In-vehicle computing apparatus in intelligent vehicle and intelligent vehicle

1. An in-vehicle computing apparatus in an intelligent vehicle and comprising:

two mainboards that are stacked, wherein each of the two mainboards comprises a plurality of components that are configured to perform driving status control on the intelligent vehicle;

a radiator disposed between the two mainboards and coupled to each of the two mainboards in a thermally conductive manner, wherein the radiator is a liquid-cooling radiator comprising:

a housing comprising two opposite surfaces and a side wall coupled between the two opposite surfaces, wherein the two opposite surfaces are respectively coupled to the two mainboards;

a heat dissipation pipe disposed inside the housing, wherein the heat dissipation pipe includes a heat dissipation fin coupled to the side wall of the housing, wherein the heat dissipation fin comprises:

a plurality of first heat dissipation fins disposed in the housing to separate the housing into a plurality of areas, wherein each of the plurality of first heat dissipation fins comprises a first length, wherein one end of each of the plurality of first heat dissipation fins is configured to press against an inner wall of the housing, wherein two adjacent first heat dissipation fins are configured to press against two different inner walls of the housing, wherein the two different inner walls are parallel walls of the housing; and

a plurality of second heat dissipation fins disposed at intervals in each of the areas, wherein each of the plurality of second heat dissipation fins comprises a second length, wherein the first length is greater than the second length, and wherein each of the plurality of second heat dissipation fins does not press against the inner wall of the housing;

a water inlet pipe disposed on the side wall of the housing and coupled to the heat dissipation pipe; and

a water outlet pipe disposed on the housing and coupled to the heat dissipation pipe; and

two sealing plates, wherein each of the two sealing plates is disposed on a side that is of each mainboard and that faces away from the radiator.

2. The in-vehicle computing apparatus of claim 1 , wherein the liquid-cooling radiator is configured to receive control from a cooling system of the intelligent vehicle.

3. The in-vehicle computing apparatus of claim 2 , wherein the cooling system is configured to pump a liquid medium into the heat dissipation pipe, and wherein the liquid medium is configured to dissipate heat of the two mainboards through the heat dissipation pipe.

4. The in-vehicle computing apparatus of claim 3 , wherein the cooling system is configured to pump a first volume of the liquid medium into the heat dissipation pipe at a single time, wherein the heat dissipation pipe is formed with the plurality of first heat dissipation fins, wherein a second volume of the liquid medium is disposed between any two adjacent first heat dissipation fins, and wherein the first volume is greater than or equal to the second volume.

5. The in-vehicle computing apparatus of claim 1 , wherein the plurality of first heat dissipation fins are arranged at intervals inside the housing to form an S-shaped heat dissipation pipe among the plurality of first heat dissipation fins.

6. The in-vehicle computing apparatus of claim 5 , wherein the plurality of second heat dissipation fins are disposed between any two adjacent first heat dissipation fins of the plurality of first heat dissipation fins.

7. The in-vehicle computing apparatus of claim 1 , wherein each of the two mainboards comprises a first surface facing the radiator, wherein the in-vehicle computing apparatus further comprises a first functional component disposed on the first surface, and wherein the first functional component is coupled to the radiator in a thermally conductive manner.

8. The in-vehicle computing apparatus of claim 1 , wherein each of the two mainboards comprises the side, wherein the in-vehicle computing apparatus comprises a second functional component disposed on the side, wherein each of the two sealing plates is a heat dissipation plate, and wherein each second functional component of each of the two mainboards is coupled to the heat dissipation plate in a thermally conductive manner.

9. An intelligent vehicle comprising:

an intelligent vehicle body; and

an in-vehicle computing apparatus comprising:

two mainboards that are stacked, wherein each of the two mainboards comprises a plurality of components that are configured to perform driving status control on the intelligent vehicle;

a radiator disposed between the two mainboards and coupled to each of the two mainboards in a thermally conductive manner, wherein the radiator is a liquid-cooling radiator comprising:

a housing comprising two opposite surfaces and a side wall coupled between the two opposite surfaces, wherein the two opposite surfaces are respectively coupled to the two mainboards;

a heat dissipation pipe disposed inside the housing, wherein the heat dissipation pipe includes a heat dissipation fin coupled to the side wall of the housing, wherein the heat dissipation fin comprises:

a plurality of first heat dissipation fins disposed in the housing to separate the housing into a plurality of areas, wherein each of the plurality of first heat dissipation fins comprises a first length, wherein one end of each of the plurality of first heat dissipation fins is configured to press against an inner wall of the housing, wherein two adjacent first heat dissipation fins are configured to press against two different inner walls of the housing, wherein the two different inner walls are parallel walls of the housing; and

a plurality of second heat dissipation fins disposed at intervals in each of the areas, wherein each of the plurality of second heat dissipation fins comprises a second length, wherein the first length is greater than the second length, and wherein each of the plurality of second heat dissipation fins does not press against the inner wall of the housing;

a water inlet pipe disposed on the side wall of the housing and coupled to the heat dissipation pipe; and

a water outlet pipe disposed on the housing and coupled to the heat dissipation pipe; and

two sealing plates, wherein each of the two sealing plates is disposed on a side that is of each mainboard and that faces away from the radiator.

10. The intelligent vehicle of claim 9 , further comprising a cooling system configured to control the liquid-cooling radiator.

11. The intelligent vehicle of claim 10 , wherein the cooling system is configured to pump a liquid medium into the heat dissipation pipe, and wherein the liquid medium is configured to dissipate heat of the two mainboards through the heat dissipation pipe.

12. The intelligent vehicle of claim 11 , wherein the cooling system is configured to pump a first volume of the liquid medium into the heat dissipation pipe at a single time, wherein the heat dissipation pipe is formed with the plurality of first heat dissipation fins, wherein a second volume of the liquid medium is disposed between any two adjacent first heat dissipation fins, and wherein the first volume is greater than or equal to the second volume.

13. The intelligent vehicle of claim 9 , wherein the plurality of first heat dissipation fins are arranged at intervals inside the housing to form an S-shaped heat dissipation pipe among the plurality of first heat dissipation fins.

14. The intelligent vehicle of claim 13 , wherein the plurality of second heat dissipation fins are disposed between any two adjacent first heat dissipation fins of the plurality of first heat dissipation fins.

15. The intelligent vehicle of claim 9 , wherein each of the two mainboards comprises a first surface facing the radiator, wherein the in-vehicle computing apparatus further comprises a first functional component disposed on the first surface, and wherein the first functional component is coupled to the radiator in a thermally conductive manner.

16. The intelligent vehicle of claim 9 , wherein each of the two mainboards comprises the side, wherein a second functional component is disposed on the side, wherein each of the two sealing plates is a heat dissipation plate, and wherein each second functional component of each of the two mainboards is coupled to the heat dissipation plate in a thermally conductive manner.

17. An in-vehicle computing apparatus in an intelligent vehicle comprising:

two mainboards comprising:

a first mainboard comprising a first plurality of components configured to perform driving status control on the intelligent vehicle; and

a second mainboard comprising a second plurality of components configured to perform the driving status control on the intelligent vehicle, wherein the first mainboard and the second mainboard are stacked;

a radiator disposed between the first mainboard and the second mainboard and coupled to each of the first mainboard and the second mainboard in a thermally conductive manner, wherein the radiator is a liquid-cooling radiator comprising:

a housing comprising:

a first surface coupled to the first mainboard;

a second surface opposite to the first surface and coupled to the second mainboard; and

a side wall coupled between the first surface and the second surface;

a heat dissipation pipe disposed inside the housing, wherein the heat dissipation pipe includes a heat dissipation fin coupled to the side wall of the housing, wherein the heat dissipation fin comprises:

a plurality of first heat dissipation fins disposed in the housing to separate the housing into a plurality of areas, wherein each of the plurality of first heat dissipation fins comprises a first length, wherein one end of each of the plurality of first heat dissipation fins is configured to press against an inner wall of the housing, wherein two adjacent first heat dissipation fins are configured to press against two different inner walls of the housing, wherein the two different inner walls are parallel walls of the housing; and

a plurality of second heat dissipation fins disposed at intervals in each of the areas, wherein each of the plurality of second heat dissipation fins comprises a second length, wherein the first length is greater than the second length, and wherein each of the plurality of second heat dissipation fins does not press against the inner wall of the housing;

a water inlet pipe disposed on the side wall of the housing and coupled to the heat dissipation pipe; and

a water outlet pipe disposed on the housing and coupled to the heat dissipation pipe; and

two sealing plates comprising:

a first sealing plate disposed on a first side of the first mainboard that faces away from the radiator; and

a second sealing plate disposed on a second side of the second mainboard that faces away from the radiator.

18. The in-vehicle computing apparatus of claim 17 , further comprising a cooling system configured to control the liquid-cooling radiator, wherein the cooling system is configured to pump a liquid medium into the heat dissipation pipe, and wherein the liquid medium is configured to dissipate heat of the two mainboards through the heat dissipation pipe.

19. The in-vehicle computing apparatus of claim 18 , wherein the cooling system is configured to pump a first volume of the liquid medium into the heat dissipation pipe at a single time, wherein the heat dissipation pipe is formed with the plurality of first heat dissipation fins, wherein a second volume of the liquid medium is disposed between any two adjacent first heat dissipation fins, and wherein the first volume is greater than or equal to the second volume.

20. The in-vehicle computing apparatus of claim 17 , wherein the plurality of first heat dissipation fins are arranged at intervals inside the housing to form an S-shaped heat dissipation pipe among the plurality of first heat dissipation fins, and wherein the plurality of second heat dissipation fins are disposed between any two adjacent first heat dissipation fins of the plurality of first heat dissipation fins.