20832646.2, 7 pages. [cited by applicant]