Integrated circuit and method for capturing baseline die temperature data

1. A method for capturing integrated circuit (IC) die temperature data, the method comprising:

responsive to an application of power to the IC, self-initializing the IC by:

asserting a reset signal for a reset period;

in response to an expiration of the reset period, deasserting the reset signal; and

responsive to deasserting the reset signal, automatically:

obtaining first temperature data from at least one thermal sensing device associated with a die of the IC; and

storing the first temperature data in a storage component of the IC.

2. The method of claim 1 , wherein self-initializing the IC further includes:

responsive to deasserting the reset signal, conducting a built in self test (BIST).

3. The method of claim 2 , wherein conducting the BIST includes:

conducting the BIST after the storing.

4. The method of claim 1 , wherein storing the first temperature data in the storage component of the IC includes:

storing the first temperature data obtained from the at least one thermal sensing device in a respective register in the IC.

5. The method of claim 1 , wherein obtaining the first temperature data from the at least one thermal sensing device associated with the die of the IC includes:

digitally sampling an electrical characteristic of the at least one thermal sensing device.

6. The method of claim 5 , wherein the at least one thermal sensing device includes a plurality of thermal sensing devices, wherein digitally sampling includes:

using an analog-to-digital converter (ADC), digitally sampling the electrical characteristic of each of the plurality of thermal sensing devices according to a sampling period.

7. The method of claim 1 , further comprising:

receiving, from a requesting device, a temperature read request;

responsive to receiving the temperature read request, obtaining second temperature data from the at least one thermal sensing device; and

providing the second temperature data to the requesting device.

8. The method of claim 7 , wherein obtaining the second temperature data from the at least one thermal sensing device includes:

digitally sampling an electrical characteristic of the at least one thermal sensing device.

9. The method of claim 1 , further comprising:

receiving, from a requesting device, a baseline temperature retrieval request;

responsive to receiving the baseline temperature retrieval request, retrieving the first temperature data from the storage component of the IC; and

providing the first temperature data retrieved from the storage component of the IC to the requesting device.

10. The method of claim 1 , wherein the at least one thermal sensing device includes a thermal sense diode.

11. An integrated circuit (IC) comprising:

at least one thermal sensing device; and

self-initializing logic configured to, responsive to an application of power to the IC:

assert a reset signal for a reset period and, after expiry of the reset period, deassert the reset signal; and

responsive to the reset signal being deasserted, automatically obtain first temperature data from the at least one thermal sensing device and store the first temperature data in a storage component of the IC.

12. The IC of claim 11 , wherein the self-initializing logic is further configured to, responsive to the reset signal being deasserted:

conduct a built in self test (BIST).

13. The IC of claim 12 , wherein the self-initializing logic is configured to conduct the BIST after the first temperature data is stored.

14. The IC of claim 11 , wherein the self-initializing logic is configured to store the first temperature data from the at least one thermal sensing device in a respective register in the IC.

15. The IC of claim 11 , wherein the self-initializing logic is configured to digitally sample an electrical characteristic of the at least one thermal sensing device.

16. The IC of claim 15 , wherein the at least one thermal sensing device includes a plurality of thermal sensing devices, wherein the self-initializing logic is configured to, using an analog-to-digital converter (ADC), digitally sample the electrical characteristic of each of the plurality of thermal sensing devices according to a sampling period.

17. The IC of claim 11 , further comprising:

temperature read logic configured to:

receive, from a requesting device, a temperature read request;

responsive to the temperature read request, obtain second temperature data from the at least one thermal sensing device; and

provide the second temperature data to the requesting device.

18. The IC of claim 17 , wherein the temperature read logic is configured to digitally sample an electrical characteristic of the at least one thermal sensing device.

19. The IC of claim 11 , further comprising:

baseline temperature retrieval logic configured to:

receive, from a requesting device, a baseline temperature retrieval request;

responsive to the baseline temperature retrieval request, retrieve the first temperature data from the storage component of the IC; and

provide the first temperature data retrieved from the storage component of the IC to the requesting device.

20. The IC of claim 11 , wherein the at least one thermal sensing device includes a thermal sense diode.