IP Library Granted Patent US 12,149,092
Granted Patent B2
US 12,149,092 · App. 17/372,755 · Granted Nov 19, 2024

Information handling system housing integrated wireless charging coil in housing bottom side

Inventors: Duck-Soo Choi (Georgetown, TX); Peng Lip Goh (Singapore, SG); Deeder M. Aurongzeb (Austin, TX)
Assignee: Dell Products L.P.
H02J50/005G06F1/1613G06F1/203H02J7/02H02J50/10
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Quick Facts
Patent No.
US 12,149,092
App. No.
17/372,755
Granted
Nov 19, 2024
Kind
B2
Abstract

A portable information handling system glass ceramic housing integrates plural wireless charging coils on one side and plural coil interface traces on an opposing side that interface with conductive material disposed in through glass via openings. Conductive contacts interfaced with the coil interface traces and exposed at the glass ceramic housing interior couple to a printed circuit board assembly through pogo pins that bias against the conductive contacts to communicate power from the wireless charging coils to the charger of the information handling system. The conductive contacts co-locate with a logo etched into the glass ceramic housing to provide an aesthetically pleasing wireless charging solution.

Claims (58)

1. An information handling system comprising:

a housing having an interior and an exterior, the housing comprising a glass ceramic material;

a processor disposed in the housing and operable to execute instructions to process information;

a memory disposed in the housing and interfaced with the processor, the memory operable to store the instructions and information;

an embedded controller disposed in the housing and interfaced with the processor, the embedded controller operable to manage power applied to the processor and memory;

a charger disposed in the housing and interfaced with embedded controller, the charger operable to accept power from an external power source;

a coil integrated in the housing and configured to accept a wireless charging signal from a wireless charging source disposed external and proximate the coil, the coil having plural exposed conductive contacts; and

a printed circuit board assembly interfaced with the charger and having plural pogo pins, the printed circuit board assembly coupling to the housing interior to align the plural pogo pins and the plural conductive contacts.

2. The information handling system of claim 1 further comprising:

a plastic case sized to couple to the housing interior and having plural openings aligned with the exposed conductive contacts;

wherein the printed circuit board assembly engages the plastic case to insert the pogo pins through the plural openings and against the plural conductive contacts.

3. The information handling system of claim 2 further comprising:

plural coils is disposed at the housing interior surface;

plural coil interface traces disposed at the housing exterior surface; and

plural through glass via conductors interfacing the plural coils and the plural coil interface traces.

4. The information handling system of claim 3 further comprising plural through glass via conductors interfacing the plural coil interface traces and the plural conductive contacts.

5. The information handling system of claim 4 wherein the housing includes an etched logo and the plural conductive contacts are located at the etched logo.

6. The information handling system of claim 3 wherein the plastic case integrates plural cooling channels providing air gaps between the housing interior surface and the plastic case.

7. The information handling system of claim 6 wherein the housing includes plural through glass via aligned to communicate air between the plural cooling channels and the housing exterior.

8. The information handling system of claim 7 wherein the plastic case integrates slits to communicate air between the plural cooling channels and the housing interior.

9. The information handling system of claim 3 wherein:

the plural coils are formed in a first dielectric coupled to the housing interior surface with an optically clear adhesive; and

the plural coil interface traces are formed in a second dielectric coupled to the housing exterior surface with an optically clear adhesive.

10. A method for wireless communication of power to an information handling system, the method comprising:

integrating a coil with a glass housing of the information handling system;

interfacing plural conductive contacts with the coil, the conductive contacts exposed at an interior side of the glass housing;

coupling a printed circuit board assembly to the housing interior side to align pogo pins of the printed circuit board assembly with the conductive contacts; and

wirelessly transferring power to the coil, through the conductive contacts and pogo pins to a charger.

11. The method of claim 10 further comprising:

integrating a logo on the glass housing exterior side; and

aligning the conductive contacts with the logo.

12. The method of claim 11 further comprising:

integrating the coil at the glass housing interior side;

integrating coil interface traces at the glass housing exterior side; and

interfacing the coil and coil interface traces with conductive material disposed in through glass via openings.

13. The method of claim 12 further comprising:

coupling a case to the glass housing interior side;

coupling the printed circuit board assembly to the case; and

interfacing the pogo pins with the conductive contacts through openings formed in the case.

14. The method of claim 13 wherein:

the coil comprises plural separate coils; and

the coil interface traces interface each of the plural separate coils to the printed circuit board assembly.

15. The method of claim 10 further comprising:

forming through glass via openings in the glass housing; and

cooling the coil by passing air from the glass housing interior to the exterior through the through glass via openings.

16. The method of claim 15 further comprising:

coupling a case to the glass housing interior, the case defining a cooling channel proximate the glass housing; and

passing the air through the cooling channel and out the through glass via opening.

17. A glass housing comprising:

planar glass ceramic having an interior side and an exterior side;

a case coupled to the interior side;

plural wireless charging coils integrated in one side of the planar glass ceramic;

plural coil interface traces integrated in an opposite side of the planar glass ceramic from the plural wireless charging coils;

conductive material disposed in through glass via openings to interface the plural wireless charging coils and plural coil interface traces; and

conductive contacts exposed at the planar glass ceramic interior side and interfaced with the plural coil interface traces.

18. The glass housing of claim 17 wherein the plural wireless charging coils integrate at the interior side and the plural coil interface traces integrate at the exterior side.

19. The glass housing of claim 17 wherein the plural wireless charging coils integrate at the exterior side and the plural coil interface traces integrate at the interior side.

20. The glass housing of claim 17 wherein the case defines a cooling channel along the glass housing interior and the glass housing includes plural through glass via openings interfacing the cooling channel with the housing exterior.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (058014/0560) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0473 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057931/0392) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0382 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057758/0286) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 061654/0064 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 058014/0560 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057758/0286 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057931/0392 →
SECURITY AGREEMENT Recorded Oct 1, 2021
From: DELL PRODUCTS, L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 057682/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2021
From: CHOI, DUCK-SOO; GOH, PENG LIP; AURONGZEB, DEEDER M.
To: DELL PRODUCTS L.P.
Reel/Frame 056822/0008 →
Continuity (1)
Related Publication 20230012464A1 · Jan 12, 2023