System and method for cooling a computing device
A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.
1. A cooling system for use with a liquid to cool a computing device, the cooling system comprising:
a first internal heat exchanger positioned within an enclosure of the computing device, the first internal heat exchanger configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion of the liquid;
a first fan operable to recirculate the air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow heated air over the first internal heat exchanger to dissipate the heat;
a water block comprising a cold plate positionable in thermal communication with a component of the plurality of components via a thermal interface material, the water block configured to receive a second portion of the liquid, flow the second portion over the cold plate, and discharge the second portion of the liquid to dissipate heat from the component of the computing device, wherein the liquid is divided into portions of the liquid comprising the first portion of the liquid and the second portion of the liquid prior to the first portion of the liquid flowing through the first internal heat exchanger and prior to the second portion of the liquid flowing through the water block; and
an external heat exchanger positionable external to the computing device, wherein:
the water block further comprises a pump operable to circulate at least the second portion of the liquid through the water block and the external heat exchanger, and
the second portion of the liquid is recombined with the first portion of the liquid after the first portion of the liquid is discharged from the first internal heat exchanger, after the second portion of the liquid is discharged from the water block, and prior to flowing through the external heat exchanger.
2. The cooling system of claim 1 , wherein the component is an integrated circuit.
3. The cooling system of claim 1 , further comprising:
a second internal heat exchanger positioned within the enclosure of the computing device, the second internal heat exchanger configured to receive a third portion of the liquid, flow the third portion of the liquid through the second internal heat exchanger to dissipate heat from the air flowing over the second internal heat exchanger, and discharge the third portion of the liquid.
4. The cooling system of claim 3 , further comprising:
a second fan operable to recirculate the air within a power supply unit (“PSU”) of the computing device to absorb heat from components of the PSU and flow the heated air over the second internal heat exchanger to dissipate the heat.
5. The cooling system of claim 3 , further comprising:
a second fan operable to recirculate the air through the enclosure to absorb heat produced by the plurality of components of the computing device and flow the heated air over the second internal heat exchanger to dissipate the heat.
6. The cooling system of claim 3 , further comprising:
a second fan and a third fan, the second fan and third fan both operable to recirculate the air through the enclosure to absorb heat produced by a PSU of the computing device and the plurality of components of the computing device and flow the heated air over the second internal heat exchanger to dissipate the heat.
7. A computing device to be cooled via a liquid, the computing device comprising:
non-persistent storage;
persistent storage; and
a cooling system comprising:
a first internal heat exchanger positioned within an enclosure of the computing device, the first internal heat exchanger configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion of the liquid;
a first fan that recirculates the air through the enclosure to absorb heat produced by the non-persistent storage and the persistent storage and flow heated air over the first internal heat exchanger to dissipate the heat; and
a water block comprising a cold plate positionable in thermal communication with a component of the computing device via a thermal interface material, the water block configured to receive a second portion of the liquid, flow the second portion over the cold plate, and discharge the second portion of the liquid to dissipate heat from the component of the computing device, wherein the liquid is divided into portions of the liquid comprising the first portion of the liquid and the second portion of the liquid prior to the first portion of the liquid flowing through the first internal heat exchanger and prior to the second portion of the liquid flowing through the water block; and
an external heat exchanger positionable external to the computing device, wherein:
the water block further comprises a pump operable to circulate at least the second portion of the liquid through the water block and the external heat exchanger, and
the second portion of the liquid is recombined with the first portion of the liquid after the first portion of the liquid is discharged from the first internal heat exchanger, after the second portion of the liquid is discharged from the water block, and prior to flowing through the external heat exchanger.
8. The computing device of claim 7 , further comprising:
an integrated circuit, wherein the component comprises the integrated circuit.
9. The computing device of claim 7 , further comprising:
an integrated circuit, wherein heat produced by the integrated circuit is dissipated via the air recirculated by the first fan.
10. The computing device of claim 7 , wherein the cooling system further comprises:
a second internal heat exchanger positioned within an enclosure of the computing device, the second internal heat exchanger configured to receive a third portion of the liquid, flow the third portion of the liquid through the second internal heat exchanger to dissipate heat from the air flowing over the second internal heat exchanger, and discharge the third portion of the liquid.
11. The computing device of claim 10 , further comprising:
a PSU; and
wherein the cooling system further comprises:
a second fan that recirculates the air within the PSU to absorb heat from components of the PSU and flow the heated air over the second internal heat exchanger to dissipate the heat.
12. The computing device of claim 10 , wherein the cooling system further comprises:
a second fan that recirculates the air through the enclosure to absorb heat produced by the non-persistent storage and the persistent storage and flow the heated air over the second internal heat exchanger to dissipate the heat.
13. The computing device of claim 10 , further comprising:
a PSU; and
wherein the cooling system further comprises:
a second fan and a third fan that both recirculate the air through the enclosure to absorb heat produced by the PSU, the non-persistent storage, and the persistent storage and flow the heated air over the second internal heat exchanger to dissipate the heat.
14. The computing device of claim 7 , wherein the computing device is mountable in a rack.
15. A method of cooling a computing device, the method comprising:
flowing a first portion of a liquid through a first internal heat exchanger positioned within the computing device to absorb heat from the first internal heat exchanger;
recirculating air within the computing device via a first fan to absorb heat from components of the computing device and dissipate the heat via the first internal heat exchanger;
flowing a second portion of the liquid through a water block comprising a cold plate positionable in thermal communication with a component of the computing device via a thermal interface material, the water block configured to receive the second portion of the liquid, flow the second portion over the cold plate, and discharge the second portion of the liquid to dissipate heat from the component of the computing device, wherein the liquid is divided into portions of the liquid comprising the first portion of the liquid and the second portion of the liquid prior to the first portion of the liquid flowing through the first internal heat exchanger and prior to the second portion of the liquid flowing through the water block; and
flowing the second portion of the liquid through an external heat exchanger positionable external to the computing device wherein the second portion of the liquid is recombined with the first portion of the liquid after the first portion of the liquid is discharged from the first internal heat exchanger, after the second portion of the liquid is discharged from the water block, and prior to flowing through the external heat exchanger.
16. The method of claim 15 , further comprising:
flowing a third portion of the liquid through a second internal heat exchanger positioned within the computing device and the external heat exchanger to absorb heat from the second internal heat exchanger and dissipate the heat via the external heat exchanger; and
recirculating the air within a PSU of the computing device via a second fan to absorb heat from components of the PSU and dissipate the heat via the second internal heat exchanger.
17. The method of claim 15 , wherein the component comprises an integrated circuit.